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公开(公告)号：US20130107482A1
公开(公告)日：2013-05-02
申请号：US13665325
申请日：2012-10-31
申请人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
发明人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.
摘要翻译： 印刷电路板包括容纳层，容纳层中容纳的片状电容器器件，以及形成在容纳层上的堆积结构，使得堆积结构覆盖容纳层中的片状电容器器件。 积层结构具有安装导体结构，其被定位成将IC芯片装置安装在积层结构的表面上，使得IC芯片装置直接安装在芯片电容器装置上，每个芯片电容器装置具有电介质体， 所述积聚结构，形成在所述电介质体上且在所述电介质体的表面上延伸的第一电极，以及形成在所述电介质体上并在所述电介质体的表面上延伸的第二电极，并且所述电介质体介于所述第一电极 电极和第二电极。
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公开(公告)号：US08116091B2
公开(公告)日：2012-02-14
申请号：US12873815
申请日：2010-09-01
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer.
摘要翻译： 印刷电路板具有包括具有开口部的树脂基板的芯基板，形成在开口部的电容器，具有第一电极结构，具有与芯基板的上表面相对的部分，第二电极结构体具有面向 芯基板的下表面，形成在芯基板的上表面上方并具有形成在上绝缘层上的导电电路的上绝缘层和将第一电极结构的部分与导电电路电连接的通孔， 上绝缘层和下绝缘层，形成在芯基板的下表面上，并且具有形成在下绝缘层上的导电电路和将第二电极结构的部分与下部绝缘层的导电电路电连接的通孔 绝缘层。
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公开(公告)号：US07855894B2
公开(公告)日：2010-12-21
申请号：US11928397
申请日：2007-10-30
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
摘要翻译： 片状电容器20设置在印刷电路板10中。以这种方式，IC芯片90和每个片状电容器20之间的距离缩短，并且环路电感减小。 此外，芯片电容器20被容纳在具有大厚度的芯基板30中。 因此，印刷电路板的厚度不会变大。
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14.发明申请公开(公告)号：US20100226108A1
公开(公告)日：2010-09-09
申请号：US12784634
申请日：2010-05-21
申请人： Yasushi INAGAKI , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi INAGAKI , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board.
摘要翻译： 一种印刷电路板，包括具有第一树脂基板的芯基板，具有开口的第二树脂基板和第三树脂基板，同时插入在芯基板上交替层叠的接合板，绝缘层和导电电路层，焊料凸块 形成在所述印刷电路板的外表面上的第一电容器，形成在所述第二树脂基板的开口中的第一电容器，形成在所述第一树脂基板上并连接到所述第一电容器的电极的导电焊盘， 树脂基板，并且直接连接到导电焊盘和芯基板上的导电电路，以及安装在印刷电路板的表面上的第二电容器。
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15.发明申请公开(公告)号：US20050157478A1
公开(公告)日：2005-07-21
申请号：US11062672
申请日：2005-02-23
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H01L21/48 , H01L23/498 , H01L23/50 , H01L23/64 , H01L25/16 , H05K1/02 , H05K1/18 , H05K3/46 , H01L23/52
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
摘要翻译： 片状电容器20设置在印刷电路板10中。以这种方式，IC芯片90和每个片状电容器20之间的距离缩短，并且环路电感减小。 此外，芯片电容器20被容纳在具有大厚度的芯基板30中。 因此，印刷电路板的厚度不会变大。
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公开(公告)号：US08107253B2
公开(公告)日：2012-01-31
申请号：US12034517
申请日：2008-02-20
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating layer and having a via hole opening extending to the metal film, and a first via hole structure formed in the via hole opening of the connection layer and connected to the metal film on the one or more of the electrodes of the chip capacitor.
摘要翻译： 印刷电路板包括具有电极的片状电容器和形成在一个或多个电极上的金属膜，在容纳层内容纳片状电容器的容纳层，形成在容纳层上的连接层，并且具有通孔开口延伸 以及形成在连接层的通孔开口中并连接到片式电容器的一个或多个电极上的金属膜的第一通孔结构。
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公开(公告)号：US07995352B2
公开(公告)日：2011-08-09
申请号：US12691154
申请日：2010-01-21
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
摘要翻译： 片状电容器设置在印刷电路板中。 以这种方式，IC芯片和每个芯片电容器之间的距离缩短，并且环路电感减小。 此外，芯片电容器容纳在具有大厚度的芯基板中。 因此，印刷电路板的厚度不会变大。
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18.发明申请公开(公告)号：US20100328915A1
公开(公告)日：2010-12-30
申请号：US12873815
申请日：2010-09-01
申请人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
发明人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer.
摘要翻译： 印刷电路板具有包括具有开口部的树脂基板的芯基板，形成在开口部的电容器，具有第一电极结构，具有与芯基板的上表面相对的部分，第二电极结构体具有面向 芯基板的下表面，形成在芯基板的上表面上方并具有形成在上绝缘层上的导电电路的上绝缘层和将第一电极结构的部分与导电电路电连接的通孔， 上绝缘层和下绝缘层，形成在芯基板的下表面上，并且具有形成在下绝缘层上的导电电路和将第二电极结构的部分与下部绝缘层的导电电路电连接的通孔 绝缘层。
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19.发明申请公开(公告)号：US20100014261A1
公开(公告)日：2010-01-21
申请号：US12566776
申请日：2009-09-25
申请人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
发明人： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board includes a core substrate having an opening portion, an electronic component provided in the opening portion of the core substrate and including a dielectric body, a first electrode formed over the dielectric body, and a second electrode formed over the dielectric body such that the dielectric body is interposed between the first electrode and the second electrode, and a resin filling a gap between the core substrate and the electronic component in the opening portion of the core substrate. The resin filling the gap includes a filler.
摘要翻译： 印刷电路板包括具有开口部分的芯基板，设置在芯基板的开口部分中的电子部件，包括电介质体，形成在绝缘体上的第一电极和形成在电介质体上的第二电极， 介电体插入在第一电极和第二电极之间，以及树脂填充芯基板的开口部分中的芯基板和电子部件之间的间隙。 填充间隙的树脂包括填料。
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公开(公告)号：US20080169120A1
公开(公告)日：2008-07-17
申请号：US11778139
申请日：2007-07-16
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/03
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
摘要翻译： 片状电容器20设置在印刷电路板10的芯基板30中。 这使得可以缩短IC芯片90和芯片电容器20之间的距离并减小环路电感。 由于通过以多层方式设置第一树脂基板30a，第二树脂基板30b和第三树脂基板30c构成的芯基板30d，因此芯基板30可以获得足够的强度。
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