公开(公告)号：US20070013901A1

公开(公告)日：2007-01-18

申请号：US11423677

申请日：2006-06-12

Applicant: Jong-An Kim ,  Dong-Chun Lee ,  Chung-Sam Jun ,  Ik-Chul Kim ,  Sang-Hee Kim

Inventor： Jong-An Kim ,  Dong-Chun Lee ,  Chung-Sam Jun ,  Ik-Chul Kim ,  Sang-Hee Kim

IPC: G01N21/88

CPC classification number: G01N21/9501 ,  G01N2021/8825

Abstract: An optical inspection tool used to detect surface defects of a substrate include a chuck for holding a substrate and a lens unit disposed over the chuck. The lens unit includes at least a pair of oblique beam paths therein, wherein light penetrating the beam paths travels without angular deflection. The beam paths take the form of spaces formed through the lens unit, or flat portions formed on a lens within the lens unit. A camera is installed on the lens unit, and the camera converts light passing through the lens unit into an image. Methods of detecting surface defects of the substrate using the inspection tool are also provided.

Abstract translation: 用于检测基板的表面缺陷的光学检查工具包括用于保持基板的卡盘和设置在卡盘上方的透镜单元。 透镜单元在其中包括至少一对倾斜光束路径，其中穿透光束路径的光行进而没有角度偏转。 光束路径采取通过透镜单元形成的空间的形式，或形成在透镜单元内的透镜上的平坦部分。 相机安装在镜头单元上，相机将通过镜头单元的光转换为图像。 还提供了使用检查工具检测基板的表面缺陷的方法。

公开(公告)号：US20070008703A1

公开(公告)日：2007-01-11

申请号：US11481179

申请日：2006-07-06

Applicant: Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

Inventor： Chang-Yong Park ,  Hyun-Jong Oh ,  Yong-Hyun Kim ,  Dong-Woo Shin ,  Kyung-Du Kim ,  Dong-Chun Lee ,  Kwang-Ho Chun

IPC: H05K7/20 ,  F28F7/00

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Abstract translation: 散热器包括散热板和压力夹。 散热板将热量从热源辐射出来。 压力夹将散热板固定在热源上。 压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。 脊柱布置在散热板上。 一个或多个肋从脊部延伸并接触热源。 钩部分从脊柱延伸并由热源支撑。 压力夹还包括将脊柱连接到钩部件的安装部件。 在脊柱和散热板之间形成弯曲空间。 散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

公开(公告)号：US20060102997A1

公开(公告)日：2006-05-18

申请号：US11233078

申请日：2005-09-23

Applicant: Hyo-Jae Bang ,  Byung-Man Kim ,  Dong-Chun Lee ,  Kwang-Su Yu

Inventor： Hyo-Jae Bang ,  Byung-Man Kim ,  Dong-Chun Lee ,  Kwang-Su Yu

IPC: H01L23/02

CPC classification number: H05K3/325 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0314 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Abstract translation: 一种半导体模块和半导体模块的制造方法，所述半导体模块包括至少一个芯片封装，至少一个模块板，设置在所述第一芯片封装和所述模块板之间的至少一个导电元件和用于向所述导电元件施加压力的保护器， 模块板和第一芯片封装和/或用作第一芯片封装的散热器。

公开(公告)号：US20060043578A1

公开(公告)日：2006-03-02

申请号：US11038211

申请日：2005-01-21

Applicant: Hyo-Jae Bang ,  Byung-Man Kim ,  Dong-Chun Lee ,  Kwang-Su Yu

Inventor： Hyo-Jae Bang ,  Byung-Man Kim ,  Dong-Chun Lee ,  Kwang-Su Yu

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/3672 ,  H01L23/3737 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A semiconductor device, which may include a heat sink using a thermal induced adhesive is provided. The adhesive strength of the thermal induced adhesive at room temperature may be reduced when heated. The thermal induced adhesive may attach the heat sink to the semiconductor device, and may result in a thinner semiconductor device.

Abstract translation: 提供了可以包括使用热诱导粘合剂的散热器的半导体器件。 当加热时，热诱导的粘合剂在室温下的粘合强度可能会降低。 热诱导的粘合剂可以将散热器附接到半导体器件，并且可以导致更薄的半导体器件。

公开(公告)号：US20050000635A1

公开(公告)日：2005-01-06

申请号：US10882336

申请日：2004-07-02

Applicant: Young-Soo Lee ,  Myung-Jong Eom ,  Byung-Man Kim ,  Dong-Chun Lee

Inventor： Young-Soo Lee ,  Myung-Jong Eom ,  Byung-Man Kim ,  Dong-Chun Lee

IPC: B65C9/06 ,  B65C1/02 ,  B65C1/04 ,  H01L23/544 ,  B32B31/00

CPC classification number: B65C1/02 ,  B65C1/047 ,  Y10T156/1702 ,  Y10T156/1744 ,  Y10T156/1751 ,  Y10T156/1768

Abstract: A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

Abstract translation: 描述了将标签附接到布置在双面基板上的多个半导体模块的方法和装置，其可以缩短工艺流以努力降低设备成本。 示例性布置可以包括至少一个标签附接单元，其被配置为将标签附接到安装在双面基板的第一表面和第二表面中的一个上的多个半导体模块，并且可以包括至少一个转盘，其被配置为翻转 所述双面基板将所述第一表面和所述第二表面中的一个暴露于所述标签附接单元。

公开(公告)号：US06479982B1

公开(公告)日：2002-11-12

申请号：US09449574

申请日：1999-11-29

Applicant: Sang Soo Lee ,  Wan Gu Lee ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

Inventor： Sang Soo Lee ,  Wan Gu Lee ,  Jong Won Kim ,  Hee Soo Kim ,  Young Hak Oh ,  Dong Chun Lee

IPC: G01R3102

CPC classification number: H01L21/67742 ,  G01R31/2808

Abstract: There is disclosed a rotator for a module IC handler, including a loading side rotator for 90-degrees changing a direction of a carrier and supplying it to the inside of a heating chamber, and an unloading side rotator for 90-degrees changing a direction of the carrier after being vertically contacted in a test site and for transferring it to the unloading location. The rotator according to the invention includes a loading side rotator, and an unloading side rotator, the loading side rotator having a driving unit, a transferring member, a holding unit for holding or releasing the carrier, and a removal/insertion unit for introducing or discharging the transferring member into or from the rotating plate, the unloading side rotator having a rotating plate, a driving unit and a holding unit.

Abstract translation: 公开了一种用于模块IC处理器的旋转器，包括用于90度改变载体的方向并将其供应到加热室内部的装载侧旋转器，以及用于90度改变方向的卸载侧旋转器 载体在试验部位垂直接触并将其转移到卸载位置。 根据本发明的旋转器包括装载侧旋转器和卸载侧旋转器，装载侧旋转器具有驱动单元，传送构件，用于保持或释放载体的保持单元，以及用于引入或 将转印构件排出旋转板或从旋转板排出，卸载侧旋转体具有旋转板，驱动单元和保持单元。

公开(公告)号：US5927504A

公开(公告)日：1999-07-27

申请号：US103641

申请日：1998-06-23

Applicant: Seong Chan Han ,  Dong Chun Lee ,  Kwang Su Yu ,  O Kyung Kwon

Inventor： Seong Chan Han ,  Dong Chun Lee ,  Kwang Su Yu ,  O Kyung Kwon

IPC: H05K13/00 ,  B65D73/00

CPC classification number: H05K13/0069

Abstract: An apparatus for carrying plural printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus comprises a main frame which is formed with an inside space for the PCBs. The main frame includes receivers for supporting one shorter edge of the PCBs. A clamp frame joined to the main frame includes a support plate for the other shorter edge of the PCBs. Movable clamps are elastically connected to the clamp frame so as to push the PCBs by elastic force when the PCBs are loaded into the apparatus. A adjustable mounting such as a slot or holes is provided in the main frame for fasteners joining two frames each other. Therefore, the apparatus can carry the PCBs of different size. The elastic connection between the clamp and the clamp frame is preferably made by slide bars and elastic members. Clamp holes, sub-walls, partition walls, hollow corners, and so forth may be preferably provided for the apparatus.

Abstract translation: 公开了用于携带用于半导体模块的多个印刷电路板（PCB）的装置。 该装置包括一个形成有用于PCB的内部空间的主框架。 主框架包括用于支撑PCB的一个较短边缘的接收器。 连接到主框架的夹持框架包括用于PCB的另一个较短边缘的支撑板。 活动夹具弹性地连接到夹具框架上，以便当PCB装载到设备中时通过弹性力推动PCB。 在主框架中设置可调整的安装件，例如槽或孔，用于将两个框架彼此连接的紧固件。 因此，该装置可以携带不同尺寸的PCB。 夹具和夹紧框架之间的弹性连接优选地由滑动杆和弹性构件制成。 可以优选地为装置提供夹紧孔，子壁，分隔壁，空心角等。

公开(公告)号：US08218330B2

公开(公告)日：2012-07-10

申请号：US11862521

申请日：2007-09-27

Applicant: Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2224/0401

Abstract: A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Abstract translation: 一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。 板构件具有彼此间隔开的第一和第二通孔。 第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。 第一无源元件包括第一和第二电极。 第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。 第一无源元件安装在第一插入槽上。 第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。 第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

公开(公告)号：US20120165103A1

公开(公告)日：2012-06-28

申请号：US13333340

申请日：2011-12-21

Applicant: Ju-Young KIM ,  Dong-Chun LEE ,  Hang-Kee KIM ,  Kang-Min SOHN ,  Chang Joon PARK

Inventor： Ju-Young KIM ,  Dong-Chun LEE ,  Hang-Kee KIM ,  Kang-Min SOHN ,  Chang Joon PARK

IPC: A63F9/24

CPC classification number: A63F13/70 ,  A63F13/12 ,  A63F13/335 ,  A63F13/56 ,  A63F2300/407 ,  A63F2300/534 ,  A63F2300/535 ,  A63F2300/6045 ,  A63F2300/646

Abstract: Disclosed herein is an apparatus for collecting game data in order to test performance of a game server. The apparatus includes a capture and filtering module, a control module, and a data management module. The capture and filtering module captures packets, transmitted and received between the game server and each of a plurality of game clients, using the plurality of game clients, and extracts a plurality of necessary data by performing filtering on the results of the capturing. The control module determines the movement route of a game character in such a way as to correspond to the plurality of necessary data, and controls the plurality of game clients based on the movement route. The data management module stores and manages the plurality of necessary data.

Abstract translation: 这里公开了一种用于收集游戏数据以便测试游戏服务器的性能的装置。 该装置包括捕获和过滤模块，控制模块和数据管理模块。 捕获和过滤模块使用多个游戏客户端捕获在游戏服务器和多个游戏客户端中的每一个之间发送和接收的分组，并且通过对捕获结果进行滤波来提取多个必需的数据。 控制模块以与多个所需数据相对应的方式确定游戏角色的移动路线，并且基于移动路线来控制多个游戏客户端。 数据管理模块存储和管理多个必要的数据。

公开(公告)号：US20120108035A1

公开(公告)日：2012-05-03

申请号：US13228966

申请日：2011-09-09

Applicant: Goon-Woo Kim ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Jeong-sam Lee ,  Sung-Soo Lee

Inventor： Goon-Woo Kim ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Jeong-sam Lee ,  Sung-Soo Lee

IPC: H01L21/78

CPC classification number: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  H01L21/67092 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/11

Abstract: A method of fabricating a semiconductor device includes preparing a semiconductor wafer having a top surface and a bottom surface. The semiconductor wafer is loaded onto a wafer chuck, and the bottom surface of the loaded semiconductor wafer faces the wafer chuck. A groove is formed in the top surface of the loaded semiconductor wafer by irradiating a second laser onto the top surface, and a reforming region is formed in the loaded semiconductor wafer under the groove by irradiating a first laser through wafer chuck and bottom surface of the semiconductor wafer into a region in which the first laser is focused. The semiconductor wafer is unloaded from the wafer chuck. The bottom surface of the semiconductor wafer is ground to decrease a thickness of the semiconductor wafer. The semiconductor wafer is separated along the groove and the reforming region, thereby forming a plurality of unit chips.

Abstract translation: 制造半导体器件的方法包括制备具有顶表面和底表面的半导体晶片。 将半导体晶片装载到晶片卡盘上，并且加载的半导体晶片的底表面面向晶片卡盘。 通过将第二激光照射在顶面上，在负载的半导体晶片的顶面形成有槽，通过将晶片卡盘的第一激光照射到晶片卡盘的下表面， 半导体晶片进入第一激光器聚焦的区域。 半导体晶片从晶片卡盘卸载。 研磨半导体晶片的底面以减小半导体晶片的厚度。 半导体晶片沿着沟槽和重整区域分离，从而形成多个单元芯片。