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119 条记录 (耗时 0.021 秒)

    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
    115.
    发明申请
    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF 有权
    混合集成组件及其制造方法

    公开(公告)号：US20130299924A1

    公开(公告)日：2013-11-14

    申请号：US13890450

    申请日：2013-05-09

    申请人： Heribert WEBER ,  Frank Fischer ,  Mirko Hattass ,  Yvonne Bergmann

    发明人： Heribert WEBER ,  Frank Fischer ,  Mirko Hattass ,  Yvonne Bergmann

    IPC分类号： B81B3/00 ,  B81C1/00

    CPC分类号： B81B3/0021 ,  B81B2201/025 ,  B81B2207/096 ,  B81C1/00238 ,  B81C1/00261 ,  B81C1/00301 ,  B81C2203/0792 ,  H01L2224/13 ,  H01L2224/48463 ,  H01L2224/73257 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure.

    摘要翻译： 组件系统包括至少一个MEMS元件，用于MEMS元件的微机械结构的盖以及至少一个ASIC基板。 MEMS元件的微机械结构在SOI晶片的功能层中实现。 MEMS元件面朝下安装，ASIC结构上的结构化功能层，并且帽被实现在SOI晶片的衬底中。 ASIC基板包括在两侧设置有分层结构的起始衬底。 在ASIC基板的MEMS侧分层结构和后侧层叠结构中，每种情况都至少实现一个电路电平。 在ASIC基板中，实现至少一个ASIC接触，其电接触后侧分层结构的至少一个电路电平和/或MEMS侧分层结构的至少一个电路电平。

    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
    116.
    发明申请
    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF 有权
    混合集成组件及其制造方法

    公开(公告)号：US20130285166A1

    公开(公告)日：2013-10-31

    申请号：US13869692

    申请日：2013-04-24

    申请人： Johannes Classen

    发明人： Johannes Classen

    IPC分类号： B81B3/00 ,  B81C1/00

    CPC分类号： B81B3/004 ,  B81B3/0018 ,  B81B3/0075 ,  B81B7/008 ,  B81C1/00134 ,  B81C1/00246 ,  B81C1/00261 ,  B81C1/00674 ,  B81C3/001 ,  B81C2203/0109 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01L24/13 ,  H01L2224/11 ,  H01L2224/48463

    摘要： Hybrid integrated components including an MEMS element and an ASIC element are described, whose capacitor system allows both signal detection with comparatively high sensitivity and sensitive activation of the micromechanical structure of the MEMS element. The hybrid integrated component includes an MEMS element having a micromechanical structure which extends over the entire thickness of the MEMS substrate. At least one structural element of this micromechanical structure is deflectable and is operationally linked to at least one capacitor system, which includes at least one movable electrode and at least one stationary electrode. Furthermore, the component includes an ASIC element having at least one electrode of the capacitor system. The MEMS element is mounted on the ASIC element, so that there is a gap between the micromechanical structure and the surface of the ASIC element. According to the invention, at least one electrode of the capacitor system is separated from the layered structure of the ASIC element and instead mechanically and electrically connected to the deflectable structural element of the MEMS element, so that this electrode functions as a movable electrode of the capacitor system.

    摘要翻译： 描述了包括MEMS元件和ASIC元件的混合集成部件，其电容器系统允许具有较高灵敏度的信号检测和MEMS元件的微机械结构的敏感激活。 混合集成部件包括具有在MEMS基板的整个厚度上延伸的微机械结构的MEMS元件。 该微机械结构的至少一个结构元件是可偏转的并且可操作地连接至至少一个电容器系统，其包括至少一个可移动电极和至少一个固定电极。 此外，该部件包括具有电容器系统的至少一个电极的ASIC元件。 MEMS元件安装在ASIC元件上，使得微机械结构和ASIC元件的表面之间存在间隙。 根据本发明，电容器系统的至少一个电极与ASIC元件的分层结构分离，而是机械地和电连接到MEMS元件的可偏转结构元件，使得该电极用作可移动电极 电容器系统。

    Leadframe-Based Premolded Package Having Acoustic Air Channel for Micro-Electro-Mechanical System
    117.
    发明申请
    Leadframe-Based Premolded Package Having Acoustic Air Channel for Micro-Electro-Mechanical System 有权
    基于引线框架的预制包装，具有用于微机电系统的声空气通道

    公开(公告)号：US20110156176A1

    公开(公告)日：2011-06-30

    申请号：US12969821

    申请日：2010-12-16

    申请人： James Richard Huckabee ,  Ray H. Purdom

    发明人： James Richard Huckabee ,  Ray H. Purdom

    IPC分类号： H01L29/66 ,  H01L21/02

    CPC分类号： B81C1/00261 ,  B81B3/0081 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00

    摘要： A low-cost micro-electro-mechanical system (MEMS) has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc, is assembled on the inset so that the opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel can then reach from the ambient through the vent and the second perforation to the second tier recess, which connects to the first perforation and the chip opening to the membrane.

    摘要翻译： 低成本的微机电系统（MEMS）具有作为预成型引线框制造的大量生产的载体，使得引线框架中心的空间填充有复合物，并且在中心形成两层凹槽。 第一层由具有第一穿孔和第二穿孔的插入物填充。 在开口端部的具有开口的膜和可操作为压力传感器，麦克风，扬声器等的膜的集成电路芯片组装在插图上，使得开口与第一穿孔对准。 芯片由与第二插入孔对准的通气孔横切的盖保护。 空气通道然后可以从环境通过排气口和第二穿孔到达第二层凹槽，其连接到第一穿孔和到膜的开口。

    Microelectromechanical systems, and devices having thin film encapsulated mechanical structures
    119.
    发明授权
    Microelectromechanical systems, and devices having thin film encapsulated mechanical structures 有权
    微机电系统和具有薄膜封装机械结构的器件

    公开(公告)号：US07288824B2

    公开(公告)日：2007-10-30

    申请号：US11323920

    申请日：2005-12-30

    申请人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

    发明人： Aaron Partridge ,  Markus Lutz ,  Silvia Kronmueller

    IPC分类号： H01L27/14 ,  H01L29/82 ,  H01L29/84

    CPC分类号： B81C1/00261 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2201/0176 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

    摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及一种MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。 当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响 室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。 在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。