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公开(公告)号：US09973860B2
公开(公告)日：2018-05-15
申请号：US15090947
申请日：2016-04-05
Applicant: Infineon Technologies AG
Inventor： Ulf Bartl , Alfons Dehe
CPC classification number: H04R23/008 , B81C1/00158 , G02B5/1814 , G02B27/4233 , H04R7/18 , H04R23/00 , H04R31/003 , H04R2201/003 , H04R2207/021 , H04R2307/207
Abstract: According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in a first plane, a reflection structure including second reflective elements and configured to deflect with respect to the diffraction structure, and an optical element configured to direct a first optical signal at the diffraction structure and the reflection structure and to receive a second optical signal from the diffraction structure and the reflection structure. The second reflective elements are arranged in the first plane when the reflection structure is at rest. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.
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公开(公告)号：US20170289703A1
公开(公告)日：2017-10-05
申请号：US15090947
申请日：2016-04-05
Applicant: Infineon Technologies AG
Inventor： Ulf Bartl , Alfons Dehe
CPC classification number: H04R23/008 , B81C1/00158 , G02B5/1814 , G02B27/4233 , H04R7/18 , H04R23/00 , H04R31/003 , H04R2201/003 , H04R2207/021 , H04R2307/207
Abstract: According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in a first plane, a reflection structure including second reflective elements and configured to deflect with respect to the diffraction structure, and an optical element configured to direct a first optical signal at the diffraction structure and the reflection structure and to receive a second optical signal from the diffraction structure and the reflection structure. The second reflective elements are arranged in the first plane when the reflection structure is at rest. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.
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公开(公告)号：US20170284951A1
公开(公告)日：2017-10-05
申请号：US15086573
申请日：2016-03-31
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Daniel Lugauer , Dominic Maier , Alfons Dehe
IPC: G01N27/02 , H01L21/56 , H01L23/538 , H05K1/18 , H01L23/31
CPC classification number: H01L23/315 , G01N27/028 , G01N27/128 , G01N33/0036 , H01L21/185 , H01L21/187 , H01L21/2007 , H01L21/561 , H01L21/568 , H01L21/7624 , H01L23/053 , H01L23/057 , H01L23/291 , H01L23/295 , H01L23/296 , H01L23/31 , H01L23/3107 , H01L23/3128 , H01L23/5386 , H01L24/19 , H01L24/24 , H01L24/96 , H01L33/0079 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/73267 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/1815 , H01L2924/18162 , H01L2924/3025 , H05K1/181
Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
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公开(公告)号：US09728653B2
公开(公告)日：2017-08-08
申请号：US13947823
申请日：2013-07-22
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Mohsin Nawaz
IPC: H04R25/00 , H01L29/84 , H01L21/306 , H04R19/00 , B81B3/00
CPC classification number: H01L29/84 , B81B3/0021 , B81B2201/0257 , B81B2203/0136 , B81B2203/053 , H01L21/30604 , H04R19/005 , H04R2201/003
Abstract: A MEMS device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the first plurality of fingers of the membrane. A deflector is configured to deflect the membrane such that the first and second plurality of fingers are displaced in a position excluding maximum overlapping of surfaces of the fingers.
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公开(公告)号：US20170217765A1
公开(公告)日：2017-08-03
申请号：US15492193
申请日：2017-04-20
Applicant: Infineon Technologies AG
Inventor： Vijaye Kumar Rajaraman , Yonsuang Arnanthigo , Alfons Dehe , Stefan Kolb
CPC classification number: B81B7/02 , B81B3/0018 , B81B2201/0214 , B81B2201/0257 , B81B2201/0278 , B81C1/00166 , B81C1/00182 , B81C1/00206 , G01N27/223 , H04R19/005 , H04R19/04 , H04R31/003 , H04R2201/003
Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a substrate with a first cavity that passes through the substrate from a backside of the substrate. The MEMS transducer also includes a perforated first electrode plate overlying the first cavity on a topside of the substrate, a second electrode plate overlying the first cavity on the topside of the substrate and spaced apart from the perforated first electrode plate by a spacing region, and a gas sensitive material in the spacing region between the perforated first electrode plate and the second electrode plate. The gas sensitive material has an electrical property that is dependent on a concentration of a target gas.
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Patent Agency Ranking
公开(公告)号：US09708180B2
公开(公告)日：2017-07-18
申请号：US14684700
申请日：2015-04-13
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe
CPC classification number: B81C1/00325 , B81B3/0072 , B81B2201/0257 , B81C1/00158 , B81C1/00182 , B81C2201/013 , B81C2201/0159 , B81C2201/0198
Abstract: A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer.
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公开(公告)号：US20170201192A1
公开(公告)日：2017-07-13
申请号：US14992615
申请日：2016-01-11
Applicant: Infineon Technologies AG
Inventor： David Tumpold , Alfons Dehe , Christoph Glacer
CPC classification number: H02N1/006 , H01L41/081 , H01L41/0973 , H04R7/06 , H04R17/00 , H04R17/02 , H04R19/005 , H04R2201/003
Abstract: According to an embodiment, a microelectromechanical systems MEMS transducer includes a deflectable membrane attached to a support structure, an acoustic valve structure configured to cause the deflectable membrane to be acoustically transparent in a first mode and acoustically visible in a second mode, and an actuating mechanism coupled to the deflectable membrane. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.
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公开(公告)号：US09670059B2
公开(公告)日：2017-06-06
申请号：US15077925
申请日：2016-03-23
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Roland Helm
CPC classification number: B81B7/04 , B81B7/0041 , B81B2201/0257 , B81B2201/0264 , G01L1/14 , G01L9/0041 , G01L9/0042 , G01L9/0072 , G01L9/0073 , G01L13/025 , H04R19/005 , H04R23/00 , H04R2201/003
Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
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公开(公告)号：US09668056B2
公开(公告)日：2017-05-30
申请号：US13975954
申请日：2013-08-26
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stefan Barzen , Marc Fueldner
CPC classification number: H04R19/04 , H04R7/00 , H04R19/005 , H04R31/00 , H04R31/003 , H04R31/006 , Y10T29/49005
Abstract: A sound transducer structure includes a membrane, a counter electrode, and a plurality of elevations. The membrane includes a first main surface, made of a membrane material, in a sound transducing region and an edge region of the membrane. The counter electrode is made of counter electrode material, and includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. The plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume.
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公开(公告)号：US09628886B2
公开(公告)日：2017-04-18
申请号：US14275337
申请日：2014-05-12
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stefan Barzen
CPC classification number: H04R31/003 , B81B3/0021 , B81B3/0086 , B81B2201/0221 , B81B2201/0257 , B81B2203/0127 , B81B2203/04 , B81C1/00158 , B81C2201/013 , H04R1/08 , H04R19/005 , H04R31/006 , H04R2201/003
Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.
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