公开(公告)号：US10062543B2

公开(公告)日：2018-08-28

申请号：US15170881

申请日：2016-06-01

Applicant: KLA-Tencor Corporation

Inventor： Ajay Gupta ,  Thanh Huy Ha ,  Olivier Moreau ,  Kumar Raja

IPC: G06K9/00 ,  H01L21/76 ,  G01B11/00 ,  H01L23/544 ,  G06F19/00 ,  H01J37/22 ,  G03F7/20

CPC classification number: H01J37/222 ,  G03F7/70633 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/31798

Abstract: Methods and systems for determining overlay error between different patterned features of a design printed on a wafer in a multi-patterning step process are provided. For multi-patterning step designs, the design for a first patterning step is used as a reference and designs for each of the remaining patterning steps are synthetically shifted until the synthetically shifted designs have the best global alignment with the entire image based on global image-to-design alignment. The final synthetic shift of each design for each patterning step relative to the design for the first patterning step provides a measurement of relative overlay error between any two features printed on the wafer using multi-patterning technology.

公开(公告)号：US10062012B1

公开(公告)日：2018-08-28

申请号：US14885859

申请日：2015-10-16

Applicant: KLA-Tencor Corporation

Inventor： Allen Park ,  Michael Lennek

IPC: G06K9/00 ,  G06K9/62 ,  G06K9/46 ,  G06T7/00 ,  G06T7/60 ,  G06K9/52

CPC classification number: G06K9/6267 ,  G06K9/4604 ,  G06K9/52 ,  G06T7/0004 ,  G06T7/001 ,  G06T7/60 ,  G06T2207/30148

Abstract: Methods and systems for finding patterns in a design for a specimen are provided. One system includes one or more computer subsystems configured for searching for a target pattern in a design for a specimen to thereby find multiple instances of the target pattern in the design. The one or more computer subsystems are also configured for separating the multiple instances of the target pattern into different groups based on information for surrounding patterns within a predefined window around the target pattern such that each of the different groups corresponds to a different combination of the target pattern and the surrounding patterns.

公开(公告)号：US10012599B2

公开(公告)日：2018-07-03

申请号：US15088081

申请日：2016-03-31

Applicant: KLA-Tencor Corporation

Inventor： Keith Wells ,  Xiaochun Li ,  Lisheng Gao ,  Tao Luo ,  Markus Huber

IPC: G01N21/95 ,  G06T7/00 ,  H01L21/67 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N2201/061 ,  G01N2201/06113 ,  G01N2201/068 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

公开(公告)号：US09915622B2

公开(公告)日：2018-03-13

申请号：US14838194

申请日：2015-08-27

Applicant: KLA-Tencor Corporation

Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

公开(公告)号：US09891538B2

公开(公告)日：2018-02-13

申请号：US15067118

申请日：2016-03-10

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal

IPC: G01N21/95 ,  H01L21/67 ,  G03F7/20 ,  H01L21/66

CPC classification number: G03F7/7065 ,  H01L22/12 ,  H01L22/20

Abstract: Methods and systems for determining a process window for a process performed on a specimen are provided. In general, the embodiments preferentially sample locations in an instance of at least a portion of a device formed on a specimen at a value of a parameter of a process performed on the specimen that is closest to an edge of a determined process window for the process. If defects are detected at the sampled locations, then the sampling may be performed again but for a different instance of the device formed at a value of the parameter that is closer to nominal than the previously used value. When no defects are detected at the sampled locations, then the sampling may be ended, and the determined process window may be modified based on the value of the parameter corresponding to the instance of the device in which no defects were detected.

公开(公告)号：US09846930B2

公开(公告)日：2017-12-19

申请号：US15376486

申请日：2016-12-12

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  G01N21/88 ,  G01N21/956

CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

公开(公告)号：US09830421B2

公开(公告)日：2017-11-28

申请号：US14983452

申请日：2015-12-29

Applicant: KLA-Tencor Corporation

Inventor： Santosh Bhattacharyya ,  Bjorn Braeuer ,  Lisheng Gao

IPC: G06F17/50 ,  G03F7/20

CPC classification number: G06F17/5081 ,  G03F7/70616

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. One method includes selecting one or more alignment targets from a design for a specimen. At least a portion of the one or more alignment targets include built in targets included in the design for a purpose other than alignment of inspection results to design data space. At least the portion of the one or more alignment targets does not include one or more individual device features. One or more images for the alignment target(s) and output generated by the inspection subsystem at the position(s) of the alignment target(s) may then be used to determine design data space positions of other output generated by the inspection subsystem in a variety of ways described herein.

公开(公告)号：US09709510B2

公开(公告)日：2017-07-18

申请号：US14749564

申请日：2015-06-24

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Mikhail Haurylau ,  Junwei Wei ,  Dan Kapp ,  Robert Danen ,  Grace Chen

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8887 ,  G01N2201/0668

Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).

公开(公告)号：US09651943B2

公开(公告)日：2017-05-16

申请号：US13457383

申请日：2012-04-26

Applicant: Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

Inventor： Pavel Izikson ,  John Robinson ,  Mike Adel ,  Amir Widmann ,  Dongsub Choi ,  Anat Marchelli

IPC: H01L21/66 ,  G06F19/00 ,  G05B21/02 ,  G03F7/20

CPC classification number: G05B21/02 ,  G03F7/70508 ,  G03F7/70625 ,  G03F7/70633

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one tot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

公开(公告)号：US09552636B2

公开(公告)日：2017-01-24

申请号：US14811409

申请日：2015-07-28

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Lisheng Gao ,  Grace Hsiu-Ling Chen ,  David W. Shortt

IPC: G06K9/00 ,  G06T7/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/88 ,  G01N21/956

CPC classification number: G06T7/0008 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8822 ,  G01N2021/8848 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/34

Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.

Abstract translation: 提供了使用缺陷特定和多信道信息检测晶片上的缺陷的方法和系统。 一种方法包括获取晶片上目标的信息。 目标包括形成在晶片上的感兴趣模式（POI）和在POI附近或在POI中出现的已知感兴趣缺陷（DOI）。 该方法还包括通过基于由检查系统的第一通道获取的目标候选者的图像来识别潜在的DOI位置来检测目标候选中的已知DOI，并将一个或多个检测参数应用于由第二个所获取的潜在DOI位置的图像 检查系统通道。 因此，用于定位潜在DOI位置的图像和用于检测缺陷的图像可以不同。