公开(公告)号：US06876049B2

公开(公告)日：2005-04-05

申请号：US10272136

申请日：2002-10-16

Applicant: Yang-Tung Fan ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

Inventor： Yang-Tung Fan ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

IPC: G02F1/1335 ,  H01L21/00 ,  H01L27/146 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

公开(公告)号：US06649507B1

公开(公告)日：2003-11-18

申请号：US09883163

申请日：2001-06-18

Applicant: Yen-Ming Chen ,  Cheng-Yu Chu ,  Kuo-Wei Lin ,  Chiou-Shian Peng ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Shih-Jane Lin

Inventor： Yen-Ming Chen ,  Cheng-Yu Chu ,  Kuo-Wei Lin ,  Chiou-Shian Peng ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Shih-Jane Lin

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: A method of forming a bump structure, comprising the following steps. A structure having an exposed first conductive structure is provided. A first photoresist layer is formed over the structure and the exposed first conductive structure. A second capping photoresist layer is formed over the first photoresist layer. The first and second photoresist layers being comprised of different photoresist materials. The first and second photoresist layers are patterned to form an opening through the first and second photoresist layers and over the first conductive structure. The second capping photoresist layer prevents excessive formation of first photoresist layer residue during processing. A second conductive structure is formed within the opening. The first and second patterned photoresist layers are stripped. The second conductive structure is reflowed to form the bump structure.

Abstract translation: 一种形成凸块结构的方法，包括以下步骤。 提供具有暴露的第一导电结构的结构。 在结构和暴露的第一导电结构上形成第一光致抗蚀剂层。 在第一光致抗蚀剂层上形成第二覆盖光致抗蚀剂层。 第一和第二光致抗蚀剂层由不同的光致抗蚀剂材料组成。 图案化第一和第二光致抗蚀剂层以形成穿过第一和第二光致抗蚀剂层并在第一导电结构上的开口。 第二覆盖光致抗蚀剂层防止在处理期间过度形成第一光致抗蚀剂层残留物。 在开口内形成第二导电结构。 剥离第一和第二图案化的光致抗蚀剂层。 第二导电结构被回流以形成凸块结构。

公开(公告)号：US06605524B1

公开(公告)日：2003-08-12

申请号：US09950227

申请日：2001-09-10

Applicant: Yang-Tung Fan ,  Cheng-Yu Chu ,  Fu-Jier Fan ,  Shih-Jane Lin ,  Chiou-Shian Peng ,  Yen-Ming Chen ,  Kuo-Wei Lin

Inventor： Yang-Tung Fan ,  Cheng-Yu Chu ,  Fu-Jier Fan ,  Shih-Jane Lin ,  Chiou-Shian Peng ,  Yen-Ming Chen ,  Kuo-Wei Lin

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/1191 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A new process is provided which is an extension and improvement of present processing for the creation of a solder bump. After the layers of Under Bump Metal and a layer of solder metal have been created in patterned and etched format and overlying the contact pad, following a conventional processing sequence, a layer of polyimide is deposited. The solder flow is performed using the thickness of the deposited layer of polyimide to control the height of the column underneath the reflown solder.

Abstract translation: 提供了一种新的工艺，其是用于产生焊料凸块的当前处理的延伸和改进。 在图形化和蚀刻形式下形成了凹凸金属层和焊料金属层之后，按照传统的处理顺序，沉积了一层聚酰亚胺。 使用聚酰亚胺沉积层的厚度来进行焊料流动，以控制在重熔焊料下面的柱的高度。

公开(公告)号：US06426281B1

公开(公告)日：2002-07-30

申请号：US09759911

申请日：2001-01-16

Applicant: Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yen-Ming Chen ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Chiou-Shian Peng ,  Shih-Jang Lin

Inventor： Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yen-Ming Chen ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Chiou-Shian Peng ,  Shih-Jang Lin

IPC: H01L2144

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05552

Abstract: A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of passivation that aligns with the contact pad. A layer of UBM metal is deposited over the layer of passivation, the layer of UBM is overlying the contact pad and limited to the immediate surroundings of the contact pad. The central surface of the layer of UBM is selectively electroplated after which a layer of solder or solder alloy is solder printed over the electroplated surface of the layer of UBM. A solder flux or paste is applied over the surface of the solder printed solder compound or solder alloy. Flowing of the solder or solder alloy creates the solder bump of the invention.

公开(公告)号：US20090111208A1

公开(公告)日：2009-04-30

申请号：US12347468

申请日：2008-12-31

Applicant: Yang-Tung FAN ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

Inventor： Yang-Tung FAN ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

IPC: H01L31/18

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

Abstract translation: 公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜 指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。 光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物， 打包。 通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。 光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。 沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

公开(公告)号：US07183598B2

公开(公告)日：2007-02-27

申请号：US11037445

申请日：2005-01-18

Applicant: Yang-Tung Fan ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

Inventor： Yang-Tung Fan ,  Chiou-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

IPC: H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

Abstract translation: 公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜 指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。 光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物， 打包。 通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。 光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。 沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

公开(公告)号：US06936923B2

公开(公告)日：2005-08-30

申请号：US10147245

申请日：2002-05-16

Applicant: Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yen-Ming Chen ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Chiou Shian Peng ,  Shih-Jang Lin

Inventor： Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yen-Ming Chen ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Chiou Shian Peng ,  Shih-Jang Lin

IPC: H01L21/60 ,  H01L23/48

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/05552

Abstract: A new method and processing sequence is provided for the creation of interconnect bumps. A layer of passivation is deposited over a contact pad and patterned, creating an opening in the layer of passivation that aligns with the contact pad. A layer of UBM metal is deposited over the layer of passivation, the layer of UBM is overlying the contact pad and limited to the immediate surroundings of the contact pad. The central surface of the layer of UBM is selectively electroplated after which a layer of solder or solder alloy is solder printed over the electroplated surface of the layer of UBM. A solder flux or paste is applied over the surface of the solder printed solder compound or solder alloy. Flowing of the solder or solder alloy creates the solder bump of the invention.

Abstract translation: 提供了一种新的方法和处理顺序，用于创建互连凸块。 钝化层沉积在接触焊盘上并被图案化，在与接触焊盘对准的钝化层中产生开口。 一层UBM金属沉积在钝化层上，UBM层覆盖接触焊盘，并限制在接触焊盘的周围环境。 选择性地电镀UBM层的中心表面，然后在UBM层的电镀表面上焊接印刷一层焊料或焊料合金。 在焊料印刷的焊料化合物或焊料合金的表面上施加焊剂或糊料。 焊料或焊料合金的流动产生本发明的焊料凸块。

公开(公告)号：US20050121737A1

公开(公告)日：2005-06-09

申请号：US11037445

申请日：2005-01-18

Applicant: Yang-Tung Fan ,  Chion-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

Inventor： Yang-Tung Fan ,  Chion-Shian Peng ,  Cheng-Yu Chu ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

IPC: G02F1/1335 ,  H01L21/00 ,  H01L27/146 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L31/02327

Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon. A transparent encapsulant is deposited to planarize the color filter layer and completes the solid-state color image-forming device without conventional convex microlenses.

Abstract translation: 公开了一种有序的微电子制造顺序，其中滤色器通过直角沉积直接形成在CCD，CID或CMOS成像装置的光电检测器阵列上以形成凹入像素表面，并且覆盖有高透光率平面化膜 指定的折射率和物理性质，其优化光收集到光电二极管而不需要额外的常规微透镜。 光学平坦的顶表面用于封装和保护成像器免受化学和热清洁处理损伤，最小化形成的底层变化，其将形成在非平面表面上的图像的像差或引起反射损失，并且消除在切割期间引起的残留颗粒夹杂物， 打包。 通过在半导体衬底上光刻地构图光电二极管平面阵列来形成CCD成像器。 光电二极管阵列设置有金属遮光罩，钝化，并且在其上形成滤色器。 沉积透明密封剂以平坦化滤色器层并完成固态彩色图像形成装置，而不需要常规的凸起的微透镜。

公开(公告)号：US06632700B1

公开(公告)日：2003-10-14

申请号：US10135096

申请日：2002-04-30

Applicant: Yang-Tung Fan ,  Cheng-Yu Chu ,  Chiou-Shian Peng ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

Inventor： Yang-Tung Fan ,  Cheng-Yu Chu ,  Chiou-Shian Peng ,  Shih-Jane Lin ,  Yen-Ming Chen ,  Fu-Jier Fan ,  Kuo-Wei Lin

IPC: H01L2100

CPC classification number: H01L31/02162 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685

Abstract: A new method to form color image sensor cells without damaging bonding pads in the manufacture of an integrated circuit device is achieved. The method comprises, first, forming cell electrodes and bonding pads on a semiconductor substrate. A passivation layer is formed overlying the cell electrodes but exposing the top surface of the bonding pads. The semiconductor substrate is then dipped in a hydrogen peroxide solution to thereby form a metal oxide layer overlying the bonding pads. A first transparent planarization layer is deposited overlying the passivation layer and the metal oxide layer. A color filter photoresist layer is deposited overlying the first transparent planarization layer. The color filter photoresist layer is patterned to form color filter elements to complete the color image sensor cells in the manufacture of the integrated circuit device. The presence of the metal oxide layer prevents damage to the bonding pads from an alkaline developer.

Abstract translation: 实现了在集成电路器件的制造中形成彩色图像传感器单元而不损坏接合焊盘的新方法。 该方法首先在半导体衬底上形成电池电极和接合焊盘。 钝化层形成在电池电极上方，但暴露了焊盘的顶表面。 然后将半导体衬底浸入过氧化氢溶液中，从而形成覆盖在焊盘上的金属氧化物层。 覆盖钝化层和金属氧化物层的第一透明平坦化层被沉积。 沉积在第一透明平坦化层上的滤色器光致抗蚀剂层。 图案化滤色器光致抗蚀剂层以形成滤色器元件，以在集成电路器件的制造中完成彩色图像传感器单元。 金属氧化物层的存在防止了碱性显影剂对接合焊盘的损坏

公开(公告)号：US06583039B2

公开(公告)日：2003-06-24

申请号：US09978422

申请日：2001-10-15

Applicant: Yen-Ming Chen ,  Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Shih-Jane Lin ,  Chiou-Shian Peng ,  Hsien-Tsung Liu

Inventor： Yen-Ming Chen ,  Kuo-Wei Lin ,  Cheng-Yu Chu ,  Yang-Tung Fan ,  Fu-Jier Fan ,  Shih-Jane Lin ,  Chiou-Shian Peng ,  Hsien-Tsung Liu

IPC: H01L2144

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03019 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A method of forming a bump overlying the copper based contact pad to prevent oxidation of the copper based contact pad. A passivation blanket is deposited over a semiconductor device having a copper based contact pad, the passivation blanket includes a first layer overlying the top surface; a second layer overlying the first layer; a portion of the second layer overlying the copper based contact pad is removed leaving the first layer in place; depositing an under bump metallurgy over the semiconductor device, a portion of the first layer overlying the copper based contact pad is removed so that the copper based contact pad has limited exposure to oxygen; depositing an under bump metallurgy over the semiconductor device; removing excess under bump metallurgy; depositing an electrically conductive material over the under bump metallurgy; reflowing electrically conductive material to form a bump overlying the copper based contact pad.

Abstract translation: 一种形成覆盖铜基接触垫的凸起以防止铜基接触垫氧化的方法。 钝化覆盖层沉积在具有铜基接触焊盘的半导体器件上，钝化层包括覆盖在顶表面上的第一层; 覆盖第一层的第二层; 去除覆盖铜基接触垫的第二层的一部分，留下第一层就位; 在半导体器件上沉积凸块下的冶金，去除覆盖在铜基接触焊盘上的第一层的一部分，使得铜基接触焊盘具有有限的暴露于氧气; 在所述半导体器件上沉积凸块下的冶金; 去除多余的突起冶金; 在凸块下冶金上沉积导电材料; 回流导电材料以形成覆盖铜基接触垫的凸块。