公开(公告)号：US20090176323A1

公开(公告)日：2009-07-09

申请号：US12343191

申请日：2008-12-23

申请人： Akiko Suzuki ,  Shinetsu Fujieda ,  Tatsuoki Kono ,  Toshihide Takahashi ,  Kazuaki Ootsuka ,  Hiroaki Oshio ,  Hideo Tamura

发明人： Akiko Suzuki ,  Shinetsu Fujieda ,  Tatsuoki Kono ,  Toshihide Takahashi ,  Kazuaki Ootsuka ,  Hiroaki Oshio ,  Hideo Tamura

IPC分类号： H01L21/56

CPC分类号： C08L83/04 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2924/181 ,  H01L2924/00012

摘要： A process for producing a light-emitting semiconductor device includes: (i) mixing at least one low-molecular silane or at least one silanol with an alcohol solution containing an alkoxysiloxane to prepare a mixture solution, the amount of the silane or silanol being from 10% by weight to 50% by weight based on the dry weight of an encapsulating material to be formed; (ii) applying the mixture solution to a light-emitting element; (iii) vaporizing the alcohol solvent in the mixture solution applied and drying the residual mixture to thereby form the encapsulating material; and (iv) curing the encapsulating material.

摘要翻译： 制造发光半导体装置的方法包括：（i）将至少一种低分子硅烷或至少一种硅烷醇与含有烷氧基硅氧烷的醇溶液混合以制备混合溶液，硅烷或硅烷醇的量来自 10重量％至50重量％，基于要形成的封装材料的干重; （ii）将混合溶液施加到发光元件上; （iii）蒸发所施加的混合溶液中的醇溶剂并干燥残余混合物从而形成包封材料; 和（iv）固化封装材料。

公开(公告)号：US07531845B2

公开(公告)日：2009-05-12

申请号：US11765077

申请日：2007-06-19

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Mitsuhiro Nawashiro

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Mitsuhiro Nawashiro

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/46 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.

摘要翻译： 一种半导体发光器件，包括：具有凹部的主体，设置在所述凹部的侧壁上的台阶; 安装在所述凹部中的半导体发光元件; 和树脂层。 树脂层覆盖主体的凹部的内表面的至少一部分。 树脂层的反射率比身体的凹部的内表面高。

公开(公告)号：US20080296605A1

公开(公告)日：2008-12-04

申请号：US12155107

申请日：2008-05-29

申请人： Hiroaki Oshio ,  Kazuhiro Tamura ,  Masakata Koseki ,  Hiroko Tsukamoto ,  Tatsuichiro Maki

发明人： Hiroaki Oshio ,  Kazuhiro Tamura ,  Masakata Koseki ,  Hiroko Tsukamoto ,  Tatsuichiro Maki

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.

摘要翻译： 发光装置包括：树脂壳体，其具有在壳体的凹部的底部露出的，具有围绕发光元件的反射器部分的凹部，由金属形成的第一引线和第二引线， 在预定方向上彼此远离，并且填充在凹部中的树脂密封材料。 第一引线包括发光元件安装部分，第一引线连接部分，第一泄漏防止凹口和相对的凹口。 第二引线包括保护装置安装部分，第二导线连接部分和第二防止漏出凹口。 第一引线和第二引线被布置成使得在预定方向上，发光元件安装部分与第二防止泄漏槽相对，第一引线连接部分与保护装置安装部分相对，并且 相对的槽口与第二线连接部分相对。

公开(公告)号：US07291866B2

公开(公告)日：2007-11-06

申请号：US11149461

申请日：2005-06-10

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Takeshi Miyakawa ,  Hatsuo Takezawa

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Takeshi Miyakawa ,  Hatsuo Takezawa

IPC分类号： H01L29/22

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.

摘要翻译： 一种半导体发光器件包括：嵌入树脂; 第一引线，其具有嵌入在嵌入树脂中的第一内部引线部分和从嵌入树脂的一个侧面突出的第一外部引线部分; 第二引线，其具有嵌入在嵌入树脂中的第二内引线部分和从与嵌入树脂的一个侧面相对的侧面突出的第二外引线部分; 半导体发光芯片，安装在所述第一内引线部分的暴露于设置在所述嵌入树脂的上表面上的凹部中的部分上; 以及将半导体发光芯片与第二引线连接的线。 第一和第二内部引线部分以及第一和第二外部引线部分各自具有基本共面的后表面。 第一内引线部分的后表面的至少一部分和第二内引线部分的后表面的至少一部分未被嵌入树脂覆盖，但是露出。

公开(公告)号：USD531140S1

公开(公告)日：2006-10-31

申请号：US29242542

申请日：2005-11-14

申请人： Kuniaki Konno ,  Hiroaki Oshio

设计人： Kuniaki Konno ,  Hiroaki Oshio

公开(公告)号：US08637892B2

公开(公告)日：2014-01-28

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US08487418B2

公开(公告)日：2013-07-16

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L23/495

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US08378347B2

公开(公告)日：2013-02-19

申请号：US13289587

申请日：2011-11-04

申请人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

发明人： Satoshi Shimizu ,  Kazuhisa Iwashita ,  Teruo Takeguchi ,  Tetsuro Komatsu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Naoya Ushiyama ,  Kazuhiro Inoue ,  Gen Watari

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L21/329 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L33/50

CPC分类号： H01L33/62 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

摘要翻译： 根据一个实施例，LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。 第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。 基部的下表面的一部分，基部的侧表面，延伸部的下表面和延伸部的侧表面被树脂覆盖。 基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。 基部的下表面的一部分包括第一引线框架的第一边缘和第二引线框架的第二边缘。 第一边缘和第二边缘彼此相对。

公开(公告)号：US20120161180A1

公开(公告)日：2012-06-28

申请号：US13234509

申请日：2011-09-16

申请人： Tetsuro Komatsu ,  Hiroaki Oshio

发明人： Tetsuro Komatsu ,  Hiroaki Oshio

IPC分类号： H01L33/50 ,  H01L33/60

CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85

摘要： According to one embodiment, an LED package includes a first lead frame and a second lead frame, an LED chip and a resin body. The resin body covers the LED chip and the top face, a part of the bottom face and a part of the end face, of each of the first and the second lead frames, and exposes the remaining part of the bottom face and the remaining part of the end face. The resin body includes a first part and a second part. The first part is disposed between the top face of the LED chip and a region immediately above the LED chip of the top face of the resin body and transmits light emitted by the LED chip. The second part surrounds the first part and has a transmittance of the light lower than a transmittance in the first part.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架和第二引线框架，LED芯片和树脂体。 树脂体覆盖第一和第二引线框架中的每一个的LED芯片和顶面，底面的一部分和端面的一部分，并且暴露出底面的剩余部分和剩余部分 的端面。 树脂体包括第一部分和第二部分。 第一部分设置在LED芯片的顶面和树脂体的顶面的LED芯片的正上方的区域之间，并透射由LED芯片发出的光。 第二部分围绕第一部分并且具有低于第一部分中的透射率的光的透射率。

公开(公告)号：US20110186902A1

公开(公告)日：2011-08-04

申请号：US12886890

申请日：2010-09-21

申请人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

发明人： Hidenori Egoshi ,  Hiroaki Oshio ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto ,  Satoshi Shimizu

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片包括至少包含铟，镓和铝的半导体层，LED芯片的一个端子连接到第一引线框架，LED的另一个端子 芯片连接到第二引线框架。 树脂体覆盖LED芯片，并且整个上表面，下表面的一部分和第一引线框架和第二引线框架中的每一个的边缘表面的一部分，并且树脂体暴露下表面的其余部分 边缘表面。 并且，树脂体的外观是LED封装的外观的一部分。