公开(公告)号：US08890188B2

公开(公告)日：2014-11-18

申请号：US13290639

申请日：2011-11-07

Applicant: Na Na Park ,  Il Woo Park ,  Chang Hoon Kwak

Inventor： Na Na Park ,  Il Woo Park ,  Chang Hoon Kwak

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/507 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014

Abstract: A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Abstract translation: 发光器件封装包括：第一和第二电极，其下表面的至少一部分被暴露; 设置在所述第一和第二电极中的至少一个的上表面上的发光器件; 反射壁，设置在第一和第二电极的上表面上并围绕发光装置，以在其中形成安装部分; 以及设置在所述反射壁上以覆盖所述安装部的上部的荧光膜。 安装部分充满空气。

公开(公告)号：US20110260192A1

公开(公告)日：2011-10-27

申请号：US13122323

申请日：2009-10-01

Applicant: Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

Inventor： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

IPC: H01L33/60 ,  H01L33/38

CPC classification number: H01L33/56 ,  H01L24/48 ,  H01L33/02 ,  H01L33/382 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.

Abstract translation: 使用液晶聚合物的发光二极管（LED）封装包括：通过使用液晶聚合物形成的封装主体; 形成在所述包装主体上的引线框架; 安装在引线框架上的LED芯片; 以及封装LED芯片的树脂封装单元，所述树脂封装单元包括荧光体。 LED封装非常可靠。

公开(公告)号：US20100127290A1

公开(公告)日：2010-05-27

申请号：US12360250

申请日：2009-01-27

Applicant: Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

Inventor： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

IPC: H01L21/50 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

Abstract translation: 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US08795817B2

公开(公告)日：2014-08-05

申请号：US13818373

申请日：2011-08-24

Applicant: Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

Inventor： Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC: B32B3/10 ,  B32B5/16 ,  H01L33/50 ,  C09K11/06

CPC classification number: H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract translation: 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。

公开(公告)号：US20140141283A1

公开(公告)日：2014-05-22

申请号：US14127878

申请日：2011-08-12

Applicant: Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

Inventor： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

IPC: C09K11/02 ,  B05D5/06

CPC classification number: C09K11/025 ,  B05D5/06 ,  C08J7/06 ,  C09K11/08

Abstract: A method of manufacturing a phosphor resin film and a phosphor resin film manufactured thereby are provided. The method of manufacturing a phosphor resin film includes preparing a polymer slurry by mixing a polymer resin and a latent curing agent in a solvent, spreading the polymer slurry such that it has a film shape, drying the spread polymer slurry to form a semi-hardened resin film, and providing phosphor powder to the semi-hardened resin film. A phosphor resin film includes semi-hardened resin film including a polymer resin and a latent curing agent and phosphors uniformly formed on one surface of the semi-hardened resin film.

Abstract translation: 提供了制造荧光体树脂膜的方法和由此制造的荧光体树脂膜。 制造荧光体树脂膜的方法包括通过在溶剂中混合聚合物树脂和潜在性固化剂来制备聚合物浆料，将聚合物浆料铺展成膜形状，干燥扩展聚合物浆料以形成半硬化 树脂膜，并向半硬化树脂膜提供荧光体粉末。 荧光体树脂膜包括半固化树脂膜，其包含聚合物树脂和潜在性固化剂以及均匀地形成在半硬化树脂膜的一个表面上的荧光体。

公开(公告)号：US08507299B2

公开(公告)日：2013-08-13

申请号：US12785024

申请日：2010-05-21

Applicant: Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

Inventor： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

Abstract translation: 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US08294168B2

公开(公告)日：2012-10-23

申请号：US12846335

申请日：2010-07-29

Applicant: Il-woo Park ,  Chang-hoon Kwak ,  Hyo-jin Lee

Inventor： Il-woo Park ,  Chang-hoon Kwak ,  Hyo-jin Lee

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  F21Y2115/10 ,  G02B6/0023 ,  H01L33/502 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light source module using quantum dots, a backlight unit employing the light source module, a display apparatus, and an illumination apparatus. The light source module includes a light emitting device package including a plurality of light emitting device chips, and a quantum dot sealing package disposed on the light emitting device package in a light emitting direction, and converts wavelengths of light emitted from the light emitting device chips to generate wavelength-converted light.

Abstract translation: 使用量子点的光源模块，采用光源模块的背光单元，显示装置和照明装置。 光源模块包括：发光器件封装，其包括多个发光器件芯片;以及量子点密封封装，其以发光方向设置在发光器件封装上，并且将从发光器件芯片发出的光的波长 以产生波长转换的光。

公开(公告)号：US08098005B2

公开(公告)日：2012-01-17

申请号：US12007925

申请日：2008-01-17

Applicant: Chang Hoon Kwak ,  Young Mok Lee ,  Il Woo Park ,  Jong Rak Sohn ,  Chul Soo Yoon

Inventor： Chang Hoon Kwak ,  Young Mok Lee ,  Il Woo Park ,  Jong Rak Sohn ,  Chul Soo Yoon

IPC: H05B33/14

CPC classification number: H01L33/50 ,  C09K11/025 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7786 ,  C09K11/886 ,  Y02B20/181

Abstract: A white light emitting device including: a blue light emitting diode (LED); a green silicate phosphor formed on the blue LED; and a red sulfide phosphor with a surface coated with a silicone oxide layer, the red sulfide phosphor formed on the blue LED.

Abstract translation: 一种白色发光装置，包括：蓝色发光二极管（LED）; 在蓝色LED上形成绿色硅酸盐荧光体; 以及表面涂覆有氧化硅层的红色硫化物荧光体，形成在蓝色LED上的红色硫化物荧光体。

公开(公告)号：US20110248299A1

公开(公告)日：2011-10-13

申请号：US12756833

申请日：2010-04-08

Applicant: Na-Na PARK ,  Chang-Hoon KWAK ,  Il-Woo Park

Inventor： Na-Na PARK ,  Chang-Hoon KWAK ,  Il-Woo Park

IPC: H01L33/52 ,  H01L33/50

CPC classification number: H01L33/501 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates to a light emitting diode package and a method of fabricating the same capable of uniformly distributing a fluorescent substance in a molding member by including a light emitting diode chip on a package substrate and the molding member having a molding resin, a fluorescent substance and nano particles, which is arranged on the package substrate, with covering the light emitting diode chip.

Abstract translation: 发光二极管封装及其制造方法技术领域本发明涉及一种发光二极管封装及其制造方法，该发光二极管封装及其制造方法能够通过在封装衬底上包括发光二极管芯片和具有模制树脂的模制构件，荧光体 物质和纳米颗粒，其布置在封装衬底上，覆盖发光二极管芯片。

公开(公告)号：US07999456B2

公开(公告)日：2011-08-16

申请号：US11905234

申请日：2007-09-28

Applicant: Jong Rak Sohn ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

Inventor： Jong Rak Sohn ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

IPC: H05B33/00 ,  H01J1/62 ,  H01L33/00 ,  C09K11/54

CPC classification number: C09K11/7792 ,  C09K11/0883 ,  C09K11/7786 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00014

Abstract: Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

Abstract translation: 提供了包括蓝色LED芯片的白色发光二极管（LED） 以及以预定混合比涂覆在蓝色LED芯片上的黄色，绿色和红色发光荧光体，并将从蓝色LED芯片发出的光转换成白色光。