公开(公告)号：US09322839B2

公开(公告)日：2016-04-26

申请号：US13854782

申请日：2013-04-01

Applicant: STMicroelectronics S.r.l.

Inventor： Giulio Ricotti ,  Alberto Pagani ,  Fulvio Vittorio Fontana ,  Ubaldo Mastromatteo

IPC: G01P15/11 ,  G01P15/105 ,  G01P15/08 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

Abstract translation: 惯性传感器，其具有带有激励线圈的主体和沿着第一轴线延伸的第一感测线圈。 悬挂质量体包括磁场集中器，位于对应于激励线圈的位置，并且构造成用于沿沿着第一轴线的平面中的惯性移位。 供电和感测电路电耦合到激励线圈和第一感测线圈，并且被配置为产生在励磁线圈中流动的时间流的电流，以便产生与磁场相互作用的磁场 感应线圈中的电压/电流。 集成电路被配置为测量在第一感测线圈中感应的电压/电流的值，以便检测与悬挂质量沿着第一轴的位移相关联的量。

公开(公告)号：US20160103035A1

公开(公告)日：2016-04-14

申请号：US14511346

申请日：2014-10-10

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01L25/00

CPC classification number: G01L25/00 ,  G01L1/16 ,  G01L1/2206 ,  G01L1/26

Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

Abstract translation: 压力传感器用于在结构内定位。 压力传感器可以包括具有响应于弯曲的压力传感器电路的压力传感器集成电路（IC）和耦合到压力传感器电路的收发器电路。 压力传感器可以包括其中具有凹部的支撑体，其联接到压力传感器IC，使得当压力传感器IC受到外部压力时，压力传感器IC弯曲到凹部中。

公开(公告)号：US20150301106A1

公开(公告)日：2015-10-22

申请号：US14754906

申请日：2015-06-30

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  C12Q1/00 ,  C12Q2304/00 ,  C12Q2326/00 ,  G01R1/06794 ,  G01R31/2884 ,  H01L21/00 ,  H01L22/34 ,  H01L2221/00 ,  H01L2924/00

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Abstract translation: 提供感测结构用于测试衬底上的集成电路。 感测结构包括对应于用于连接到集成电路的导电区域的探针区域。 第一感测区域至少部分地围绕探针区域。 多个感测元件串联连接，使得多个感测元件中的第一个具有分别连接到第一感测区域和探针区域的两个端子。 并且多个感测元件中的第二个具有分别连接到探针区域和第一参考电位的两个端子。

公开(公告)号：US20140001521A1

公开(公告)日：2014-01-02

申请号：US13933898

申请日：2013-07-02

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L27/14 ,  H01L31/02 ,  H01L31/0216

CPC classification number: H01L31/105 ,  H01L27/14 ,  H01L27/14643 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/02327 ,  H01L31/035281

Abstract: An optoelectronic device for detecting electromagnetic radiation and including: a body of semiconductor material delimited by a main surface and including a first region and a second region that form a junction; and a recess formed in the body, which extends from the main surface and is delimited at least by a first wall, the first wall being arranged transverse to the main surface. The junction faces the first wall.

Abstract translation: 一种用于检测电磁辐射的光电子器件，包括：由主表面限定并包括形成结的第一区域和第二区域的半导体材料体; 以及形成在主体中的凹部，其从主表面延伸并且至少由第一壁限定，第一壁横向于主表面设置。 接头面向第一个墙壁。

公开(公告)号：US20140001493A1

公开(公告)日：2014-01-02

申请号：US13933858

申请日：2013-07-02

Applicant: STMicroelectronics S.r.l

Inventor： Alberto Pagani ,  Alessandro Motta ,  Sara Loi

IPC: H01L31/0232 ,  H01L31/12

CPC classification number: H01L31/02327 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/43 ,  H01L31/103 ,  H01L31/125

Abstract: An integrated electronic device, delimited by a first surface and by a second surface and including: a body made of semiconductor material, formed inside which is at least one optoelectronic component chosen between a detector and an emitter; and an optical path which is at least in part of a guided type and extends between the first surface and the second surface, the optical path traversing the body. The optoelectronic component is optically coupled, through the optical path, to a first portion of free space and a second portion of free space, which are arranged, respectively, above and underneath the first and second surfaces.

Abstract translation: 一种集成的电子器件，由第一表面和第二表面限定，并包括：由半导体材料制成的主体，其内部是在检测器和发射极之间选择的至少一个光电元件; 以及光路，其至少部分地被引导并且在所述第一表面和所述第二表面之间延伸，所述光路穿过所述主体。 光电子部件通过光路被光耦合到自由空间的第一部分和自由空间的第二部分，其分别布置在第一和第二表面的上方和下方。

公开(公告)号：US20130109111A1

公开(公告)日：2013-05-02

申请号：US13722684

申请日：2012-12-20

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L21/66

CPC classification number: H01L22/14 ,  G01R31/2818 ,  G01R31/2884 ,  H01L22/32 ,  H01L23/481 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method performs electrical testing and assembly of an electronic device on a wafer and comprising a pad made in an oxide layer covered by a passivation layer. The method includes connecting the electronic device to a testing apparatus; providing said electronic device with a metallization layer extending on the passivation layer from the pad to a non-active area of said wafer. The method comprises-performing the electrical testing on wafer of the electronic device by placing a probe of on a portion of the extended metallization layer; performing the cut of said wafer, reducing the extension of the metallization layer to the edge of the electronic device; embedding the device inside a package, forming on the metallization layer an electrical connection configured to connect the metallization layer to a circuit in said package.

Abstract translation: 一种方法执行电子装置在晶片上的电测试和组装，并且包括由钝化层覆盖的氧化物层中制成的焊盘。 该方法包括将电子设备连接到测试设备; 向所述电子设备提供在所述钝化层上从所述焊盘延伸到所述晶片的非有效区域的金属化层。 该方法包括：通过放置延伸的金属化层的一部分上的探针来对电子器件的晶片进行电测试; 执行所述晶片的切割，减少金属化层延伸到电子设备的边缘; 将器件嵌入封装内，在金属化层上形成电连接，该电连接被配置为将金属化层连接到所述封装中的电路。

公开(公告)号：US11724932B2

公开(公告)日：2023-08-15

申请号：US16442199

申请日：2019-06-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Motta

IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00 ,  G01L9/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/0074 ,  G01L9/0045 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0116

Abstract: A method for making an integrated micro-electromechanical device includes forming a first body of semiconductor material having a first face and a second face opposite the first face. The first body includes a buried cavity forming a diaphragm delimited between the buried cavity and the first face. The diaphragm is monolithic with the first body. The method further includes forming at least one first magnetic via extending between the second face and the buried cavity of the first body, forming a first magnetic region extending over the first face of the first body, and forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via.

公开(公告)号：US11552191B2

公开(公告)日：2023-01-10

申请号：US17017565

申请日：2020-09-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alessandro Paolo Bramanti ,  Alberto Pagani ,  Antonello Santangelo

IPC: G01R33/07 ,  H01L29/78 ,  H01L49/02 ,  H01L29/417 ,  H01L43/06 ,  H01L43/14 ,  H03K17/687 ,  H03K17/51

Abstract: Various embodiments of the present disclosure provide a power device including at least one first conductive element adapted to generate a magnetic field when traversed by a current, and characterised in that it further comprises a Hall sensor electrically insulated from the first conductive element. The sensor and the first conductive element are mutually arranged so as to detect said magnetic field indicative of the current that traverses the first conductive element.

公开(公告)号：US20220026466A1

公开(公告)日：2022-01-27

申请号：US17496154

申请日：2021-10-07

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R3/00 ,  G01R31/319 ,  G01R1/067 ,  G01R1/073

Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

公开(公告)号：US10861842B2

公开(公告)日：2020-12-08

申请号：US16389475

申请日：2019-04-19

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L23/31 ,  H01L23/48 ,  H01L21/768 ,  H01L23/498 ,  H01L27/02 ,  H01L23/00 ,  H01L23/66 ,  H01L21/683 ,  H01L25/10 ,  H05K1/18 ,  H01L25/065 ,  H01L21/66 ,  H01L21/56

Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.