Abstract:
A photodiode includes at least one central pad arranged on a light-receiving surface of a photodiode semiconductor substrate. The pad is made of a first material and includes lateral sidewalls surrounded by a spacer made of a second material having a different optical index than the first material. The lateral dimensions of the pad are smaller than an operating wavelength of the photodiode. Both the first and second materials are transparent to that operating wavelength. The pads and spacers are formed at a same time gate electrodes and sidewall spacers of MOS transistors are formed.
Abstract:
A device for converting heat energy into electrical energy including cells, the cells including: a first cavity with one wall for contacting a heat source; a second cavity with one wall for contacting a cold source; a primary channel between the first cavity and the second cavity transporting a fluid as liquid drops, the primary channel providing transport of liquid fluid drops from the second cavity to the first cavity; at least one secondary channel between the first cavity and the second cavity transporting the fluid as a gas; a piezoelectric material provided in one of the cavities; and a fluid as a liquid and gas contained within the cell.
Abstract:
A color image sensor including an array of pixels is formed in a semiconductor layer having a back side that receives an illumination. Insulated conductive walls penetrate into the semiconductor layer from the back side and separate the pixels from one another. For each pixel, a color pixel penetrates into from 5 to 30% of a thickness of the semiconductor layer from the back side and occupies at least 90% of the surface area delimited by the walls. An electrically-conductive layer extends from the lateral wall of the filter all the way to the walls.
Abstract:
A method for forming a transistor includes defining agate structure on a top surface of a first semiconductor layer of a silicon-on-insulator (SOI) substrate. The gate structure includes an insulating cover. A second semiconductor layer is then conformally deposited. The deposited second semiconductor layer includes an epitaxial portion on surfaces of the first semiconductor layer and an amorphous portion on surfaces of the insulating cover. The amorphous portion is then removed using a selective etch. The remaining epitaxial portion forms faceted raised source-drain structures on either side of the transistor gate structure. A slope of the sloped surface for the facet is dependent on the process parameters used during the conformal deposition.
Abstract:
A method for making a silicon layer extending on an insulation layer, including the steps of forming a silicon-germanium layer on at least a portion of a silicon wafer; transforming portions of the silicon-germanium layer into porous silicon pads; growing a monocrystalline silicon layer on the silicon-germanium layer and on the porous silicon pads; removing the silicon-germanium layer; oxidizing the porous silicon pads; and depositing an insulation material on the silicon layer.
Abstract:
A transformer of the balanced-unbalanced type includes a primary inductive circuit and a secondary inductive circuit housed inside an additional inductive winding connected in parallel to the terminals of the secondary circuit and inductively coupled with the primary circuit and the secondary circuit.
Abstract:
An electro-optical phase shifter to be located in an optical waveguide may include a rib of a semiconductor material extending along a length of the optical waveguide and a control structure configured to modify a concentration of carriers in the rib according to a control voltage present between first and second control terminals of the phase shifter. The control structure may include a conductive layer covering a portion of the rib and electrically connected to a first of the control terminals. An insulating layer may be configured to electrically isolate the conductive layer from the rib.
Abstract:
A structure of insulation between photodiodes formed in a doped semiconductor layer of a first conductivity type extending on a doped semiconductor substrate of the second conductivity type, the insulating structure including a trench crossing the semiconductor layer, the trench walls being coated with an insulating layer, the trench being filled with a conductive material and being surrounded with a P-doped area, more heavily doped than the semiconductor layer.
Abstract:
The production of spacers at flanks of a transistor gate, including a step of forming a dielectric layer covering the gate and a peripheral region of a layer of semiconductor material surrounding the gate, including forming a superficial layer covering the gate and the peripheral region; partially removing the superficial layer configured so as to completely remove the superficial layer at the peripheral region while preserving a residual part of the superficial layer at the flanks; and selective etching of the dielectric layer vis-à-vis the material of the residual part of the superficial layer and vis-à-vis the semiconductor material.
Abstract:
A method includes making a gate stack on the surface of an active zone, including depositing a first dielectric layer; depositing a gate conductive layer; depositing a first metal layer; depositing a second metal layer; depositing a second dielectric layer; partially etching the gate stack for the formation of a gate zone on the active zone; making insulating spacers on either side of the gate zone on the active zone; making source and drain electrodes zones; making silicidation zones on the surface of the source and drain zones; etching, in the gate zone on the active zone, the second dielectric layer and the second metal layer with stopping on the first metal layer, so as to form a cavity between the insulating spacers; making a protective plug at the surface of the first metal layer of the gate zone on the active zone, where the protective plug fills the cavity.