Abstract:
Embodiments relate to an improved tri-gate device having gate metal fills, providing compressive or tensile stress upon at least a portion of the tri-gate transistor, thereby increasing the carrier mobility and operating frequency. Embodiments also contemplate method for use of the improved tri-gate device.
Abstract:
A hetero-BiMOS injection system comprises a MOSFET transistor formed on a substrate and a hetero-bipolar transistor formed within the substrate. The bipolar transistor can be used to inject charge carriers into a floating gate of the MOSFET transistor. This is done by operating the MOSFET transistor to form an inversion layer in its channel region and operating the bipolar transistor to drive minority charge carriers from the substrate into a floating gate of the MOSFET transistor. The substrate provides a silicon emitter and a silicon germanium containing base for the bipolar transistor. The inversion layer provides a silicon collector for the bipolar transistor.
Abstract:
In general, in one aspect, a method includes forming an n-diffusion fin and a p-diffusion fin in a semiconductor substrate. A high dielectric constant layer is formed over the substrate. A first work function metal layer is created over the n-diffusion fin and a second work function metal layer, thicker than the first, is created over the n-diffusion fin. A silicon germanium layer is formed over the first and second work function metal layers. A ploysilicon layer is formed over the silicon germanium layer and is polished. The ploysilicon layer over the first work function metal layer is thicker than the ploysilicon layer over the second work function metal layer. A hard mask is patterned and used to etch the ploysilicon layer and the silicon germanium layer to create gate stacks. The etch rate of the silicon germanium layer is faster over the first work function metal layer.
Abstract:
Independent gate electrodes for multi-gate transistors are generally described. In one example, an apparatus includes a semiconductor fin, one or more multi-gate pull down (PD) gate stacks coupled with the semiconductor fin, the one or more PD gate stacks including a PD gate electrode, and one or more multi-gate pass gate (PG) gate stacks coupled with the semiconductor fin, the one or more PG gate stacks including a PG gate electrode, the PG gate electrode having a greater threshold voltage than the PD gate electrode.
Abstract:
A process capable of integrating both planar and non-planar transistors onto a bulk semiconductor substrate, wherein the channel of all transistors is definable over a continuous range of widths.
Abstract:
In one embodiment, the present invention includes a method for forming a transistor that includes forming a first buffer layer of silicon germanium tin (SiGe(Sn)) on a silicon (Si) substrate, forming a barrier layer on the first buffer layer, the barrier layer comprising silicon germanium (Si1−xGex), and forming a quantum well (QW) layer on the barrier layer including a lower QW barrier layer formed of silicon germanium carbon (Si1−yGey(C)), a strained QW channel layer formed of germanium on the lower QW layer, and an upper QW barrier layer on the strained QW channel layer formed of Si1−zGez(C). Other embodiments are described and claimed.
Abstract translation:在一个实施例中,本发明包括一种用于形成晶体管的方法,该晶体管包括在硅(Si)衬底上形成硅锗锡(SiGe(Sn))的第一缓冲层,在第一缓冲层上形成阻挡层, 阻挡层,其包含硅锗(Si 1-x N x Ge x Si x Ga y),并且在阻挡层上形成量子阱(QW)层,其包括由硅形成的下部QW势垒层 锗碳(Si 1-y)Ge(C)),由QW层上的锗形成的应变QW沟道层和上QW沟道层 应变QW沟道层由Si 1-z≡Z(C)形成。 描述和要求保护其他实施例。
Abstract:
Embodiments of an apparatus and methods for fabricating a spacer on one part of a multi-gate transistor without forming a spacer on another part of the multi-gate transistor are generally described herein. Other embodiments may be described and claimed.
Abstract:
A transistor structure and a system including the transistor structure. The transistor structure comprises: a substrate including a first layer comprising a first crystalline material; a tensile strained channel formed on a surface of the first layer and comprising a second crystalline material having a lattice spacing that is smaller than a lattice spacing of the first crystalline material; a metal gate on the substrate; a pair of sidewall spacers on opposite sides of the metal gate; and a source region and a drain region on opposite sides of the metal gate adjacent a corresponding one of the sidewall spacers.
Abstract:
A method to provide a transistor or memory cell structure. The method comprises: providing a substrate including a lower Si substrate and an insulating layer on the substrate; providing a first projection extending above the insulating layer, the first projection including an Si material and a Si1-xGex material; and exposing the first projection to preferential oxidation to yield a second projection including a center region comprising Ge/Si1-yGey and a covering region comprising SiO2 and enclosing the center region.
Abstract:
A group III-V material CMOS device may have NMOS and PMOS portions that are substantially the same through several of their layers. This may make the CMOS device easy to make and prevent coefficient of thermal expansion mismatches between the NMOS and PMOS portions.