Electric circuit module, circuit module arrangement and use of said circuit module and of said circuit module arrangement
    11.
    发明授权
    Electric circuit module, circuit module arrangement and use of said circuit module and of said circuit module arrangement 有权
    电路模块,电路模块布置以及所述电路模块和所述电路模块布置的使用

    公开(公告)号:US08014731B2

    公开(公告)日:2011-09-06

    申请号:US10466338

    申请日:2002-01-17

    CPC classification number: H04B1/006 H04B1/48

    Abstract: Circuitry includes a voltage-controlled switch having a transmitter input, a receiver input, and an output that connects to one of the transmitter input and the receiver input. Passive components form a low-pass filter that is electrically connected to the transmitter input. The passive components are part of a multilayer ceramic passive module that includes a base body made of superimposed dielectric layers and electrically conductive layers. The voltage-controlled switch is on an upper portion or a lower portion of the base body.

    Abstract translation: 电路包括具有发射机输入,接收机输入和连接到发射机输入和接收机输入之一的输出的电压控制开关。 无源元件构成电连接到发射机输入的低通滤波器。 无源部件是包括由叠加的电介质层和导电层制成的基体的多层陶瓷无源模块的一部分。 电压控制开关位于基体的上部或下部。

    Logistics start-up method
    13.
    发明申请
    Logistics start-up method 审中-公开
    物流启动方式

    公开(公告)号:US20080082378A1

    公开(公告)日:2008-04-03

    申请号:US11528578

    申请日:2006-09-28

    CPC classification number: G06Q10/08 G06Q10/063 G06Q10/063118 G06Q10/0639

    Abstract: A method for implementing a new logistics program includes executing a plurality of start-up model phases for the new logistics program, the start-up phases including at least a program development phase, a pilot phase, a go-live phase, and a transition phase. During the program development phase, logistics processes are selected, for the pilot, go-live, and transition phases, to be reviewed during each respective phase. Furthermore, a communication plan is selected to execute between a program developer entity and a program client entity during each respective phase. The new logistics program is piloted during the pilot phase, according to the processes and the communication plan selected for the pilot phase, operated in real-time during the go-live phase, according to the processes and the communication plan selected for the go-live phase, and transitioned to self-sufficient operation during the transition phase, according to the processes and communication plan selected for the transition phase.

    Abstract translation: 实施新物流计划的方法包括为新物流项目执行多个启动模型阶段,启动阶段至少包括程序开发阶段,试点阶段,转机阶段和转换阶段 相。 在方案开发阶段,选择后勤进程,用于试点,上岗和过渡阶段,以便在各个阶段进行审查。 此外,选择通信计划以在每个相应阶段期间在程序开发者实体和程序客户端实体之间执行。 根据试点阶段选择的流程和通信方案,在试运行阶段,根据流程和选择的通信计划,在试运行阶段,实行新的物流计划, 根据过渡阶段选定的流程和沟通方案,在转型阶段过渡到自给自足的运作。

    Transmitter module with improved heat dissipation
    15.
    发明申请
    Transmitter module with improved heat dissipation 审中-公开
    变送器模块具有改善的散热

    公开(公告)号:US20070108584A1

    公开(公告)日:2007-05-17

    申请号:US10570189

    申请日:2004-08-12

    Abstract: A transmitter module for mobile radio applications includes a multilayer module substrate with levels of metallization and intervening dielectric stacks in which a circuit is implemented by structuring the levels of metallization. In or on the module substrate, at least one HF filter or adjustment network is implemented. On the underside of the module substrate, a cutout, in which a chip element is soldered in a flip-chip-arrangement, is provided. The rear of the chip element pointing to the outside displays a metallization that makes a good thermal contact of the chip element with extrinsic circuit surroundings possible.

    Abstract translation: 用于移动无线电应用的发射机模块包括具有金属化水平和中间介电堆叠的多层模块衬底,其中通过构造金属化水平来实现电路。 在模块衬底中或模块衬底上,实现至少一个HF滤波器或调节网络。 在模块基板的下侧,设置有以倒装芯片布置焊接芯片元件的切口。 指向外部的芯片元件的后部显示出使得芯片元件与外部电路环境的良好热接触可能的金属化。

    Low-loss transmitter module
    16.
    发明申请
    Low-loss transmitter module 有权
    低损耗发射器模块

    公开(公告)号:US20060121874A1

    公开(公告)日:2006-06-08

    申请号:US11272596

    申请日:2005-11-14

    CPC classification number: H04B1/0483 H03H7/0138 H04B1/0458 H04B1/48 H04B1/54

    Abstract: A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.

    Abstract translation: 具有设置在输入侧的具有功率放大器的至少一个传输路径的无线传输系统的发射机模块包括设置在输出侧的低通滤波器和设置在其间的阻抗转换器。 因此,功率放大器和低通滤波器设置在多层载体衬底的顶表面上。 优选地,阻抗转换器设置在载体衬底的金属化平面中。 本发明将所有这些组件集成在一个模块中特别允许低阻抗放大器输出与具有确定的输出阻抗(例如50欧姆)的发射机模块的输出之间的逐步阻抗适配,由此阻抗适配 部分由低通滤波器进行。 多级阻抗适配允许减少例如在阻抗转换器中使用的线路段的长度和所涉及的信号损耗。

    Strip transmission filter
    17.
    发明授权
    Strip transmission filter 有权
    带式传输过滤器

    公开(公告)号:US06404305B1

    公开(公告)日:2002-06-11

    申请号:US09509620

    申请日:2000-03-29

    Inventor: Christian Block

    CPC classification number: H01P1/20363

    Abstract: A strip transmission filter having resonators with impedance skips in which the resonators are provided in a ceramic substrate. The strip transmission filter also includes capacitive couplings. The ceramic substrate has a metallic coating on all sides except for a face side. The coupling structures are at the face side of the substrate. The ceramic substrate is constructed in a stepped formation in a region of the coupling structures and at least one ground terminal. Thus, the adhesion of metallic coating is increased which, in turn, facilitates soldering.

    Abstract translation: 具有谐振器的带状透射滤光器,其中谐振器设置在陶瓷衬底中,具有阻抗跳跃。 带状传输滤波器还包括电容耦合。 陶瓷基板除了正面以外还具有除了所有侧面之外的金属涂层。 耦合结构位于衬底的正面。 陶瓷衬底在耦合结构的区域和至少一个接地端子中以阶梯形式构造。 因此,金属涂层的附着力增加,这又有助于焊接。

    Front end module comprising an antenna switch
    19.
    发明授权
    Front end module comprising an antenna switch 有权
    前端模块包括天线开关

    公开(公告)号:US08077656B2

    公开(公告)日:2011-12-13

    申请号:US11576986

    申请日:2005-10-07

    CPC classification number: H01Q1/50 H04B1/0057 H04B1/006 H04B1/48

    Abstract: A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.

    Abstract translation: 前端模块用于至少三个射频频段。 前端模块包括至少五个信号路径,以及天线开关,用于将天线电连接到信号路径之一。 至少一个信号路径包括子路径。 频率分离网络将至少一个信号路径接口到子路径。 子路径用于通过不同的射频。 不同的射频频段具有不重叠的频率范围。

    Electrical multilayer component with reduced parasitic capacitance
    20.
    发明授权
    Electrical multilayer component with reduced parasitic capacitance 有权
    降低寄生电容的电气多层组件

    公开(公告)号:US08058965B2

    公开(公告)日:2011-11-15

    申请号:US11993273

    申请日:2006-06-19

    Abstract: An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.

    Abstract translation: 电气多层部件包括具有顶部和底部的具有陶瓷层的堆叠的主体。 第一和第二连接表面位于主体的底部。 电极表面位于陶瓷层之间的金属化层中。 通过触点位于金属化层之间。 通孔触点中的至少一个电连接到电极表面或连接表面。 通过相应的通孔接点连接到一个连接表面的电极表面是第一电极结构或第二电极结构。 第一或第二电极结构中的至少一个包括具有盲端的通孔接触。 第一和第二电极结构之间的最短距离是从盲端到(i)在盲端上方或下方的金属化层的垂直距离,或(ii)另一电极结构的盲端。

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