公开(公告)号：US20080299394A1

公开(公告)日：2008-12-04

申请号：US12191710

申请日：2008-08-14

Applicant: Sanyogita Arora ,  Gerard R. Minogue

Inventor： Sanyogita Arora ,  Gerard R. Minogue

IPC: B32B15/04

CPC classification number: B22F1/0062 ,  B22F1/0059 ,  B22F2998/00 ,  B23K35/34 ,  H05K3/3484 ,  H05K2201/0224 ,  H05K2203/0425 ,  H05K2203/105 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract translation: 一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。 该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动 。 用于静电或电动沉积过程的静电和电动移动颗粒。 颗粒包括涂层介质和颗粒体上的电荷导向器。

公开(公告)号：US20070277909A1

公开(公告)日：2007-12-06

申请号：US11660552

申请日：2005-09-06

Applicant: Norihito Tsukahara ,  Kazuhiro Nishikawa

Inventor： Norihito Tsukahara ,  Kazuhiro Nishikawa

IPC: B23K35/34

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3613 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/0224 ,  H05K2203/111

Abstract: This invention provides such solder paste that prevents, when a minute-size passive component or a semiconductor integrated circuit element having a small terminal pitch is soldered by the solder paste, the solder particles from being oxidized to provide highly-reliable solder joint even when the solder paste is used in a very small amount. Specifically, solder paste obtained by mixing solder alloy powders with flux is structured so that the flux has, at a pre-heating temperature in a heating/melting step, a high temperature retention property by which the flux covers the surface of the solder alloy powders.

Abstract translation: 本发明提供了这样一种焊锡膏，当通过焊膏焊接具有小端子间距的微小的无源部件或半导体集成电路元件时，即使当焊料粒子被 焊膏的使用量很少。 特别地，通过将​​焊剂合金粉末与焊剂混合而获得的焊膏被构造成使得焊剂在加热/熔融步骤中的预热温度下具有保持焊剂覆盖焊料合金粉末表面的高温保持性能 。

公开(公告)号：US20070030433A1

公开(公告)日：2007-02-08

申请号：US11462112

申请日：2006-08-03

Applicant: Kiyofumi Kudo ,  Futoshi Nakanishi

Inventor： Kiyofumi Kudo ,  Futoshi Nakanishi

IPC: G02F1/1345

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13016 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/361 ,  H05K2201/0224 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A liquid crystal display (LCD) device includes a LCD panel and a flexible wiring member coupled together by an anisotropic-conductive adhesive film (ACF). The ACF includes insulating resin and a plurality of conductive particles dispersed therein and each having an insulating film on a conductive body. The insulating film is broken by the thermal compression of the ACF during manufacture of the LCD device, thereby allowing terminals of the LCD panel and terminals of the flexible wiring member to be electrically coupled together.

Abstract translation: 液晶显示器（LCD）装置包括LCD面板和通过各向异性导电粘合膜（ACF）连接在一起的柔性布线构件。 ACF包括绝缘树脂和分散在其中的多个导电颗粒，并且每个在导电体上具有绝缘膜。 在LCD装置的制造过程中，ACF的热压缩使绝缘膜断裂，从而使LCD面板的端子和柔性布线构件的端子电连接在一起。

公开(公告)号：US20060263581A1

公开(公告)日：2006-11-23

申请号：US11429390

申请日：2006-05-05

Applicant: Jin Park ,  Jung Jun ,  Tae Bae ,  Jae Lee

Inventor： Jin Park ,  Jung Jun ,  Tae Bae ,  Jae Lee

IPC: B32B7/02 ,  B32B5/16 ,  H01B1/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/24942 ,  Y10T428/25

Abstract: The insulated conductive particles of the present invention comprise a resin core 41 having an average particle size of 1 to 10 μm, a Ni layer 42 coated on the surface of the resin core with a thickness of 0.01-0.1 μm, an Au layer 43 coated on the Ni layer with a thickness of 0.03-0.3 μm, and an inorganic insulating layer 44 coated on the Au layer with a thickness of 0.05-1 μm. An anisotropic conductive film of the present invention comprises the insulated conductive particles in the number of 10,000-80,000 per square millimeter (mm2).

Abstract translation: 本发明的绝缘导电性粒子包括平均粒径为1〜10μm的树脂芯41，涂覆在树脂芯的表面上的厚度为0.01〜0.1μm的Ni层42，涂覆有Au层43 在厚度为0.03-0.3μm的Ni层上，以及涂覆在Au层上的厚度为0.05-1μm的无机绝缘层44。 本发明的各向异性导电膜包括10000-80,000 /平方毫米（mm 2）的绝缘导电颗粒。

公开(公告)号：US07132922B2

公开(公告)日：2006-11-07

申请号：US10746020

申请日：2003-12-23

Applicant: Edwin James Harris ,  Tushar Vyas ,  Stephen J. Whitney

Inventor： Edwin James Harris ,  Tushar Vyas ,  Stephen J. Whitney

IPC: H01C7/10

CPC classification number: H01L23/62 ,  H01C17/06513 ,  H01C17/06553 ,  H01C17/0656 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2201/0738 ,  H01L2924/00

Abstract: A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.

Abstract translation: 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂，因此VVM是可自我修复的，并且可以在使用前干燥的可涂抹形式使用。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂，因此VVM可以直接应用于许多不同类型的基材，例如刚性（FR-4）层压材料，聚酰亚胺或聚合物。 VVM也可以直接应用于放置在设备内部的不同类型的基板。 在一个实施例中，VVM包括具有芯的掺杂的半导体颗粒，其可以是硅，以及可以是氧化物的惰性涂层。 颗粒在粘合剂中与导电颗粒混合。

公开(公告)号：US07128847B2

公开(公告)日：2006-10-31

申请号：US10617117

申请日：2003-07-10

Applicant: Michael Robert Samuels ,  Michael Joseph Molitor

Inventor： Michael Robert Samuels ,  Michael Joseph Molitor

IPC: C09K19/52 ,  C09K19/38 ,  H01R13/648 ,  C08J5/08

CPC classification number: C09K19/52 ,  C09K19/00 ,  C09K19/38 ,  C09K19/542 ,  H01B3/305 ,  H01B3/445 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0224 ,  H05K2201/0254

Abstract: Disclosed are liquid crystalline polymer compositions, which are melt moldable, and which contain a perfluorinated polymer, and a particulate aramid, and optionally contain hollow glass or quartz spheres, and which usually have low dielectric constants. They are particularly useful as electrical connectors and substrates for other electronic applications which use high frequency signals.

Abstract translation: 公开了液态聚合物组合物，其是可熔融模塑的，并且其含有全氟化聚合物和芳族聚酰胺颗粒，并且任选地包含中空玻璃或石英球，并且通常具有低介电常数。 它们特别适用于使用高频信号的其他电子应用的电连接器和基板。

公开(公告)号：US20060240259A1

公开(公告)日：2006-10-26

申请号：US11407401

申请日：2006-04-19

Applicant: Naoyuki Toyoda ,  Toshiyuki Miyabayashi

Inventor： Naoyuki Toyoda ,  Toshiyuki Miyabayashi

IPC: B32B1/00 ,  B05D7/00

CPC classification number: H05K1/097 ,  B22F1/0059 ,  C09D11/30 ,  H05K3/125 ,  H05K2201/0224 ,  H05K2203/013 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A microencapsulated particulate metal material includes metal particles, a polymer coating the metal particles, and an ionic group provided on a surface of the polymer.

Abstract translation: 微胶囊化颗粒状金属材料包括金属颗粒，涂覆金属颗粒的聚合物和设置在聚合物表面上的离子基团。

公开(公告)号：US20060222889A1

公开(公告)日：2006-10-05

申请号：US11390663

申请日：2006-03-28

Applicant: Yoshihiro Kobayashi ,  Kiyoshi Itoh

Inventor： Yoshihiro Kobayashi ,  Kiyoshi Itoh

IPC: B32B27/08

CPC classification number: H01L51/0021 ,  G03F7/0047 ,  H01L27/3239 ,  H01L51/0015 ,  H01L51/5048 ,  H01L51/5088 ,  H05K1/092 ,  H05K3/105 ,  H05K2201/0224 ,  H05K2203/1142 ,  Y10T428/2991 ,  Y10T428/31928

Abstract: The main object of the present invention is to provide a conductive pattern formed body with a conductive pattern formed efficiently and highly precisely in a simple process, a conductivity variable laminated body used for formation of the conductive pattern, and the like. To attain the object, the invention provides a conductivity variable composition characterized by containing insulating particle including a conductive inorganic material and an organic material adhered on the circumference of the conductive inorganic material, and a photocatalyst.

Abstract translation: 本发明的主要目的是提供一种具有导电图案的导电图案形成体，该导电图案以简单的方法有效且高度精确地形成，用于形成导电图案的导电率可变叠层体等。 为了达到上述目的，本发明提供一种电导率可变组合物，其特征在于，含有包含导电性无机材料和附着在导电性无机材料的周围的有机材料的绝缘性粒子和光催化剂。

公开(公告)号：US20060154070A1

公开(公告)日：2006-07-13

申请号：US10489406

申请日：2002-09-17

Applicant: Takeshi Wakiya ,  Yoshikazu Yoneda ,  Masako Ueba

Inventor： Takeshi Wakiya ,  Yoshikazu Yoneda ,  Masako Ueba

IPC: B32B5/16

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

Abstract: An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure. A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

Abstract translation: 本发明的目的是提供具有优异连接可靠性的涂覆导电颗粒，这种涂覆导电颗粒的制造方法，各向异性导电材料和导电连接结构。 包括具有由导电金属制成的表面的颗粒和绝缘颗粒的涂覆的导电颗粒，以将具有由导电金属制成的表面的颗粒的表面涂覆在其上，其中绝缘颗粒化学键合到具有由 导电金属经由具有与导电金属的接合特性的官能团（A），从而形成单个涂层。

公开(公告)号：US20050171273A1

公开(公告)日：2005-08-04

申请号：US11034984

申请日：2005-01-14

Applicant: Eadaoin Ledwidge ,  Harry Woolfson

Inventor： Eadaoin Ledwidge ,  Harry Woolfson

IPC: C08J3/00 ,  C09J4/00 ,  C09J4/04 ,  C09J9/02 ,  H05K3/32 ,  H05K13/04

CPC classification number: C09J4/00 ,  H05K3/323 ,  H05K2201/0224

Abstract: A curable composition for forming anisotropically conductive bonds comprising: (i) an amount of first substantially uncured curable component; (ii) conductive particles coated with a substantially uniformly thick coating of the cure product of a second curable component dispersed within the first curable cyanoacrylate component. The composition is suitable for use as an adhesive composition for bonding chips to electronic circuits. Desirably the first component and the second component are both cyanoacrylates.

Abstract translation: 一种用于形成各向异性导电键的可固化组合物，包括：（i）第一基本上未固化的可固化组分的量; （ii）涂覆有分散在第一可固化氰基丙烯酸酯组分内的第二可固化组分的固化产物的基本上均匀厚的涂层的导电颗粒。 该组合物适用于将芯片接合到电子电路的粘合剂组合物。 理想地，第一组分和第二组分都是氰基丙烯酸酯。