公开(公告)号：US20150249059A1

公开(公告)日：2015-09-03

申请号：US14430173

申请日：2013-09-23

Applicant: STORA ENSO OYJ

Inventor： Juha Maijala

IPC: H01L23/66 ,  H01L23/58 ,  H01L23/00 ,  H01L23/64

CPC classification number: H01L23/66 ,  A61J1/035 ,  A61J2200/30 ,  A61J2205/60 ,  B65D25/00 ,  B65D2203/10 ,  H01L23/4985 ,  H01L23/564 ,  H01L23/585 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0239 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0292 ,  H05K1/111 ,  H05K1/165 ,  H05K3/0052 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09954 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

Abstract translation: 包装体包括主体和由所述主体支撑的导电图案。 接口部分被配置为将模块接收到具有包装的可移除附件。 所述导电图案至少部分地在所述接口部分内包括构成无线耦合装置的一半的无线耦合图案。

公开(公告)号：US09119314B2

公开(公告)日：2015-08-25

申请号：US13483522

申请日：2012-05-30

Applicant: Rohit Krishna Koppal ,  Martin Earl Holman, IV ,  Patrick Yves Mas ,  Douglas Wayne Moskowitz

Inventor： Rohit Krishna Koppal ,  Martin Earl Holman, IV ,  Patrick Yves Mas ,  Douglas Wayne Moskowitz

IPC: H05K1/00 ,  G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/36 ,  H05K7/14 ,  H01R12/79 ,  H04M1/02

CPC classification number: H05K1/147 ,  H01R12/79 ,  H04M1/0252 ,  H04M1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K1/189 ,  H05K3/36 ,  H05K3/365 ,  H05K7/1402 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1031 ,  H05K2201/2009 ,  Y02P70/611 ,  Y10T29/49124

Abstract: A flexible printed circuit connector structure and assembly method. A panel with a back side that is parallel to a first plane and a flexible printed circuit backer that has a base and a backing structure. The base is attached to the back side of the panel. The backing structure depends from the base and extends along a second plane that forms an angle with the first plane. A first flexible circuit side of the flexible printed circuit is attached to a first side and an opposite second side of the backing structure. The flexible printed circuit has exposed conductors on a second flexible circuit side that is opposite the first flexible circuit side.

Abstract translation: 柔性印刷电路连接器结构及组装方法。 具有平行于第一平面的背面的面板和具有底座和背衬结构的柔性印刷电路支架。 基座连接到面板的背面。 背衬结构从底部延伸并且沿着与第一平面成角度的第二平面延伸。 柔性印刷电路的第一柔性电路侧连接到背衬结构的第一侧和相对的第二侧。 柔性印刷电路在第二柔性电路侧具有与第一柔性电路侧相对的露出导体。

公开(公告)号：US09089050B2

公开(公告)日：2015-07-21

申请号：US13699883

申请日：2010-12-24

Applicant: Atsushi Kajiya

Inventor： Atsushi Kajiya

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0393 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/10106

Abstract: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 μm or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 μm or more.

Abstract translation: 本发明提供了一种具有散热层的柔性电路板，能够容易地实现弯曲加工，同时实现其减薄，并且可以保持散热层的平坦度。 柔性电路板至少具有适于电连接到电路元件，绝缘层2和散热层3b的布线层3a，其特征在于，所述布线层3a由铜 箔的拉伸强度为250MPa以下，厚度为50μm以下，所述散热层由拉伸强度为400MPa以上且厚度为70μm以上的铜箔形成。

公开(公告)号：US20150131290A1

公开(公告)日：2015-05-14

申请号：US14075081

申请日：2013-11-08

Applicant: Richard Speer ,  David Hamby ,  Ken Grossman

Inventor： Richard Speer ,  David Hamby ,  Ken Grossman

IPC: F21V15/01 ,  F21K99/00

CPC classification number: F21V15/012 ,  F21K9/90 ,  F21Y2101/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10106 ,  Y10T29/49124

Abstract: Techniques are disclosed for designing light fixtures for flexible LED circuit boards. The flexible LED circuit boards include an array of LED packages and the surface of the flexible circuit boards is highly reflective. A flexible LED circuit board may be shaped to conform to a rigid preform and the preform may be concave, convex, corrugated, or have any other custom shape. The shape of the preform, as well as the location of the LEDs within the flexible LED circuit may determine the light distribution of the light fixture. Alternatively, the lighting fixture may have multiple rods held in place with side plates and a flexible LED circuit board may be woven between the rods. A set of hole patterns in the side plates determine the location of the rods and the rods will determine the shape of the flexible LED circuit.

Abstract translation: 公开了用于设计柔性LED电路板的灯具的技术。 柔性LED电路板包括LED封装阵列，柔性电路板的表面是高反射性的。 柔性LED电路板可以被成形为符合刚性预制件，并且预成型件可以是凹形，凸形，波纹状或具有任何其它定制形状。 预制件的形状以及LED在柔性LED电路内的位置可以确定灯具的光分布。 或者，照明器具可以具有用侧板保持就位的多个杆，并且柔性LED电路板可以在杆之间编织。 侧板中的一组孔图案确定棒的位置，杆将确定柔性LED电路的形状。

公开(公告)号：US20150008017A1

公开(公告)日：2015-01-08

申请号：US14319648

申请日：2014-06-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Se Woong NA ,  Min Jae KIM ,  Hyun Gyu PARK ,  In Hee CHO ,  Man Hue CHOI ,  Seung Kwon HONG

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K3/0058 ,  H05K2201/056

Abstract: Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion.

Abstract translation: 提供一种印刷电路板，包括：支撑基板，包括第一区域和第二区域，所述第二区域从第一区域延伸以被弯曲; 在支撑基板上方的绝缘基板; 在所述第一区域和所述第二区域之间弯曲的弯曲部分; 以及在支撑基板和绝缘基板之间的粘合层，除了弯曲部分之外。

公开(公告)号：US08917250B2

公开(公告)日：2014-12-23

申请号：US13312138

申请日：2011-12-06

Applicant: Jae Hun Kim ,  Sang Su Hong ,  Chung Mo Yang ,  In Hyung Lee ,  Woo Jin Lee ,  Young Woo Lee

Inventor： Jae Hun Kim ,  Sang Su Hong ,  Chung Mo Yang ,  In Hyung Lee ,  Woo Jin Lee ,  Young Woo Lee

IPC: G06F3/041 ,  H05K1/02

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0289 ,  H05K2201/0108 ,  H05K2201/056

Abstract: Disclosed herein is a structure of an FPC integrated touch panel. According to preferred embodiments of the present invention, a transparent substrate configured of a flexible transparent film is provided and an extension part protruded to the transparent substrate is integrally formed with the transparent substrate, such that a separate FPC needs not to be manufactured, thereby saving process time and manufacturing costs. In addition, the exemplary embodiments of the present invention bend an inactive area unnecessarily occupying an area of the transparent substrate to a side of the touch panel, thereby implementing a touch panel widening a substantial area of an active region.

Abstract translation: 这里公开了FPC集成触摸面板的结构。 根据本发明的优选实施例，提供由柔性透明膜构成的透明基板，并且向透明基板突出的延伸部分与透明基板一体形成，使得不需要制造单独的FPC，从而节省 处理时间和制造成本。 此外，本发明的示例性实施例将不需要地占据透明基板的区域的非活性区域弯曲到触摸面板的一侧，从而实现扩大有源区域的实质区域的触摸面板。

公开(公告)号：US20140268595A1

公开(公告)日：2014-09-18

申请号：US14210073

申请日：2014-03-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Yong Eom ,  Dong-Sub Kim ,  Dong-Hui Kim ,  Mi-Sun Lee ,  Joon-Gyu Lee

IPC: H05K1/02 ,  H05K3/30 ,  H05K5/00

CPC classification number: H05K1/0281 ,  G02F1/133305 ,  G02F1/13452 ,  H05K1/028 ,  H05K3/30 ,  H05K5/0017 ,  H05K2201/056 ,  H05K2201/10128 ,  Y10T29/49128

Abstract: A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached to a rear surface of the display panel. When the flexible printed circuit board is flexed to be partially positioned on the rear surface of the display panel, the protection member is positioned between the display panel and the integrated circuit chip. The flexible display device prevents the integrated circuit chip stacked with the display panel from making direct contact with the display panel using the protection member. Thus, even if the display device is deformed into, for example, a flexed or rolled state, it is possible to prevent the display panel from being damaged.

Abstract translation: 柔性显示装置包括柔性显示面板，从显示面板延伸的柔性印刷电路板，安装在柔性印刷电路板的至少一个表面上并构造成驱动显示面板的集成电路芯片，以及 保护构件附接到显示面板的后表面。 当柔性印刷电路板弯曲以部分地位于显示面板的后表面上时，保护构件位于显示面板和集成电路芯片之间。 柔性显示装置防止与显示面板堆叠的集成电路芯片使用保护构件直接与显示面板接触。 因此，即使显示装置变形为例如弯曲或滚动状态，也可以防止显示面板被损坏。

公开(公告)号：US20140252400A1

公开(公告)日：2014-09-11

申请号：US13971845

申请日：2013-08-21

Applicant: Cheng-Yen Chen ,  Sheng-Yuan Sun ,  Chih-Ming Chen ,  Yi-Hao Huang ,  Kuan-Wen Chen

Inventor： Cheng-Yen Chen ,  Sheng-Yuan Sun ,  Chih-Ming Chen ,  Yi-Hao Huang ,  Kuan-Wen Chen

IPC: H01L33/48

CPC classification number: F21V19/0055 ,  F21V9/30 ,  F21V29/89 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/056 ,  H05K2201/10106

Abstract: A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier.

Abstract translation: 提供了包括载体，基板，至少一个电极对，至少一个发光二极管（LED）和至少一个定位元件的发光器件。 基板设置在载体上并具有主体部分和至少一个弯曲部分。 弯曲部分连接到主体部分。 弯曲部分不与主体部分共面。 电极对位于基板的主体部分上。 LED设置在基板的主体部分上并与电极对电连接。 定位元件设置在基板的弯曲部分上，用于将基板固定在载体上。

公开(公告)号：US08813347B2

公开(公告)日：2014-08-26

申请号：US13589220

申请日：2012-08-20

Applicant: Roland J. Menassa ,  Pamela R. Patterson ,  Geoffrey P. McKnight ,  Guillermo A. Herrera ,  Hung D. Nguyen ,  Douglas Martin Linn ,  Chris A. Ihrke

Inventor： Roland J. Menassa ,  Pamela R. Patterson ,  Geoffrey P. McKnight ,  Guillermo A. Herrera ,  Hung D. Nguyen ,  Douglas Martin Linn ,  Chris A. Ihrke

IPC: H01C17/28

CPC classification number: G01L1/22 ,  G01L5/009 ,  G01L5/226 ,  H05K1/0268 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10151 ,  H05K2203/163 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49103

Abstract: A method of manufacturing a load cell assembly and methods of folding a circuit device are disclosed. A flexible circuit body including a strip having at least one hinge is provided, with the strip being in a first position or an unfolded position. A plurality of strain gauges are attached to the strip, with the hinge disposed between the strain gauges. A jig is provided and the strip of the flexible circuit body is folded along the hinge utilizing the jig to define a second position or folded position of the strip.

Abstract translation: 公开了一种制造称重传感器组件的方法和折叠电路装置的方法。 提供一种柔性电路体，其包括具有至少一个铰链的条带，带材处于第一位置或展开位置。 多个应变计连接到条上，铰链位于应变计之间。 设置夹具，并且利用夹具将柔性电路体的条带沿着铰链折叠以限定条带的第二位置或折叠位置。

公开(公告)号：US08734000B2

公开(公告)日：2014-05-27

申请号：US13151356

申请日：2011-06-02

Applicant: Hsin-Chang Chiang ,  Chieh-Jen Cheng ,  Chien-Ting Liao

Inventor： Hsin-Chang Chiang ,  Chieh-Jen Cheng ,  Chien-Ting Liao

IPC: F21V7/04

CPC classification number: H05K1/147 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106

Abstract: A light module and an assembling method thereof are disclosed. The light module includes a first circuit board, a second circuit board, and a light source, wherein the first circuit board has a first opening and a second opening, and the second circuit board has a first bending portion. The light source is disposed on the first circuit board. The second circuit board passes through the first opening and the second opening of the first circuit board to form the first bending portion and the first circuit board and the second circuit board are fixed together to complete the light module assembling.

Abstract translation: 公开了一种光模块及其组装方法。 光模块包括第一电路板，第二电路板和光源，其中第一电路板具有第一开口和第二开口，并且第二电路板具有第一弯曲部分。 光源设置在第一电路板上。 第二电路板通过第一电路板的第一开口和第二开口以形成第一弯曲部分，并且第一电路板和第二电路板固定在一起以完成光模块组装。