公开(公告)号：US08608659B2

公开(公告)日：2013-12-17

申请号：US10580100

申请日：2004-11-11

申请人： Kouji Waki ,  Takashi Osaka ,  Mitsuaki Ito ,  Takeshi Matsumura ,  Naoyuki Murayama ,  Takashi Kashiwagi

发明人： Kouji Waki ,  Takashi Osaka ,  Mitsuaki Ito ,  Takeshi Matsumura ,  Naoyuki Murayama ,  Takashi Kashiwagi

IPC分类号： A61B8/00

CPC分类号： A61B8/485 ,  A61B8/08 ,  A61B8/14

摘要： An ultrasonic imaging apparatus according to the present invention includes an ultrasonic probe (2) for receiving and transmitting ultrasonic waves from/to an object (1), ultrasound image structuring means (6) for generating an ultrasound image from a reflected echo signal received by the ultrasonic probe, elastic image structuring means (7) for obtaining a physical quantity of the elasticity of a region of the object corresponding to the ultrasound image from the reflected echo signal and generating a color elastic image, display means (9) for overlaying the ultrasound image to the color elastic image, or arranging the ultrasound image and the color elastic input means (17) for variably setting a corresponding relationship between a hue of the color elastic image and the level of the physical quantity displayed on the screen. The level of the elasticity, such as the strain of each region in the tissue or an elastic modulus, is displayed with colors in accordance with the interest of the examiner, thus improving the convenience of use.

摘要翻译： 根据本发明的超声波成像装置包括：用于从物体（1）接收和发射超声波的超声波探头（2），用于从由下列部件接收的反射回波信号产生超声波图像的超声波图像结构装置（6） 超声波探头，用于从反射回波信号中获得与超声波图像对应的物体的区域的弹性的物理量并产生彩色弹性图像的弹性图像构造装置（7），用于将所述超声波探头 超声图像或颜色弹性图像的布置，或者布置超声图像和颜色弹性输入装置，用于可变地设置彩色弹性图像的色调和屏幕上显示的物理量的水平之间的对应关系。 根据检查者的兴趣，以颜色显示弹性水平，例如组织中每个区域的应变或弹性模量，从而提高使用的便利性。

公开(公告)号：US20130131893A1

公开(公告)日：2013-05-23

申请号：US13813587

申请日：2010-12-10

申请人： Koichi Nakao ,  Takeshi Matsumura ,  Toshiro Hikita

发明人： Koichi Nakao ,  Takeshi Matsumura ,  Toshiro Hikita

IPC分类号： G06F17/00

CPC分类号： G06F17/00 ,  G07C5/008 ,  G07C5/085

摘要： A vehicular information collection system which collects information from a vehicle. The vehicular information collection system includes a vehicle information output portion that outputs vehicle information to a collection destination, a presentation portion that presents a query relating to sensory evaluation based on the vehicle information output from the vehicle information output portion to a driver, a receiving portion that receives a driver's reply to the query presented by the presentation portion, and a reply output portion that outputs the driver's reply received by the receiving portion to the collection destination. With this configuration, a query relating to sensory evaluation based on vehicle information is presented to request a reply from the driver, thereby collecting vehicle information taking the sensory evaluation of the driver into consideration.

摘要翻译： 一种从车辆收集信息的车辆信息收集系统。 车辆信息收集系统包括将车辆信息输出到收集目的地的车辆信息输出部，基于从车辆信息输出部输出的车辆信息向驾驶者呈现感官评价的查询的呈现部，接收部 其接收由演示部分呈现的查询的驾驶员答复;以及答复输出部分，其将由接收部分接收的驾驶员的答复输出到收集目的地。 利用该结构，提出与基于车辆信息的感官评价有关的查询来请求驾驶员的答复，从而考虑驾驶员的感官评价来收集车辆信息。

公开(公告)号：US08420509B2

公开(公告)日：2013-04-16

申请号：US12975783

申请日：2010-12-22

申请人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

发明人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  C09J163/00 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/16 ,  H01L24/27 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has an elastic modulus (at 50° C.) of 10 MPa or less and the laser marking layer has an elastic modulus (at 50° C.) of 100 MPa or more.

摘要翻译： 本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中 晶片粘合层的弹性模量（50℃）为10MPa以下，激光打标层的弹性模量（50℃）为100MPa以上。

公开(公告)号：US08416469B2

公开(公告)日：2013-04-09

申请号：US12632248

申请日：2009-12-07

申请人： Takeshi Matsumura

发明人： Takeshi Matsumura

IPC分类号： H04N1/04 ,  H04N1/387 ,  H04N1/40

CPC分类号： H04N1/0402 ,  G06T3/4053 ,  H04N1/0437 ,  H04N1/1932 ,  H04N1/1934 ,  H04N1/40068

摘要： Conventionally, in the case where multiple readings of a document are carried out in order to generate an output image, image processing to a super-resolution image has been started after waiting for completion of the multiple readings necessary for giving a target resolution to the image after super-resolution processing. Therefore, a lot of time has been required for processing. In an image processing apparatus including a document reading component configured to read a plurality of image data each having a different phase from a document by a single scanning, a super-resolution processing component is configured to generate super-resolution image data by using the plurality sheets of image data each having a different phase, so as to have a resolution higher than those of the plurality of image data, and an image processing component is configured to carry out multiple image processing to the super-resolution image data. Super-resolution processing is started at the time when image data necessary for obtaining a specific resolution associated with any of the multiple image processing is obtained.

摘要翻译： 通常，在为了生成输出图像而执行文档的多次读取的情况下，在等待完成对图像给出目标分辨率所需的多个读数之后已经开始对超分辨率图像的图像处理 经过超分辨率处理。 因此，需要很多时间来处理。 在包括文件读取部件的图像处理装置中，超文件读取部件被配置为通过单次扫描读取与文档具有不同相位的多个图像数据，超分辨率处理部件被配置为通过使用多个图像数据生成超分辨率图像数据 具有不同相位的图像数据，以便具有比多个图像数据的分辨率更高的分辨率，并且图像处理部件被配置为对超分辨率图像数据执行多个图像处理。 在获得与多个图像处理中的任何一个相关联的特定分辨率所需的图像数据的时刻开始超分辨率处理。

公开(公告)号：US08353831B2

公开(公告)日：2013-01-15

申请号：US11630164

申请日：2005-06-17

申请人： Takeshi Matsumura

发明人： Takeshi Matsumura

IPC分类号： A61B5/00

CPC分类号： A61B8/485 ,  A61B8/08 ,  A61B8/4254 ,  A61B8/463

摘要： A diagnostic ultrasound system includes an ultrasound transmitting and receiving system for transmitting and receiving ultrasonic waves to and from a object to be examined 10, an elasticity image capturing system for capturing an elasticity image related to body tissue of the object to be examined on the basis of a signal output from the ultrasound transmitting and receiving system, and a controlling and displaying system for capturing the elasticity image. The elasticity image capturing system obtains compression data related to the compression state of the object to be examined 10, determines the compression state of the body tissue on the basis of the compression data, and includes a compression direction and range evaluation unit 115 as a compression state evaluating means for reflecting the determination result to the elasticity image. In this way, more accurate diagnosis by objectively and quantitatively grasping the compression state of the body tissue is possible.

摘要翻译： 诊断超声系统包括用于向被检体10发送和接收超声波的超声波发射和接收系统10，用于基于被检测物体的身体组织拍摄与弹性图像相关的弹性图像的弹性图像捕获系统 从超声波发射和接收系统输出的信号，以及用于捕获弹性图像的控制和显示系统。 弹性图像捕获系统获得与被检体10的压缩状态相关的压缩数据，基于压缩数据确定身体组织的压缩状态，并且包括作为压缩的压缩方向和范围评价部115 用于将确定结果反映到弹性图像的状态评估装置。 以这种方式，通过客观和定量地掌握身体组织的压缩状态的更准确的诊断是可能的。

公开(公告)号：US20120289178A1

公开(公告)日：2012-11-15

申请号：US13521953

申请日：2010-02-17

申请人： Takeshi Matsumura ,  Hideshi Murai ,  Toshikane Oda

发明人： Takeshi Matsumura ,  Hideshi Murai ,  Toshikane Oda

IPC分类号： H04W52/02

CPC分类号： H04W52/0206 ,  H04W84/045 ,  Y02D70/1224 ,  Y02D70/1242 ,  Y02D70/1262 ,  Y02D70/164 ,  Y02D70/166

摘要： A Femto base station which is arranged to connect to a wireless communication network and to generate a first cell for providing a wireless communication service to at least one user equipment existing within a coverage area of the first cell, comprising a transceiver comprising a transmitter and a receiver for the wireless communication with the user equipment and a controller, wherein the controller determines whether the Femto base station has entered an energy-saving mode or not, the controller disables the operation of the transmitter when it is determined that the base station has entered the energy-saving mode, and when the receiver detects a data transmission from the user equipment to a macro base station after disabling the operation of the transmitter, the controller reconfigures the transmitter. The macro base station generates a second cell with a broader coverage than the first cell and including the first cell.

摘要翻译： 一种毫微微基站，其被布置为连接到无线通信网络并且生成用于向存在于所述第一小区的覆盖区域内的至少一个用户设备提供无线通信服务的第一小区，所述收发器包括发射机和 用于与用户设备的无线通信的接收机和控制器，其中控制器确定毫微微基站是否已经进入节能模式，当确定基站已经进入时，控制器禁止发射机的操作 节能模式，并且当接收器在禁用发射机的操作之后检测到从用户设备到宏基站的数据传输时，控制器重新配置发射机。 宏基站生成具有比第一小区更宽的覆盖范围并且包括第一小区的第二小区。

公开(公告)号：US08278153B2

公开(公告)日：2012-10-02

申请号：US12829707

申请日：2010-07-02

申请人： Sadahito Misumi ,  Takeshi Matsumura ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

发明人： Sadahito Misumi ,  Takeshi Matsumura ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L23/293 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10T428/1462 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175° C. is 2000 Pa or more.

摘要翻译： 本发明包括临时固定步骤，将半导体元件临时固定在粘合片之间的粘附片上，将导线接合到半导体元件的引线键合步骤以及用密封树脂密封半导体元件的步骤，以及 其中粘合片在175℃下的损耗弹性模量为2000Pa以上。

公开(公告)号：US08278151B2

公开(公告)日：2012-10-02

申请号：US12969959

申请日：2010-12-16

申请人： Shuhei Murata ,  Takeshi Matsumura ,  Koji Mizuno ,  Fumiteru Asai

发明人： Shuhei Murata ,  Takeshi Matsumura ,  Koji Mizuno ,  Fumiteru Asai

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  B32B7/12 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24802 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.

摘要翻译： 本发明的目的在于提供一种用于保持芯片的带状物，其使得片状工件的粘贴和剥离变得容易。 用于保持具有在基材上形成压敏粘合剂层的构造的芯片的胶带，其中粘合剂层具有将片状工件粘贴到其上的切屑状工件粘贴区域 以及粘贴安装框架的框架粘贴区域，并且通过将安装框架粘贴到框架粘贴区域来使用，其中压敏粘合剂层的180度剥离粘合力到硅镜晶片 框状粘贴区域是片状工件粘贴区域的粘合剂层向硅镜面晶片的180度剥离粘合力的5倍以上。

公开(公告)号：US20120208350A1

公开(公告)日：2012-08-16

申请号：US13396554

申请日：2012-02-14

申请人： Takashi Oda ,  Naohide Takamoto ,  Takeshi Matsumura

发明人： Takashi Oda ,  Naohide Takamoto ,  Takeshi Matsumura

IPC分类号： H01L21/78

CPC分类号： H01L23/293 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3157 ,  H01L24/10 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/10126 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00

摘要： The present invention aims to provide a method of manufacturing a semiconductor device that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer, while also suppressing an increase in the number of steps in the manufacturing process. This object is achieved by a method of manufacturing a semiconductor device including the steps of pasting a film for forming a protective layer in which a support base, an adhesive layer, and a thermosetting resin layer are laminated, in that order, onto a bumped wafer in which a low dielectric material layer is formed, with the thermosetting resin layer serving as a pasting surface, and further, peeling the support base and the adhesive layer from the thermosetting resin layer, forming a protective layer by thermally curing the thermosetting resin layer, and dicing the bumped wafer and the protective layer together.

摘要翻译： 本发明的目的在于提供一种能够防止半导体晶片的低电介质材料层中的裂纹的半导体器件的制造方法，同时也抑制了制造工序中的工序数量的增加。 该目的通过一种制造半导体器件的方法来实现，该半导体器件包括以下步骤：将用于形成保护层的膜，其中将支撑基底，粘合剂层和热固性树脂层按顺序粘贴到凸起的晶片上 其中形成低介电材料层，热固性树脂层用作糊化表面，此外，从热固性树脂层剥离支撑基底和粘合剂层，通过热固化热固性树脂层形成保护层， 并将凸起的晶片和保护层切割在一起。

公开(公告)号：US08236614B2

公开(公告)日：2012-08-07

申请号：US11816696

申请日：2006-02-20

申请人： Sadahito Misumi ,  Takeshi Matsumura

发明人： Sadahito Misumi ,  Takeshi Matsumura

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  C08L33/00 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J161/06 ,  H01L21/6836 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3011 ,  Y10T156/10 ,  Y10T428/1462 ,  Y10T428/2887 ,  H01L2924/00012 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/20752

摘要： Provided are a semiconductor device producing method with simple production steps while preventing contamination of a bonding pad and preventing warp generation in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element 13 to an adherend 11 through an adhesive sheet 12, and a wire bonding step of wire bonding the element 13 in the bonding temperatures range of 80 to 250° C. without performing any heating step, wherein, as the adhesive sheet 12, a sheet having a storage elastic modulus of 1 MPa or more in the temperature range of 80 to 250° C. or a storage elastic modulus of 1 MPa or more at any temperature in the temperature range before curing the sheet 12 is used.

摘要翻译： 提供一种半导体器件制造方法，其具有简单的制造步骤，同时防止焊盘的污染并防止诸如衬底，引线框架或半导体元件的被粘物中的翘曲产生，从而提高产量; 在该方法中使用的粘合片; 以及通过该方法获得的半导体器件。 本发明包括通过粘合片12将半导体元件13预先设置到被粘物11的预设步骤，以及在80至250℃的接合温度范围内将元件13引线接合的引线接合步骤，而没有 进行任何加热步骤，其中作为粘合片12，在80-250℃的温度范围内具有1MPa或更高的储能弹性模量或在任何温度下的储能弹性模量为1MPa或更高的片材 使用固化片材12之前的温度范围。