公开(公告)号：US07408015B2

公开(公告)日：2008-08-05

申请号：US11311198

申请日：2005-12-19

Applicant: Byoung Un Kang ,  Hyuk Soo Moon ,  Jong Kul Lee ,  Kyoung Tae Wi ,  Tae Sung Kim

Inventor： Byoung Un Kang ,  Hyuk Soo Moon ,  Jong Kul Lee ,  Kyoung Tae Wi ,  Tae Sung Kim

IPC: C07F7/08 ,  C07F7/10 ,  C08G59/14

CPC classification number: C08G59/306 ,  C08G59/3254 ,  C08G59/504 ,  C08L61/00 ,  C08L79/08 ,  C08L83/00 ,  C09J5/02 ,  C09J2400/123 ,  C09J2400/143 ,  C09J2400/163 ,  C09J2461/00 ,  C09J2479/00 ,  C09J2483/00 ,  H05K3/389

Abstract: The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.

Abstract translation: 本发明涉及具有如表达式X 3 SiR 1 1的粘合强度相对较高的硅烷加成物及其制造方法。 其中X是选自环氧化合物，氨基化合物和双酚的一种氢化形式，R 1选自缩水甘油氧基丙基，2-（3,4-环氧环己基）乙基，3- 丙烯酰氧基丙基，3-甲基丙烯酰氧基丙基，氨基丙基，3- [2-（2-氨基乙基氨基）乙基氨基]丙基，N-甲基氨基丙基，N-苯基氨基丙基，N，N-二甲基-3-氨基丙基， 丙基，氰基丙基和异氰酸基 - 丙基。

公开(公告)号：US06878261B2

公开(公告)日：2005-04-12

申请号：US10278644

申请日：2002-10-23

Applicant: Sang-Kyum Kim ,  Chang-Hee Choi ,  Byoung-Un Kang

Inventor： Sang-Kyum Kim ,  Chang-Hee Choi ,  Byoung-Un Kang

IPC: C23C22/00 ,  C09D4/00 ,  C23C22/68 ,  C25D3/56 ,  C25D5/48 ,  H05K3/38 ,  C23C28/00 ,  C23C8/00 ,  C25D5/44

CPC classification number: H05K3/389 ,  C09D4/00 ,  C23C22/68 ,  C23C28/00 ,  C23C2222/20 ,  C25D3/565 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  C08G77/04

Abstract: A surface treatment method for increasing adhesion of a surface of copper foil to an insulating epoxy-impregnated substrate used in printed circuit boards is provided. The method includes nodularizing a surface of an electrolytic copper foil, surface-treating the surface of the nodularized electrolytic copper foil by Zn—As alloy electrodeposition to form a Zn—As composite layer thereon, and coating the surface of the surface-treated electrolytic copper foil with a silane coupling agent mixture, whose compounding ratio of 3-aminopropyltriethoxysilane with respect to vinyltriethoxysilane is between 6:4 and 9:1. This method is very effective to prevent discoloration of copper foil caused by oxidation and the like.

Abstract translation: 提供了一种用于增加铜箔表面对印刷电路板中使用的绝缘环氧树脂浸渍基材的粘附性的表面处理方法。 该方法包括使电解铜箔的表面结节化，通过Zn-As合金电沉积对结节状电解铜箔的表面进行表面处理，在其上形成Zn-As复合层，并将表面处理的电解铜 用硅烷偶联剂混合物，其3-氨基丙基三乙氧基硅烷相对于乙烯基三乙氧基硅烷的配混比为6:4至9:1。 该方法对于防止由氧化等引起的铜箔的变色是非常有效的。

公开(公告)号：US07485494B2

公开(公告)日：2009-02-03

申请号：US11413938

申请日：2006-04-27

Applicant: Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

Inventor： Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

IPC: H01L21/00

CPC classification number: H01L24/29 ,  C09J7/10 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Abstract translation: 本发明的半导体用切割模粘合膜具有3层结构，其包括附着在半导体晶片背面的第一粘接层; 附着在第一粘合剂层上的第二粘合剂层; 以及附着在第二粘合剂层上的切割膜，因此具有能够确保半导体封装工艺的可靠性的优点，因为它可以防止模切现象和切割过程中的模具拾取不良并保持足够的 模头与芯片之间的粘合力。

公开(公告)号：US20100317155A1

公开(公告)日：2010-12-16

申请号：US12526313

申请日：2007-08-03

Applicant: Byoung-Un Kang ,  Joon-Mo Seo ,  Choong-Hyun Sung ,  Jae-Hoon Kim ,  Soon-Young Hyun

Inventor： Byoung-Un Kang ,  Joon-Mo Seo ,  Choong-Hyun Sung ,  Jae-Hoon Kim ,  Soon-Young Hyun

IPC: H01L21/50 ,  B32B7/02 ,  B32B7/12 ,  C09J7/00 ,  B32B5/02 ,  B32B27/00 ,  B32B27/18

CPC classification number: H01L24/29 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/274 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/2891 ,  Y10T428/2896 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A multifunctional die attachment film used in a semiconductor packaging process includes a first die attachment film attached to a surface of a wafer having fine circuit patterns and solder bump patterns and having a first adhesive strength; and a second die attachment film attached on the first die attachment film and having a second adhesive strength with a wafer, a die chip, PCB and a flexible board, and the multifunctional die attachment film serves as a backgrinding tape in a backgrinding process, and after the backgrinding process is completed, the multifunctional die attachment film is not removed, but is used to attach a die chip to a connection member. And, the present invention utilizes the die attachment film as a backgrinding tape in the backgrinding process and concurrently a wafer protection means in a wafer dicing process, thereby preventing sawing burr, scratches or cracks.

Abstract translation: 在半导体封装工序中使用的多功能芯片安装膜包括附着在具有微细电路图形和焊料凸块图案的晶片表面的第一芯片附着膜，并具有第一粘合强度; 以及附着在第一芯片安装膜上并且与晶片，芯片，PCB和柔性板具有第二粘合强度的第二芯片附着膜，并且多功能模片附接膜在背面研磨工艺中用作背面研磨胶带，并且 在背面研磨处理完成之后，多功能模片安装膜不被去除，而是用于将芯片附接到连接构件。 并且，本发明在背面研磨工艺中利用模片附着膜作为后研磨带，同时在晶圆切片工艺中使用晶片保护装置，从而防止锯切毛刺，划痕或裂纹。

公开(公告)号：US20090198013A1

公开(公告)日：2009-08-06

申请号：US11915280

申请日：2005-10-31

Applicant: Dong-Cheon Shin ,  Byoung-Un Kang ,  Tae-Hyun Sung ,  Jai-Hoon Kim ,  Kyung-Tae Wi ,  Joon-Mo Seo ,  Hyuk-Soo Moon

Inventor： Dong-Cheon Shin ,  Byoung-Un Kang ,  Tae-Hyun Sung ,  Jai-Hoon Kim ,  Kyung-Tae Wi ,  Joon-Mo Seo ,  Hyuk-Soo Moon

IPC: C08L63/00

CPC classification number: H01L24/83 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2463/00 ,  H01L24/27 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05032

Abstract: An adhesive film for semiconductor is disclosed. The present invention provides an adhesive film for semiconductor used in semiconductor packaging, comprising an adhesive layer, wherein the adhesive layer has surface tension of 19 to 52 erg/cm at 60 ° C. Accordingly, the adhesive film for semiconductor according to the present invention may prevent bubbles from being formed between the adhesive film and a supporting member by controlling surface tension in an optimum condition, and also obtain higher reliability in use of the adhesive film in the semi-conductor packaging by controlling tackiness and adhesive force in an optimum condition.

Abstract translation: 公开了一种用于半导体的粘合膜。 本发明提供一种半导体封装用半导体用粘接膜，其特征在于，具有粘合层，其粘合层在60℃下的表面张力为19〜52erg / cm。因此，本发明的半导体用粘接膜 可以通过在最佳条件下控制表面张力来防止在粘合剂膜和支撑构件之间形成气泡，并且通过在最佳条件下控制粘性和粘合力，在半导体封装中使用粘合剂膜也获得更高的可靠性 。

公开(公告)号：US20060244132A1

公开(公告)日：2006-11-02

申请号：US11413938

申请日：2006-04-27

Applicant: Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

Inventor： Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

IPC: H01L23/34

CPC classification number: H01L24/29 ,  C09J7/10 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.