公开(公告)号：US20100129532A1

公开(公告)日：2010-05-27

申请号：US12570040

申请日：2009-09-30

Applicant: YAO-WEN BAI ,  CHENG-HSIEN LIN

Inventor： YAO-WEN BAI ,  CHENG-HSIEN LIN

IPC: B05D5/12

CPC classification number: H05K3/105 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/44 ,  H05K2201/0347 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125

Abstract: A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.

Abstract translation: 在衬底上形成电迹线的方法包括以下步骤：提供衬底; 在基板上使用油墨印刷油墨图案，所述油墨包括含有银离子的水性介质和热敏还原剂; 加热油墨图案以将银离子还原成银颗粒，从而形成半成品痕迹; 并通过化学镀在半成品迹线上形成金属外涂层，从而获得图案化的电迹线。

公开(公告)号：US20100044237A1

公开(公告)日：2010-02-25

申请号：US12426276

申请日：2009-04-19

Applicant: CHUNG-JEN TSAI ,  YU-CHENG HUANG ,  HUNG-YI CHANG ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  YU-CHENG HUANG ,  HUNG-YI CHANG ,  CHENG-HSIEN LIN

IPC: C25D5/02 ,  C25D7/00

CPC classification number: H05K3/427 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/0346

Abstract: A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled.

Abstract translation: 涉及PCB的制造方法。 该方法包括向基板提供两个相对的导电层并限定穿过两个导电层的通孔; 使用无电镀工艺在所述通孔中的所述基板的内表面上形成第一导电金属层; 在所述第一导电金属层上使用电镀工艺形成第二导电金属层，直到所述通孔被填充。

公开(公告)号：US20090314739A1

公开(公告)日：2009-12-24

申请号：US12345896

申请日：2008-12-30

Applicant: CHIH-KANG YANG ,  WEN-CHIN LEE

Inventor： CHIH-KANG YANG ,  WEN-CHIN LEE

IPC: B44C1/22 ,  C23F1/08

CPC classification number: H05K3/0085 ,  H05K3/068 ,  H05K2203/0195 ,  H05K2203/075 ,  H05K2203/082 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/166

Abstract: An exemplary system for processing a workpiece comprises a conveyor, a first liquid spraying device, a second liquid spraying device, and a substrate positioning device. The conveyor is configured for conveying the workpiece along a conveying direction. The first and second liquid spraying devices for spraying liquid onto the workpiece transported on the conveyor face the conveyor and are arranged along the conveying direction. The substrate positioning device for reorienting the workpiece on the conveyor is installed between the first and second liquid spraying devices and faces the conveyor.

Abstract translation: 用于处理工件的示例性系统包括输送机，第一液体喷射装置，第二液体喷射装置和基板定位装置。 输送机构造成沿输送方向输送工件。 第一和第二液体喷射装置，用于将液体喷射到在输送机上传送的工件上，并且沿输送方向布置。 用于在输送机上重新定向工件的基板定位装置安装在第一和第二液体喷涂装置之间并面向输送机。

公开(公告)号：US20090260867A1

公开(公告)日：2009-10-22

申请号：US12332321

申请日：2008-12-10

Applicant: PAI-HUNG HUANG ,  CHIH-KANG YANG ,  CHENG-HSIEN LIN

Inventor： PAI-HUNG HUANG ,  CHIH-KANG YANG ,  CHENG-HSIEN LIN

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/0097 ,  H05K3/0082 ,  H05K3/064 ,  H05K2203/1554 ,  Y10T29/49162

Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

Abstract translation: 印刷电路板基板包括金属包覆基板和沿着假想圆布置在金属包覆基板上的多个N个间隔开的电路基板，N是大于2的自然数。电路基板绕等角度地布置在 圆圈和每个电路基板相对于相邻的印刷电路板定向成360度/ N度。

公开(公告)号：US07581312B2

公开(公告)日：2009-09-01

申请号：US11877585

申请日：2007-10-23

Applicant: Chih-Yi Tu ,  Cheng-Hsien Lin ,  Ming Wang

Inventor： Chih-Yi Tu ,  Cheng-Hsien Lin ,  Ming Wang

IPC: H05K3/20

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 制造多层FPCB的方法包括以下步骤：提供第一覆铜层压板，第二覆铜层压板和粘合剂层; 在粘合剂层上限定开口; 在所述第一覆铜层压板上限定第一狭缝; 层压第一覆铜层压板，粘合剂层和第二覆铜层压板; 限定用于在所述第一覆铜层压板和所述第二覆铜层压板之间建立电连接的通孔; 切割第一覆铜层压板，粘合剂层和第二覆铜层压板，从而形成在不同区域中具有不同层数的多层柔性印刷电路板。

公开(公告)号：US20090205855A1

公开(公告)日：2009-08-20

申请号：US12144260

申请日：2008-06-23

Applicant: YUNG-WEI LAI ,  CHENG-WEI KUO ,  SHING-TZA LIOU

Inventor： YUNG-WEI LAI ,  CHENG-WEI KUO ,  SHING-TZA LIOU

IPC: B32B27/34 ,  H05K1/00

CPC classification number: H05K3/0064 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/34 ,  B32B2250/42 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/546 ,  B32B2307/714 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721 ,  Y10T428/31725

Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.

Abstract translation: 用于柔性印刷柔性印刷电路板的加强片包括交替层叠的聚酰亚胺层和聚酰胺酰亚胺层，其中聚酰胺酰亚胺的分子结构由下式表示：其中Ar和Ar'表示不同的取代芳族基团。

公开(公告)号：US20090159317A1

公开(公告)日：2009-06-25

申请号：US12135873

申请日：2008-06-09

Applicant: QI ZHANG ,  YUNG-WEI LAI ,  SHING-TZA LIOU

Inventor： QI ZHANG ,  YUNG-WEI LAI ,  SHING-TZA LIOU

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.

Abstract translation: 提供了制造印刷电路板的示例性方法。 在该方法中，提供了具有在基板与第一表面相对的第一表面和第二表面的基板。 形成在第一表面和第二表面之间的衬底中的多个通孔。 将导电浆料施加到基材上以填充限定在基材中的通孔，以形成多个填充构件，并印刷在基板的第一表面和第二表面中的至少一个上以形成多个电迹线 。 位于衬底中的通孔中的填充构件和印刷在衬底上的电迹线被固化。

公开(公告)号：US20090107706A1

公开(公告)日：2009-04-30

申请号：US12135842

申请日：2008-06-09

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K2201/0382 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract translation: 多层印刷电路板包括第一印刷电路板，第二印刷电路板，粘合膜和功能层。 粘合膜夹在第一印刷电路板和第二印刷电路板之间。 功能层设置在第一印刷电路板和第二印刷电路板之间，用于阻止水从其中通过，并用于屏蔽第一印刷电路板和第二印刷电路板之间的电磁干扰。

公开(公告)号：US20090042370A1

公开(公告)日：2009-02-12

申请号：US12051687

申请日：2008-03-19

Applicant: YING SU ,  HU-HAI ZHANG ,  HUAN-LONG LIN

Inventor： YING SU ,  HU-HAI ZHANG ,  HUAN-LONG LIN

IPC: H01L21/304

CPC classification number: H05K3/0032 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0191 ,  H05K2203/1383

Abstract: The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cutt the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.

Abstract translation: 本发明涉及使用激光切割PCB模块的方法。 该方法包括以下步骤：提供覆盖膜，所述覆盖膜包括限定在其中的至少一个开口; 将所述覆盖膜附着到所述PCB模块上，使得所述PCB模块的通孔被所述覆盖膜覆盖，并且所述激光切割区域经由所述至少一个开口暴露; 将激光束施加到PCB模块的暴露的激光切割区域以切割PCB模块; 并移除覆盖膜。 可以获得PCB模块的高定位精度和更好的切割效果。

公开(公告)号：US20090035566A1

公开(公告)日：2009-02-05

申请号：US11964578

申请日：2007-12-26

Applicant: FENG-YAN HUANG ,  SHING-TZA LIOU

Inventor： FENG-YAN HUANG ,  SHING-TZA LIOU

IPC: B32B7/12

CPC classification number: H05K1/118 ,  C09J7/10 ,  C09J2201/40 ,  C09J2201/606 ,  C09J2433/00 ,  H05K3/0058 ,  H05K3/323 ,  H05K3/386 ,  H05K2201/0187 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/2009 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2857

Abstract: An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.

Abstract translation: 示例性粘合剂层包括粘合剂主体，其具有第一粘合剂表面和在粘合剂主体的与第一粘合剂表面相对的一侧上的第二粘合剂表面。 粘合剂主体在第一粘合剂表面和第二粘合剂表面之间限定多个通孔。 通孔填充有比粘合剂主体具有更高粘合力的内部粘合剂。 可以提高粘合剂主体的第一粘合剂表面和第二粘合剂表面的粘附性，从而防止具有粘合剂层的印刷电路板变形。