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公开(公告)号：US09965901B2
公开(公告)日：2018-05-08
申请号：US15176139
申请日：2016-06-07
Applicant: KLA-Tencor Corporation
Inventor： Jing Zhang , Kris Bhaskar
CPC classification number: G06T19/20 , G06F17/5081 , G06K9/4628 , G06K9/6257 , G06T7/00 , G06T7/001 , G06T9/00 , G06T2200/08 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for generating simulated images from design information are provided. One system includes one or more computer subsystems and one or more components executed by the computer subsystem(s), which include a generative model. The generative model includes two or more encoder layers configured for determining features of design information for a specimen. The generative model also includes two or more decoder layers configured for generating one or more simulated images from the determined features. The simulated image(s) illustrate how the design information formed on the specimen appears in one or more actual images of the specimen generated by an imaging system.
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公开(公告)号：US09875536B2
公开(公告)日：2018-01-23
申请号：US15084340
申请日：2016-03-29
Applicant: KLA-Tencor Corporation
Inventor： Soren Konecky
CPC classification number: G06T7/001 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for determining if a defect detected on a specimen is a DOI (Defect of Interest) or a nuisance are provided. One system includes computer subsystem(s) configured for aligning output of an inspection subsystem for an area on a specimen to simulated output of the inspection subsystem for the area on the specimen and detecting a defect in the output for the area on the specimen. The computer subsystem(s) are also configured for determining a location of the defect in the output with respect to patterned features in the simulated output based on results of the detecting and aligning, determining a distance between the determined location of the defect and a known location of interest on the specimen, and determining if the defect is a DOI or a nuisance based on the determined distance.
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公开(公告)号：US09835566B2
公开(公告)日：2017-12-05
申请号：US15058115
申请日：2016-03-01
Applicant: KLA-Tencor Corporation
Inventor： Ardis Liang , Martin Plihal , Raghav Babulnath , Sankar Venkataraman
CPC classification number: G01N21/8806 , G01N21/9501 , G01N23/20008 , G01N2021/8809 , G01N2201/061 , G01N2201/0683
Abstract: Methods and systems for generating inspection results for a specimen with an adaptive nuisance filter are provided. One method includes selecting a portion of events detected during inspection of a specimen having values for at least one feature of the events that are closer to at least one value of at least one parameter of the nuisance filter than the values for at least one feature of another portion of the events. The method also includes acquiring output of an output acquisition subsystem for the sample of events, classifying the events in the sample based on the acquired output, and determining if one or more parameters of the nuisance filter should be modified based on results of the classifying. The nuisance filter or the modified nuisance filter can then be applied to results of the inspection of the specimen to generate final inspection results for the specimen.
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公开(公告)号：US09778207B2
公开(公告)日：2017-10-03
申请号：US14890880
申请日：2014-05-14
Applicant: KLA-Tencor Corporation
Inventor： Weston L. Sousa , Yalin Xiong , Rui-Fang Shi
IPC: G01N21/88 , G03F1/84 , G06T7/00 , G01N21/956
CPC classification number: G01N21/8851 , G01N21/94 , G01N21/956 , G01N21/95607 , G01N2021/558 , G01N2021/8867 , G01N2021/95676 , G01N2201/12 , G03F1/84 , G06T7/0004 , G06T7/001 , G06T7/10 , G06T7/136 , G06T2207/30148
Abstract: Methods and systems for integrated multi-pass reticle inspection are provided. One method for inspecting a reticle includes acquiring at least first, second, and third images for the reticle. The first image is a substantially high resolution image of light transmitted by the reticle. The second image is a substantially high resolution image of light reflected from the reticle. The third image is an image of light transmitted by the reticle that is acquired with a substantially low numerical aperture. The method also includes detecting defects on the reticle using at least the first, second, and third images for the reticle in combination.
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公开(公告)号：US09727047B2
公开(公告)日：2017-08-08
申请号：US14880187
申请日：2015-10-09
Applicant: KLA-Tencor Corporation
Inventor： Qing Luo , Kenong Wu , Hucheng Lee , Lisheng Gao , Eugene Shifrin , Yan Xiong , Shuo Sun
IPC: G05B19/401 , H01L21/66
CPC classification number: G05B19/401 , G05B2219/37365 , G05B2219/37571 , H01J2237/221 , H01J2237/2817 , H01L22/12 , H01L22/20
Abstract: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.
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Patent Agency Ranking
公开(公告)号：US09721337B2
公开(公告)日：2017-08-01
申请号：US14944130
申请日：2015-11-17
Applicant: KLA-Tencor Corporation
Inventor： Kenong Wu , Meng-Che Wu , Lisheng Gao
CPC classification number: G06T7/001 , G01N21/9501 , G06T2207/10061 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations.
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公开(公告)号：US09646379B1
公开(公告)日：2017-05-09
申请号：US15139315
申请日：2016-04-26
Applicant: KLA-Tencor Corporation
Inventor： Haiguang Chen , Michael D. Kirk , Stephen Biellak , Jaydeep Sinha
CPC classification number: G06T7/0012 , G01N21/8851 , G01N21/95623 , G01N2021/8887 , G06K9/4633 , G06K2209/19 , G06T7/0004 , G06T7/60 , G06T2207/20056 , G06T2207/20061 , G06T2207/30148
Abstract: Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.
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公开(公告)号：US09613411B2
公开(公告)日：2017-04-04
申请号：US14505446
申请日：2014-10-02
Applicant: KLA-Tencor Corporation
Inventor： Raghavan Konuru , Naema Bhatti , Michael Lennek , Martin Plihal
CPC classification number: G06T7/0004 , G06K9/6254 , G06K9/6282 , G06K2209/19
Abstract: Methods and systems for setting up a classifier for defects detected on a wafer are provided. One method includes generating a template for a defect classifier for defects detected on a wafer and applying the template to a training data set. The training data set includes information for defects detected on the wafer or another wafer. The method also includes determining one or more parameters for the defect classifier based on results of the applying step.
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129.发明授权Decision tree construction for automatic classification of defects on semiconductor wafers 有权用于半导体晶片缺陷自动分类的决策树构造公开(公告)号：US09489599B2
公开(公告)日：2016-11-08
申请号：US14257921
申请日：2014-04-21
Applicant: KLA-Tencor Corporation
Inventor： Chien-Huei (Adam) Chen , Chris Maher , Patrick Huet , Tai-Kam Ng , John Raymond Jordan, III
CPC classification number: G06K9/6285 , G06K9/6282 , G06T7/0004
Abstract: Methods and systems for decision tree construction for automatic classification of defects on semiconductor wafers are provided. One method includes creating a decision tree for classification of defects detected on a wafer by altering one or more floating trees in the decision tree. The one or more floating trees are sub-trees that are manipulated as individual units. In addition, the method includes classifying the defects detected on the wafer by applying the decision tree to the defects.
Abstract translation: 提供了用于半导体晶片上的缺陷自动分类的决策树构造的方法和系统。 一种方法包括通过改变决策树中的一个或多个浮动树来创建用于分类在晶片上检测到的缺陷的决策树。 一个或多个浮动树是作为单独单元操纵的子树。 此外，该方法包括通过将决策树应用于缺陷来分类在晶片上检测到的缺陷。
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130.发明授权Extracting comprehensive design guidance for in-line process control tools and methods 有权为在线过程控制工具和方法提取综合设计指导公开(公告)号：US09400865B2
公开(公告)日：2016-07-26
申请号：US14735596
申请日：2015-06-10
Applicant: KLA-Tencor Corporation
Inventor： Sagar A. Kekare , Sergei G. Bakarian
IPC: G06F17/50
CPC classification number: G06F17/5081 , G06F17/5009 , H01L22/12 , H01L22/20
Abstract: Methods and systems for extracting comprehensive design guidance for in-line process control of wafers are provided. One method includes automatically identifying potential marginalities in a design for a device to be formed on a wafer. The method also includes automatically generating information for the potential marginalities. The automatically generated information is used to set up process control for the wafer.
Abstract translation: 提供了提供晶圆在线过程控制综合设计指导的方法和系统。 一种方法包括自动识别要在晶片上形成的器件的设计中的潜在边缘。 该方法还包括为潜在的边际自动生成信息。 自动生成的信息用于设置晶圆的过程控制。
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