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公开(公告)号：US12004298B2
公开(公告)日：2024-06-04
申请号：US17392817
申请日：2021-08-03
Applicant: Shinkawa Electric Co., Ltd.
Inventor： Kotaro Matsumoto , Hiroyuki Matsuda , Hiroshi Aoki , Masaru Terada , Ovel Emerson , Paul A. Lowe
CPC classification number: H05K1/181 , H05K5/0073 , H05K5/03 , H05K2201/09827 , H05K2201/10037 , H05K2201/10098 , H05K2201/10151 , H05K2201/10159 , H05K2201/10583
Abstract: Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.
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公开(公告)号：US11979992B2
公开(公告)日：2024-05-07
申请号：US17410597
申请日：2021-08-24
Applicant: Medtronic MiniMed, Inc.
Inventor： Claire F. Ferraro , Shelley L. Thurk , Mark Henschel , Shawn Shi , Gabe German
IPC: H05K5/00 , A61B5/145 , B29C45/14 , H05K5/06 , B29K77/00 , B29K79/00 , B29L31/00 , B29L31/34 , H01R12/71 , H05K1/18
CPC classification number: H05K5/0034 , A61B5/14532 , B29C45/14819 , B29C45/14836 , H05K5/0069 , H05K5/069 , A61B2562/12 , A61B2562/166 , A61B2562/227 , A61B2562/242 , B29C2045/14844 , B29K2077/00 , B29K2079/08 , B29L2031/3425 , B29L2031/753 , H01R12/71 , H05K1/181 , H05K2201/10037
Abstract: An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.
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公开(公告)号：US11950368B2
公开(公告)日：2024-04-02
申请号：US17851504
申请日：2022-06-28
Applicant: Yazaki Corporation
Inventor： Hidehiko Shimizu , Tomohiro Sugiura
IPC: H05K1/18
CPC classification number: H05K1/189 , H05K2201/09036 , H05K2201/10037 , H05K2201/10272
Abstract: A flexible printed circuit includes: a chip component serving as an electronic component having a first electrode and the like; a base film; a conductive first pattern layer which is laminated on a portion of the base film and has a bonding region to which the electrode is, for example, soldered; and a coverlay laminated on the base film or the first pattern layer via an adhesive and having an opening for externally exposing a portion of the first pattern layer including the bonding region, and the chip component. The first pattern layer has a groove that opens in a range between the bonding region and an edge of the opening on a surface of the first pattern layer.
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公开(公告)号：US11909132B2
公开(公告)日：2024-02-20
申请号：US17043011
申请日：2019-11-19
Applicant: LG Chem, Ltd.
Inventor： Changjoo Lee
CPC classification number: H01Q9/0464 , H01M10/425 , H01Q7/00 , H05K1/0243 , H01M2010/4278 , H05K2201/10037 , H05K2201/10098
Abstract: A printed circuit board (PCB) adopting an edge antenna which designs an antenna pattern in an edge region of the PCB to generate a beam pattern generated from the antenna pattern not in a vertical direction to an antenna plane but in a lateral direction of the PCB, thereby enabling face-to-face communication between large-area battery packs laterally adjacent to each other, and a battery including battery packs having the PCB.
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115.发明公开公开(公告)号：US20240055672A1
公开(公告)日：2024-02-15
申请号：US18271195
申请日：2022-02-11
Applicant: LG ENERGY SOLUTION, LTD.
Inventor： Sang Jin KIM , Jin Hyun LEE , Jae Young JANG , Dae Ho JUNG
IPC: H01M10/42 , H05K1/18 , H05K1/11 , H01M50/528 , B23K26/26
CPC classification number: H01M10/425 , H05K1/181 , H05K1/11 , H01M50/528 , B23K26/26 , H05K2201/10037 , H01M2200/00
Abstract: Discussed is a connection structure between a battery and a protection circuit module (PCM) in a battery pack in which a battery cell is connected to the PCM. The battery cell can include a battery cell main body, and an electrode lead tab electrically connected with the battery cell main body. The PCM can include a printed circuit board (PCB), which can include an insulation board, a second copper foil layer in contact with a first surface of the insulation board, a first copper foil layer above the second copper foil layer, and a first prepreg layer between the first copper foil layer and the second copper foil layer. The electrode lead tab of the battery cell can directly contact the first copper foil layer of the PCM.
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Patent Agency Ranking
公开(公告)号：US11894580B2
公开(公告)日：2024-02-06
申请号：US18352584
申请日：2023-07-14
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcom Brown , Paul Tsao
IPC: H01M50/581 , H05K1/11 , H05K1/18 , H05K3/40 , H01M10/48 , H01M50/526 , H01M50/522 , H01M50/503 , H01M10/42 , H05K1/02
CPC classification number: H01M50/581 , H01M10/482 , H01M50/503 , H01M50/522 , H01M50/526 , H05K1/118 , H05K1/189 , H05K3/4092 , H01M10/4257 , H01M2200/103 , H05K1/0265 , H05K2201/0397 , H05K2201/056 , H05K2201/09081 , H05K2201/10037 , H05K2201/10181 , Y02E60/10
Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.
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公开(公告)号：US20240032200A1
公开(公告)日：2024-01-25
申请号：US18446820
申请日：2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taihwan CHOI , Jongdoo KIM , Jongmin KIM , Ungki MIN , Gunhee PARK , Daeseung PARK , Garam YU , Bongyeol LEE , Hanyeop LEE , Gun LIM
IPC: H05K1/18
CPC classification number: H05K1/183 , H05K2201/10037 , H05K2201/10083
Abstract: An electronic device is provided. The electronic device includes an electronic component including a coil therein, and a printed circuit board that is disposed to surround at least a part of the electronic component and includes plural slits disposed at preset intervals in at least one of regions facing the electronic component, wherein each of the plural slits may include a central slit portion extended along a center of the slit, and a symmetric slit portion extended to be symmetric with respect to the central slit portion.
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公开(公告)号：US20240023244A1
公开(公告)日：2024-01-18
申请号：US18128477
申请日：2023-03-30
Applicant: Inventus Power, Inc.
Inventor： Elijah Brett Goldin , Ilyas Ayub , William Mark Batts , Anvin Joe Manadan , Timothy James Vallaro , Bryan Rossman , Daniel Paul Rose , Kevin James Zwart , Marcelo Nicosia , Horace C. Rodriguez
IPC: H05K1/11 , H05K3/30 , H05K1/18 , H01M50/209 , H01M50/502
CPC classification number: H05K1/118 , H05K1/117 , H05K3/303 , H05K1/181 , H01M50/209 , H01M50/502 , H01M2220/30 , H05K2201/10037 , H05K2203/107 , H05K2201/09072
Abstract: A molded housing of a conformal wearable battery (CWB) encloses an electronic component and include an electrically conductive contact component embedded within an exterior wall to conduct electricity between an interior and an exterior of the casing. A flexible printed circuit board assembly (PCBA) for a conformal wearable battery (CWB) is enclosed in a cavity within the molded housing and includes attachment sections for a plurality of battery cells that are arranged in a grid-like pattern on a same side of the flexible PCBA. A visco-elastic shock-absorbing member installed between the upper and lower portion of the flexible PCBA when configured in a folded configuration. Each battery cell is joined to the flexible PCBA via a welding process. Each battery cell has a visco-elastic shock-absorbing member attached individually to each battery cell of the plurality of battery cells. When folded to fit within the cavity of the molded housing, the flexible PCBA forms a three-dimensional grid of physical components comprising at least the battery cell modules.
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公开(公告)号：US20230413454A1
公开(公告)日：2023-12-21
申请号：US18239723
申请日：2023-08-29
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Ming-Hung CHEN , Yung I YEH , Chang-Lin YEH , Sheng-Yu CHEN
CPC classification number: H05K5/0017 , H05K5/065 , H05K1/181 , H05K9/0022 , H05K3/284 , H05K1/142 , H05K1/144 , H05K2203/1316 , H05K2201/10037 , H05K2201/10128 , H05K2201/10151 , H05K2201/041 , H05K2203/1327
Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
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公开(公告)号：US20230412095A1
公开(公告)日：2023-12-21
申请号：US17882913
申请日：2022-08-08
Applicant: CenturyLink Intellectual Property LLC
Inventor： Patrick Giagnocavo
CPC classification number: H02N2/04 , H05K1/189 , H01L41/12 , H05K2201/10151 , H05K2201/083 , H05K2201/10121 , H05K2201/10106 , H05K2201/10037
Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.
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