Abstract:
A MEMS device includes a plurality of ribbon elements, a securing portion, and a plurality of connecting portions. The securing portion supports the plurality of ribbon elements. The plurality of connecting portions are disposed on ends of each of the plurality of ribbon elements and connect each of the plurality of ribbon elements to the securing portion. An angle formed by a longitudinal extending line of each of the plurality of ribbon elements and each of the plurality of connecting portions is greater than 0° in a planar direction of each of the plurality of ribbon elements.
Abstract:
For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.
Abstract:
In a mirror drive device, a first and second actuator sections are arranged on both sides of a mirror supporting section that supports a mirror section so as to sandwich the mirror supporting section. Division of an upper and lower electrodes of each of the first and second actuator sections is performed correspondingly to stress distribution of principal stresses in a piezoelectric body in resonant mode vibration, and a piezoelectric body portion corresponding to positions of a first and third upper electrode sections, and a piezoelectric body portion corresponding to positions of a second and fourth upper electrode sections have stresses in opposite directions to each other. Division of the lower electrodes is performed similar to the upper electrodes, and drive voltages having the same phase can be respectively applied to the upper and lower electrode sections of the piezoelectric body portions that are different due to a division arrangement.
Abstract:
The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, and an end of the second beam coupled to a motion actuator; and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.
Abstract:
The invention relates to an electromagnetically actuated microshutter comprising: a moveable plate that can rotate about an axis, connected to a stationary frame by two arms aligned on both sides of the plate to said axis, and comprising on its periphery a conductive loop and below the assembly formed by the stationary frame and the moveable plate, a group of magnets having distinct magnetic orientations, arranged in such a manner so as to create, with respect to the moveable plate, a lateral magnetic field, in the plane of the frame, oblique in relation to the axis of rotation.
Abstract:
This disclosure provides systems, methods and apparatus for modulating light to form an image on a display, as well as methods manufacturing such apparatus. The display apparatus includes shutters having asymmetric light obstructing portions extending out from opposing sides of a shutter aperture along an axis of motion of the shutter. Actuators move the shutters laterally along the axis of motion to move the shutter between fully closed, partially open, and fully open states to modulate light, thereby forming an image.
Abstract:
A microstructural body includes a substrate such as an electrode substrate, a support portion, one post that fixes the support portion to the substrate, a frame-shaped movable portion provided around outer periphery of the support portion, and an elastic support portion that elastically connects the movable portion and the support portion. The elastic support portion supports the frame-shaped movable portion such that the movable portion is movable relative to the support portion. The elastic support portion includes torsion springs and an elastically deformable connecting portion.
Abstract:
The MEMS shutter includes a shutter having an aperture part, a first spring connected to the shutter, a first anchor connected to the first spring, a second spring and a second anchor connected to the second spring, an insulation film on a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a perpendicular direction to a surface of a substrate, and the insulation film is not present on a surface of the plurality of terminals, and a surface of the shutter, the first spring, the second spring, the first anchor and the second anchor, the surfaces being in a parallel direction to a surface of the substrate and on the opposite side of the side facing the substrate.
Abstract:
A cut which penetrates a resin layer is formed in the resin layer such that the cut surrounds a third upper surface. A film is formed such that the film covers the whole resin layer except for a bottom surface of the resin layer inside the cut and at least a portion of the resin layer is exposed outside the cut. The resin layer which is wholly covered with the film is left inside the cut, and the whole resin layer continuously formed with a surface exposed from the film is removed outside the cut. A bump is formed by the resin layer and the film inside the cut, and a shutter and at least a portion of a drive part are formed by the film outside the cut in a state where these parts are floated from a first substrate.
Abstract:
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.