公开(公告)号：US20130147062A1

公开(公告)日：2013-06-13

申请号：US13567046

申请日：2012-08-04

Applicant: Hee-Jin LEE ,  Woo-Dong LEE

Inventor： Hee-Jin LEE ,  Woo-Dong LEE

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L21/50 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion. Thus, the protrusion may not be deflected.

Abstract translation: 多芯片封装可以包括封装衬底，第一半导体芯片，第二半导体芯片和支撑构件。 第一半导体芯片可以布置在封装衬底的上表面上。 第一半导体芯片可以与封装衬底电连接。 第二半导体芯片可以布置在第一半导体芯片的上表面上。 第二半导体芯片可以与第一半导体芯片电连接。 第二半导体芯片可以具有突出超过第一半导体芯片的侧表面的区域的突起。 支撑构件可以插入在第二半导体芯片的突起与封装基板之间，以防止突起的偏转。 因此，突起可能不会偏转。

公开(公告)号：US20130146719A1

公开(公告)日：2013-06-13

申请号：US13554329

申请日：2012-07-20

Applicant: Byung Sik YOON ,  Sook-Jin LEE

Inventor： Byung Sik YOON ,  Sook-Jin LEE

IPC: B61L25/02 ,  H04B7/24

CPC classification number: B61L25/025 ,  B61L3/121 ,  B61L3/125 ,  B61L15/0027 ,  B61L27/0005 ,  B61L27/0038 ,  B61L2003/123 ,  B61L2027/005

Abstract: A frequency control apparatus and method for railway wireless communication are provided. The frequency control apparatus includes a variable frequency processor and a fixed frequency processor. The variable frequency processor selects an available variable frequency and wirelessly receives non-safety-related train running information from a base station at the selected variable frequency. The fixed frequency processor wirelessly receives safety-related train running information at a predetermined fixed frequency.

Abstract translation: 提供了一种用于铁路无线通信的频率控制装置和方法。 频率控制装置包括可变频率处理器和固定频率处理器。 可变频率处理器选择可用的可变频率，并且以选定的可变频率从基站无线地接收非安全相关的列车运行信息。 固定频率处理器以预定的固定频率无线地接收与安全相关的列车运行信息。

公开(公告)号：US08455889B2

公开(公告)日：2013-06-04

申请号：US13102586

申请日：2011-05-06

Applicant: Young-jin Lee ,  Jeong-wook Lee ,  Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi

Inventor： Young-jin Lee ,  Jeong-wook Lee ,  Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi

IPC: H01L29/18

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.

Abstract translation: 一种用于芯片封装的引线框架，芯片封装，封装模块和包括芯片封装模块的照明装置。 芯片封装包括第一耦合部分和第二耦合部分，该第一耦合部分和第二耦合部分在引线框架的边缘处彼此耦合，用于在其上安装芯片，因此封装模块通过将第一耦合部分和第二耦合部分 对彼此。

公开(公告)号：US20130128170A1

公开(公告)日：2013-05-23

申请号：US13415137

申请日：2012-03-08

Applicant: Myong Ho Kwon ,  Chang-Jin Lee ,  Chang-Gil Lee ,  Tae-Sik Kim ,  Hwal Choi

Inventor： Myong Ho Kwon ,  Chang-Jin Lee ,  Chang-Gil Lee ,  Tae-Sik Kim ,  Hwal Choi

IPC: G02F1/136

CPC classification number: G09G3/3677 ,  G02F1/134309 ,  G02F1/136286 ,  G09G3/3614 ,  G09G2300/0426 ,  G09G2310/0218 ,  G09G2310/0286

Abstract: A liquid crystal display device is disclosed which, according to one aspect, includes first and second substrates facing each other and a liquid crystal layer interposed between the first and second substrates. The first substrate includes a plurality of first pixels arranged in a first pixel column and a plurality of second pixels arranged in a second pixel column. The first pixels and the second pixels are connected to different ones of a plurality of gate lines and connected to any one of a plurality of data lines.

Abstract translation: 公开了一种液晶显示装置，其根据一个方面包括彼此面对的第一和第二基板以及介于第一和第二基板之间的液晶层。 第一基板包括布置在第一像素列中的多个第一像素和布置在第二像素列中的多个第二像素。 第一像素和第二像素连接到多条栅极线中的不同的栅极线并连接到多条数据线中的任何一条。

公开(公告)号：US08439719B2

公开(公告)日：2013-05-14

申请号：US12801685

申请日：2010-06-21

Applicant: Woo-Suk Jung ,  Soon-Ryong Park ,  Sa-Bang Um ,  Duk-Jin Lee ,  Jae-Yong Kim

Inventor： Woo-Suk Jung ,  Soon-Ryong Park ,  Sa-Bang Um ,  Duk-Jin Lee ,  Jae-Yong Kim

IPC: H01J9/26

CPC classification number: H01L51/5246 ,  H01L2251/566

Abstract: In a method of encapsulating an organic light emitting display device, when a lower substrate and a encapsulating substrate are encapsulated, the encapsulating process can be simplified since a sealant coating process can be performed without a mask aligning process, thereby reducing manufacturing cost. The method comprises the steps of: preparing an encapsulating substrate for encapsulating a lower substrate on which a display unit, which includes the organic light emitting display device, is formed; forming a black mask on a region of the encapsulating substrate, which is not a sealant region, corresponding to outer regions of the display unit; and forming a sealant on the sealant region.

Abstract translation: 在封装有机发光显示装置的方法中，当封装下基板和封装基板时，可以简化封装工艺，因为可以在没有掩模对准工艺的情况下执行密封剂涂布工艺，从而降低制造成本。 该方法包括以下步骤：制备用于封装其中形成有包括有机发光显示装置的显示单元的下基板的封装基板; 在与显示单元的外部区域对应的不是密封剂区域的封装基板的区域上形成黑色掩模; 并在密封剂区域上形成密封剂。

公开(公告)号：US20130113111A1

公开(公告)日：2013-05-09

申请号：US13602101

申请日：2012-09-01

Applicant: Young Jin LEE

Inventor： Young Jin LEE

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76883 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76843 ,  H01L23/5222 ,  H01L23/5226 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device and methods directed toward preventing a leakage current between a contact plug and a line adjacent to the contact plug, and minimizing capacitance between adjacent lines.

Abstract translation: 一种半导体器件和方法，旨在防止接触插塞和与接触插塞相邻的线路之间的漏电流，并使相邻线路之间的电容最小化。

公开(公告)号：US08434251B2

公开(公告)日：2013-05-07

申请号：US12951343

申请日：2010-11-22

Applicant: Dong Jin Lee ,  Sang Hak Kim ,  Hyun Jun Jung ,  Jin Jung

Inventor： Dong Jin Lee ,  Sang Hak Kim ,  Hyun Jun Jung ,  Jin Jung

IPC: A47G1/06

CPC classification number: H05K5/02 ,  G02F2001/133325 ,  G02F2201/46 ,  Y10T292/0894 ,  Y10T292/0895

Abstract: Disclosed is a display apparatus including a first case and a second case coupled to each other to define an external appearance of the display apparatus. A fastening guide extends from an inner surface of the first case, and a fastening member is engaged with the fastening guide. The fastening member is provided with a boss portion for screw-fastening. The first case and second case are coupled to each other using the fastening guide and fastening member having a thin thickness, whereby a reduced thickness of fastening parts and stable inter-coupling of the first case and second case are accomplished.

Abstract translation: 公开了一种显示装置，包括彼此耦合以限定显示装置的外观的第一壳体和第二壳体。 紧固引导件从第一壳体的内表面延伸，并且紧固构件与紧固引导件接合。 紧固构件设置有用于螺纹紧固的凸台部。 第一壳体和第二壳体使用具有薄的厚度的紧固引导件和紧固构件彼此联接，从而实现第一壳体和第二壳体的紧固部件的减小的厚度和稳定的互连。

公开(公告)号：US20130105851A1

公开(公告)日：2013-05-02

申请号：US13340867

申请日：2011-12-30

Applicant: Byoung Sung KIM ,  Sang Eun LIM ,  Jae Jin LEE ,  Yeoun Chul SON

Inventor： Byoung Sung KIM ,  Sang Eun LIM ,  Jae Jin LEE ,  Yeoun Chul SON

IPC: H01L33/62

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H05K1/0268 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/09427 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00014

Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.

Abstract translation: 本发明的示例性实施例提供一种包括发光二极管芯片的发光二极管封装，其上布置有发光二极管芯片的芯片区域的引线框架和支撑引线框架的封装体。 引线框架包括布置在芯片区域的第一侧的第一端子组和布置在芯片区域的第二侧的第二端子组。 第一端子组和第二端子组各自包括第一端子和第二端子，并且在第一端子组和第二端子组中的至少一个中，第一端子连接到芯片区域，并且第二端子被分离 从芯片区域。 第一端子具有第一宽度，第二端子具有第二宽度，并且第一宽度不同于第二宽度。

公开(公告)号：US08433293B2

公开(公告)日：2013-04-30

申请号：US12447886

申请日：2007-11-08

Applicant: Ho-Jin Lee

Inventor： Ho-Jin Lee

IPC: H04L12/58

CPC classification number: H04L67/26 ,  H04L67/04 ,  H04L69/16 ,  H04L69/162 ,  H04L69/164

Abstract: The present invention relates to an apparatus and method of providing a content push service, a mobile terminal, and a method of operating a mobile terminal. According to an exemplary embodiment of the present invention, a user datagram protocol (UDP) port is set between the mobile terminal and a content push service providing server. In addition, the mobile terminal drives an application that receives the content push service through the set user datagram protocol (UDP) port, by the request of the content push service providing server. The mobile terminal receives the content push service from the content push service providing server through the driven application. Accordingly, it is not necessary to select a specific identifier for each of existing applications and recognize a specific identifier for each node of the mobile communication network.

Abstract translation: 本发明涉及提供内容推送服务，移动终端和操作移动终端的方法的装置和方法。 根据本发明的示例性实施例，在移动终端和内容推送服务提供服务器之间设置用户数据报协议（UDP）端口。 此外，通过内容推送服务提供服务器的请求，移动终端通过设置的用户数据报协议（UDP）端口来驱动接收内容推送服务的应用。 移动终端通过驱动应用从内容推送服务提供服务器接收内容推送服务。 因此，不需要为每个现有应用选择特定的标识符并且识别移动通信网络的每个节点的特定标识符。

公开(公告)号：US20130099752A1

公开(公告)日：2013-04-25

申请号：US13494516

申请日：2012-06-12

Applicant: Yoon Cheol Jeon ,  Hae Kyu Lim ,  Yong Jin Lee

Inventor： Yoon Cheol Jeon ,  Hae Kyu Lim ,  Yong Jin Lee

IPC: H02J7/00

CPC classification number: H01M2/1077 ,  H01M10/425 ,  H01M10/482

Abstract: Disclosed is a system for protecting a BMS from electromagnetic waves, and more particularly, to a system for protecting a BMS from electromagnetic waves to prevent voltage sensing errors due to the electromagnetic waves generated by current from a battery cell. The system includes: a battery having a plurality of battery cells; a power relay assembly intermittently charging and discharging the battery; a battery management system (BMS) connected to the battery cell via a voltage sensing wire to predict a battery's SOC; and a housing surrounding the battery and the power relay assembly with one side of the outside of the housing having a separate section for therein for receiving the BMS so as to partition the BMS and the battery in different spaces.

Abstract translation: 公开了一种用于保护BMS免受电磁波的系统，更具体地说，涉及一种用于保护BMS免受电磁波的系统，以防止由于来自电池单元的电流产生的电磁波引起的电压感测误差。 该系统包括：具有多个电池单元的电池; 电力继电器组件间歇地对电池充电和放电; 电池管理系统（BMS），经由电压检测线连接到电池单元以预测电池的SOC; 以及围绕电池和电力继电器组件的壳体，壳体的外侧的一侧具有用于其中的用于接收BMS的单独部分，以便在不同空间中分隔BMS和电池。