Abstract:
Circuitry includes a voltage-controlled switch having a transmitter input, a receiver input, and an output that connects to one of the transmitter input and the receiver input. Passive components form a low-pass filter that is electrically connected to the transmitter input. The passive components are part of a multilayer ceramic passive module that includes a base body made of superimposed dielectric layers and electrically conductive layers. The voltage-controlled switch is on an upper portion or a lower portion of the base body.
Abstract:
A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure, also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.
Abstract:
A method for implementing a new logistics program includes executing a plurality of start-up model phases for the new logistics program, the start-up phases including at least a program development phase, a pilot phase, a go-live phase, and a transition phase. During the program development phase, logistics processes are selected, for the pilot, go-live, and transition phases, to be reviewed during each respective phase. Furthermore, a communication plan is selected to execute between a program developer entity and a program client entity during each respective phase. The new logistics program is piloted during the pilot phase, according to the processes and the communication plan selected for the pilot phase, operated in real-time during the go-live phase, according to the processes and the communication plan selected for the go-live phase, and transitioned to self-sufficient operation during the transition phase, according to the processes and communication plan selected for the transition phase.
Abstract:
An electrical multilayer component includes a base body having stacked ceramic dielectric and metallization layers that are formed into component structures among the dielectric layers. Solder contacts are on the underside of the base body. Plated through-holes connect the component structures to the solder contacts. The plated through-holes have at least cross section that widens upward away from the solder contact.
Abstract:
A transmitter module for mobile radio applications includes a multilayer module substrate with levels of metallization and intervening dielectric stacks in which a circuit is implemented by structuring the levels of metallization. In or on the module substrate, at least one HF filter or adjustment network is implemented. On the underside of the module substrate, a cutout, in which a chip element is soldered in a flip-chip-arrangement, is provided. The rear of the chip element pointing to the outside displays a metallization that makes a good thermal contact of the chip element with extrinsic circuit surroundings possible.
Abstract:
A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.
Abstract:
A strip transmission filter having resonators with impedance skips in which the resonators are provided in a ceramic substrate. The strip transmission filter also includes capacitive couplings. The ceramic substrate has a metallic coating on all sides except for a face side. The coupling structures are at the face side of the substrate. The ceramic substrate is constructed in a stepped formation in a region of the coupling structures and at least one ground terminal. Thus, the adhesion of metallic coating is increased which, in turn, facilitates soldering.
Abstract:
Compositions containing p-dinitrosobenzene deposited onto a support of a chemically inert material which is solid at room temperature are provided. The composition is preferably formed by depositing p-dinitrosobenzene from a solution or by sublimation or in the course of its synthesis in the presence of one or more supports. Hydrophilic or hydrophobic silica, hydrophobicized zeolites, carbon blacks and layer silicates are examples of supports. The composition is useful in the production of adhesives, more particularly for bonding elastomers, e.g. in the polymerization or crosslinking of elastomers, and even more particularly in the bonding of rubber to metal.
Abstract:
A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.
Abstract:
An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.