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公开(公告)号:US20180268899A1
公开(公告)日:2018-09-20
申请号:US15980480
申请日:2018-05-15
Applicant: Micron Technology, Inc.
Inventor: Agostino Pirovano , Fabio Pellizzer , Anna Maria Conti , Davide Fugazza , Johannes A. Kalb
CPC classification number: G11C13/0004 , G11C7/04 , G11C13/0069 , G11C2013/0083 , G11C2013/0092
Abstract: Various embodiments disclosed herein comprise methods and apparatuses for placing phase-change memory (PCM) cells of a memory array into a temperature regime where nucleation probability of the PCM cells is enhanced prior to applying a subsequent SET programming signal. In one embodiment, the method includes applying a nucleation signal to the PCM cells to form nucleation sites within the memory array where the nucleation signal has a non-zero rising-edge. A programming signal is subsequently applied to achieve a desired level of crystallinity within selected ones of the plurality of PCM cells. Additional methods and apparatuses are also described.
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公开(公告)号:US20180040370A1
公开(公告)日:2018-02-08
申请号:US15231518
申请日:2016-08-08
Applicant: Micron Technology, Inc.
Inventor: Innocenzo Tortorelli , Russell L. Meyer , Agostino Pirovano , Andrea Redaelli , Lorenzo Fratin , Fabio Pellizzer
Abstract: Disclosed herein is a memory cell including a memory element and a selector device. Data may be stored in both the memory element and selector device. The memory cell may be programmed by applying write pulses having different polarities and magnitudes. Different polarities of the write pulses may program different logic states into the selector device. Different magnitudes of the write pulses may program different logic states into the memory element. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities and magnitudes of the write pulses.
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公开(公告)号:US20180006087A1
公开(公告)日:2018-01-04
申请号:US15691576
申请日:2017-08-30
Applicant: Micron Technology, Inc.
Inventor: Antonino Rigano , Fabio Pellizzer , Gianfranco Capetti
CPC classification number: H01L27/2436 , H01L27/101 , H01L27/2463 , H01L45/06 , H01L45/1233
Abstract: Embodiments disclosed herein may relate to forming a base contact layout in a memory device.
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公开(公告)号:US09768378B2
公开(公告)日:2017-09-19
申请号:US14468036
申请日:2014-08-25
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Fabio Pellizzer , Innocenzo Tortorelli , Andrea Ghetti
CPC classification number: H01L45/06 , H01L27/2427 , H01L27/2463 , H01L27/249 , H01L45/1233 , H01L45/144 , H01L45/1675
Abstract: The disclosed technology generally relates to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same. Line stacks are formed, including a storage material line disposed over lower a conductive line. Upper conductive lines are formed over and crossing the line stacks, exposing portions of the line stacks between adjacent upper conductive lines. After forming the upper conductive lines, storage elements are formed at intersections between the lower conductive lines and the upper conductive lines by removing storage materials from exposed portions of the line stacks, such that each storage element is laterally surrounded by spaces. A continuous sealing material laterally surrounds each of the storage elements.
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公开(公告)号:US20170250341A1
公开(公告)日:2017-08-31
申请号:US15596397
申请日:2017-05-16
Applicant: Micron Technology, Inc.
Inventor: Fabio Pellizzer
CPC classification number: H01L45/1675 , H01L27/2463 , H01L45/04 , H01L45/06 , H01L45/065 , H01L45/085 , H01L45/1233 , H01L45/1253 , H01L45/144 , H01L45/1666
Abstract: Some embodiments include a memory array having a first series of access/sense lines which extend along a first direction, a second series of access/sense lines over the first series of access/sense lines and which extend along a second direction substantially orthogonal to the first direction, and memory cells vertically between the first and second series of access/sense lines. Each memory cell is uniquely addressed by a combination of an access/sense line from the first series and an access/sense line from the second series. The memory cells have programmable material. At least some of the programmable material within each memory cell is a polygonal structure having a sidewall that extends along a third direction which is different from the first and second directions. Some embodiments include methods of forming memory arrays.
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公开(公告)号:US09748311B2
公开(公告)日:2017-08-29
申请号:US14535731
申请日:2014-11-07
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Paolo Fantini , Cristina Casellato , Fabio Pellizzer
IPC: H01L45/00 , H01L27/24 , H01L27/115 , H01L21/764 , H01L21/768 , H01L27/11521 , H01L27/11524 , H01L21/762 , H01L27/1157
CPC classification number: H01L27/2463 , H01L21/76224 , H01L21/764 , H01L21/7682 , H01L21/76837 , H01L27/115 , H01L27/11521 , H01L27/11524 , H01L27/1157 , H01L45/06 , H01L45/1233 , H01L45/141 , H01L45/144 , H01L45/1675
Abstract: A cross-point memory array includes a plurality of variable resistance memory cell pillars. Adjacent memory cell pillars are separated by a partially filled gap that includes a buried void. In addition, adjacent memory cell pillars include storage material elements that are at least partially interposed by the buried void.
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公开(公告)号:US09673393B2
公开(公告)日:2017-06-06
申请号:US15145654
申请日:2016-05-03
Applicant: Micron Technology, Inc.
Inventor: Fabio Pellizzer
CPC classification number: H01L45/1675 , H01L27/2463 , H01L45/04 , H01L45/06 , H01L45/065 , H01L45/085 , H01L45/1233 , H01L45/1253 , H01L45/144 , H01L45/1666
Abstract: Some embodiments include a memory array having a first series of access/sense lines which extend along a first direction, a second series of access/sense lines over the first series of access/sense lines and which extend along a second direction substantially orthogonal to the first direction, and memory cells vertically between the first and second series of access/sense lines. Each memory cell is uniquely addressed by a combination of an access/sense line from the first series and an access/sense line from the second series. The memory cells have programmable material. At least some of the programmable material within each memory cell is a polygonal structure having a sidewall that extends along a third direction which is different from the first and second directions. Some embodiments include methods of forming memory arrays.
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公开(公告)号:US09645102B2
公开(公告)日:2017-05-09
申请号:US14596406
申请日:2015-01-14
Applicant: Micron Technology, Inc.
Inventor: Fabio Pellizzer , Innocenzo Tortorelli , Christina Papagianni , Gianpaolo Spadini , Jong Won Lee
CPC classification number: G01N27/04 , H01L22/34 , H01L43/10 , H01L45/04 , H01L45/06 , H01L45/14 , H01L45/142 , H01L45/143 , H01L45/144 , H01L45/146 , H01L45/147 , H01L45/148
Abstract: Material test structures having cantilever portions and methods of forming the same are described herein. As an example, a method of forming a material test structure includes forming a number of electrode portions in a first dielectric material, forming a second dielectric material on the first dielectric material, wherein the second dielectric material includes a first cantilever portion and a second cantilever portion, and forming a test material on the number of electrode portions, the first dielectric material, and the second dielectric material.
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公开(公告)号:US20170125484A1
公开(公告)日:2017-05-04
申请号:US14932707
申请日:2015-11-04
Applicant: Micron Technology, Inc.
Inventor: Fabio Pellizzer
CPC classification number: H01L27/2481 , G11C13/0004 , G11C13/0026 , G11C13/0028 , G11C13/003 , G11C13/004 , G11C13/0069 , G11C2013/0073 , G11C2213/71 , G11C2213/77 , H01L27/2409 , H01L27/249 , H01L45/04 , H01L45/06 , H01L45/065 , H01L45/1226 , H01L45/1233 , H01L45/126 , H01L45/141 , H01L45/143 , H01L45/144 , H01L45/16 , H01L45/1608
Abstract: A three dimensional (3D) memory array is disclosed. The 3D memory array may include an electrode plane and a memory material disposed through and coupled to the electrode plane. A memory cell included in the memory material is aligned in a same plane as the electrode plane, and the memory cell is configured to exhibit a first threshold voltage representative of a first logic state and a second threshold voltage representative of a second logic state. A conductive pillar is disposed through and coupled to the memory cell, wherein the conductive pillar and electrode plane are configured to provide a voltage across the memory cell to write a logic state to the memory cell. Methods to operate and to form the 3D memory array are disclosed.
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公开(公告)号:US20170033042A1
公开(公告)日:2017-02-02
申请号:US15233494
申请日:2016-08-10
Applicant: Micron Technology, Inc.
Inventor: Fabio Pellizzer , Everardo Torres Flores , Hernan A. Castro
IPC: H01L23/528 , H01L27/02 , H01L21/768 , G11C5/06 , G11C13/00
CPC classification number: H01L23/528 , G11C5/025 , G11C5/063 , G11C13/0004 , G11C13/0028 , G11C2213/77 , H01L21/768 , H01L27/0207 , H01L27/2427 , H01L27/2463 , H01L2924/0002 , H01L2924/00
Abstract: Subject matter disclosed herein may relate to word line electrodes and/or digit line electrodes in a cross-point array memory device. One or more word line electrodes may be configured to form a socket area to provide connection points to drivers and/or other circuitry that may be located within a footprint of an array of memory cells.
Abstract translation: 本文公开的主题可涉及交叉点阵列存储装置中的字线电极和/或数字线电极。 一个或多个字线电极可以被配置为形成插座区域,以提供到可以位于存储器单元阵列的覆盖区内的驱动器和/或其他电路的连接点。
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