摘要:
An escape guiding apparatus includes: a projecting section projecting an image on a floor by scanning a laser beam; a storage section storing escape guidance information for guiding a person who is escaping; and an image information generating section generating image information of the image to be projected based on the escape guidance information stored in the storage section.
摘要:
An actuator, includes: a weight part; a supporting part supporting the weight part; a connecting part coupling the weight part rotatable to the supporting part and having an elastic part; a driving member for driving and rotating the weight part; and a semiconductor circuit for driving the weight part. The driving member is operated to torsionally deform the elastic part and rotate the weight part. The elastic part has a first silicon part that is mainly made of silicon and a first resin part that is mainly made of resin and coupled to the first silicon part. The supporting part has at least a second silicon part made mainly of silicon and coupled to the first silicon part of the elastic part. The semiconductor circuit is provided on the second silicon part of the supporting part.
摘要:
When laminating two types of film (1, 2) with different melting points on the two sides of a metal sheet (3), the thickness of the low melting point side film (2) is adjusted. Specifically, the thickness d2 of the low melting point side film (2) at the part sandwiched between the lamination roll (10) and metal sheet (3) is made a range defined by d2≧k(ΔMP−ΔT)/V. Here, ΔMP is the difference of melting points of the two types of film, k is k≧2, O
摘要:
The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a second portion surrounding the first portion is adhered to the substrate, and a closed space is defined between the first portion and the substrate. The optical element is mounted on the substrate within the closed space.
摘要:
A micro electro mechanical systems (MEMS) device includes a first substrate on which an electrode is formed, a movable substrate having at least a moving part and a periphery supporting member, and a second substrate having a concave portion. A space that includes a part of the concave portion is formed by jointing the first substrate, the movable substrate, and the second substrate together. The moving part inside the space moves when a voltage is applied between the electrode and the moving part through the periphery supporting member, and a part of the first substrate protrudes outside a side surface of the second substrate.
摘要:
A three-dimensional mounted assembly includes a molded body, a plurality of electronic parts sealed with the molded body, a plurality of interconnections electrically connected to the electronic parts and sealed with the molded body wherein part of at least one of the interconnections is exposed on a first side of the molded body and at least another one of the interconnections is exposed on a second side of the molded body differing from the first side.
摘要:
An analyzer includes an optical tunable filter 1 for selectively outputting light having a predetermined wavelength, and a PD 421 for receiving light outputted from the optical tunable filter 1 and then passed through or reflected by an object to be measured. The optical tunable filter 1 includes a first substrate 3 including a movable portion 31 having a light transmitting property; a second substrate 2 having a light transmitting property, the second substrate being provided so as to be opposed to the first substrate; a first gap 21 and a second gap 22 which are respectively provided between the movable portion 31 of the first substrate 3 and the second substrate 2; an interference portion which cases interference with light that enters the optical tunable filter 1 and that has the predetermined wavelength between the movable portion and the second substrate 2 by means of the second gap 22; and a driving portion for changing a distance of the second gap 22 by displacing the movable portion 31 with respect to the second substrate 2 using the first gap 21.
摘要:
An optical tunable filter includes a first substrate 3 having a light transmitting property which includes a movable portion 31, a second substrate 20 having a light transmitting property which is provided so as to be opposed to the first substrate, a first gap 21 and a second gap 22 which are respectively provided between the movable portion 31 and the second substrate 20, an interference portion which causes interference of incident light between the movable portion 31 and the second substrate 20 through the second gap 22, and a driving portion which changes a distance of the second gap 22 by displacing the movable portion 31 with respect to the second substrate 20 using the first gap 21. This makes it possible to provide an optical tunable filter having a simpler structure and a smaller size, which can be manufactured through a simplified manufacturing process without using a release hole and can achieve stable driving of a movable portion, and a method for manufacturing such an optical tunable filter.
摘要:
A surface emission laser (14) is disposed so that a side surface (15) of a semiconductor substrate of the surface emission laser (14) faces a plane (13) of a mounting substrate (12). By this means, emitted light (44) from the surface emission laser (14) travels in the direction along the plane (13) of the mounting substrate (12). Therefore, it is possible to dispose the optical fiber (16) so as to be along the plane (13) of the mounting substrate (12). By this means, an optical module (10) can be made thinner.
摘要:
A semiconductor apparatus, method of manufacturing the same, and an electronic apparatus are provided that improve the productivity and reduce the manufacturing cost. A plurality of semiconductor devices 16 may be mounted on a substrate 10. The semiconductor devices 16 may be sealed by resin 19. A heat radiation plate 18 may be mounted and the substrate 10 and the heat radiation plate 18 may be cut into pieces corresponding to the respective semiconductor devices 16.