摘要:
A stacked electronic part comprises a first electronic part which is adhered onto a circuit board via a first adhesive layer and a second electronic part which is adhered onto the first electronic part via a second adhesive layer. An insulating resin having a filling viscosity of 1 Pa·s or more and less than 1000 Pa·s or a photo-setting insulating resin is filled in the spaces below first bonding wires which are connected to the first electronic part. Thus, the occurrence of bubbles resulting from the resin non-filled portions below the wires can be prevented. Besides, the first electronic part and the second electronic part are adhered via an insulating resin layer having an adhering viscosity of 1 kPa·s or more and 100 kPa·s or less. Therefore, the occurrence of an insulation failure, a short circuit or the like resulting from a contact between the bonding wires of the lower electronic part and the upper electronic part can be prevented.
摘要:
A semiconductor device includes a substrate, an external connection terminal, a penetrating outer moat in a doughnut form, a first interconnection, a second interconnection and a conductor. The outer moat is formed in a portion of the substrate which surrounds the external connection terminal. The first interconnection is provided on one-surface side of the substrate which is surrounded by the outer moat and electrically connected to the external connection terminal. The second interconnection is provided on one-surface side of the semiconductor chip which lies outside the outer moat and electrically connected to an internal circuit. The conductor has a bent portion and electrically connects the first and second interconnections to each other.
摘要:
According to an embodiment, a first discharging unit and a second discharging unit discharge a sheet. A first conveying path extends from a scanning unit to the first discharging unit. A second conveying path branches off from the first conveying path at a branch point of the first conveying path and extends to the second discharging unit. A conveying member discharges the sheet to the first discharging unit when a discharging destination of the sheet is the first discharging unit, and the conveying member makes part of the sheet project from the first conveying path to the first discharging unit, locates an upstream tip end of the sheet in a sheet conveying direction, at a position downstream in the sheet conveying direction from the branch point, and conveys the sheet to switchback to the second conveying path, when the discharging destination of the sheet is the second discharging unit.
摘要:
According to one embodiment, an electrical component comprises a substrate, an element, a first layer, and a second layer. The element is formed on the substrate. The first layer forms a cavity accommodating the element on the substrate and includes through holes. The second layer is formed on the first layer and seals the through holes. The first layer includes the first film formed on the lower side and the second film which is formed on the first film and has a lower coefficient of thermal expansion than the first film.
摘要:
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar, a resin layer and a conductive material. The conductive material is provided on a surface of the resin layer between the first metal pillar and the second metal pillar, and electrically connects the first metal pillar and the second metal pillar.
摘要:
According to an embodiment, a method for color erasing process includes the steps of: supplying a power to a heat source configured to heat a sheet having an image formed thereon using a color erasable material so as to cause heat generation as warming-up control; stopping the power supply to the heat source for a predetermined period of time in the warming-up control if the temperature of the heat source is increased starting from a temperature lower than a predetermined reference value that is lower than a color erasing temperature of the color erasable material and exceeds the predetermined reference value; performing maintenance control that is power supply control to maintain the temperature of the heat source at the target temperature; and performing, after the passage of the predetermined period of time, a color erasing process by the heat source.
摘要:
After stacking m wafers in each of which a plurality of semiconductor chips are formed, the m wafers are diced to semiconductor chips to form a first chip stack having m of the semiconductor chips stacked, and, after stacking n wafers, the n wafers are diced to semiconductor chips to form a second chip stack having n of the semiconductor chips stacked. Next, the first chip stack is sorted according to the number of defective semiconductor chips included in the first chip stack, and the second chip stack is sorted according to the number of defective semiconductor chips included in the second chip stack. Furthermore, the first chip stack or the second chip stack after sorting are combined to form a third chip stack.
摘要:
An erasing device of one embodiment includes a conveyance unit that conveys a sheet; a pair of rotating brushes is provided corresponding to both side portions in a width direction perpendicular to a sheet conveyance direction of the sheet conveyed by the conveyance unit, the rotating brushes being provided to oppose to each other, nipping the conveyed sheet, the rotating brushes rotating in the same direction as the sheet conveyance direction such that a circumferential speed of the brush tip has a higher speed than a conveyance speed of the sheet, the rotating brushes rolling and correcting a corner fold portion which occurs on the sheet conveyed by the brush tip portion while rotating; and an erasing unit is provided downstream in the sheet conveyance direction than the rotating brush, the erasing unit erasing an image which is formed on the sheet.
摘要:
A sheet feed apparatus which includes a sheet feed tray in which a plurality of sheets is loaded in piles; a sheet feed roller which is provided at a forward position of the sheet feed tray in a sheet feed direction, and sends the loaded sheets inside thereof; and a lift detection sensor which detects, by using a movable lever, a lift of a sheet bundle which occurs when the sheet bundle, of which a rear or a side in a sheet feed direction is bound, is sent by the sheet feed roller therein, the lift detection sensor being provided at a side position of the sheet bundle in a width direction and at a backward position with respect to the center of the sheet bundle in the sheet feed direction.
摘要:
According to one embodiment, a color erasing apparatus includes a color erasing section which erases a color of an image formed with an erasable color material on a sheet conveyed at first speed, a reading section which reads an image on the surface of the sheet conveyed at second speed higher than the first speed, a first conveying section, and a second conveying section. The first conveying section includes a first conveying roller arranged downstream in a sheet conveying direction of the color erasing section and conveys the sheet at the first speed. The second conveying section includes a second conveying roller arranged upstream in the sheet conveying direction of the reading section and in a position where the second conveying roller nips the conveyed sheet simultaneously with the first conveying roller. The second conveying section conveys the sheet to the reading section at the second speed.