摘要:
In one embodiment, a memory device includes a plurality of unit cell arrays. Each unit cell array includes an array of memory cells arranged in a plurality of columns, and each column is associated with a bit line. The memory device further includes a program control circuit configured to program cells in the plurality of unit cell arrays based on program bits associated with the plurality of unit cell arrays. For example, the program control unit is configured to simultaneously program one memory cell in each unit cell array having at least one associated program bit.
摘要:
A semiconductor memory device includes a memory cell array, an input/output (I/O) gating circuit, an error decision circuit and an error check and correction (ECC) circuit. The I/O gating circuit reads test pattern data to provide test result data in a test mode and reads a codeword in a normal mode. The error decision circuit determines the correctability of errors in the test result data by a first unit, based on the test pattern data and the test result data and provides a first error kind signal indicating a first determination result, in the test mode. The ECC circuit decodes the codeword including main data and parity data generated based on the main, determines correctability of errors in the codeword by a second unit and provides a second error kind signal indicating a second determination result, in the normal mode. The main data includes a plurality of unit data.
摘要翻译:半导体存储器件包括存储单元阵列,输入/输出(I / O)选通电路,错误判定电路和错误校验(ECC)电路。 I / O门控电路读取测试模式数据,以便在测试模式下提供测试结果数据,并以正常模式读取码字。 错误判定电路基于测试图形数据和测试结果数据,确定第一单元在测试结果数据中的错误的可校正性,并且在测试模式中提供指示第一确定结果的第一错误种类信号。 ECC电路对包括主数据和基于主数据生成的奇偶校验数据的码字进行解码,由第二单元确定码字中的错误的可校正性,并在正常模式下提供指示第二确定结果的第二错误种类信号。 主数据包括多个单位数据。
摘要:
Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.
摘要:
A nonvolatile memory device that employs a variable resistive element includes: a memory cell array having a plurality of memory cells; a first circuit block that is disposed at one side of the memory cell array and performs a first operation on the memory cells; a second circuit block that is disposed at the other side of the memory cell array and performs a second operation on the memory cells, wherein the second operation is different from the first operation; and a redundancy block that is disposed closer to the second circuit block than the first circuit block, and which compares a repair address of a repaired memory cell among the plurality of memory cells with an input address to then generate a redundancy control signal, and to supply the redundancy control signal to the first circuit block and the second circuit block.
摘要:
A semiconductor device includes phase-change memory cells and an access circuit. The access circuit generates a plurality of bitwise comparison signals indicating different comparison events for respective write and read bit groups. At least a portion of the write data is then written to the phase-change memory cells according to a number of activated comparison signals for each comparison event, as well as according to a ratio of a set current pulse width and a reset current pulse width as applied to the of phase-change memory cells.
摘要:
A semiconductor memory device includes a memory cell array, an input/output (I/O) gating circuit, an error decision circuit and an error check and correction (ECC) circuit. The I/O gating circuit reads test pattern data to provide test result data in a test mode and reads a codeword in a normal mode. The error decision circuit determines the correctability of errors in the test result data by a first unit, based on the test pattern data and the test result data and provides a first error kind signal indicating a first determination result, in the test mode. The ECC circuit decodes the codeword including main data and parity data generated based on the main data, determines correctability of errors in the codeword by a second unit and provides a second error kind signal indicating a second determination result, in the normal mode. The main data includes a plurality of unit data.
摘要:
A memory controller includes a controller input/output circuit configured to output a first command to read first data, and output a second command to read an error corrected portion of the first data. A memory device includes: an error detector, a data storage circuit and an error correction circuit. The error detector is configured to detect a number of error bits in data read from a memory cell in response to a first command. The data storage circuit is configured to store the read data if the detected number of error bits is greater than or equal to a first threshold value. The error correction circuit is configured to correct the stored data.
摘要:
In one embodiment, the semiconductor device includes a memory array and a control architecture configured to control reading data from and writing data to the memory array. The control architecture is configured to receive data and a codeword location in the memory array, select one or more data units in the received data based on a data mask, read a codeword currently stored at the codeword location in the memory array, error correct the read codeword to generate a corrected read codeword, form a new codeword from the selected data units of the received data and data units in the corrected read codeword that do not correspond to the selected data units, and write the new codeword to the memory array.
摘要:
A memory controller includes a controller input/output circuit configured to output a first command to read first data, and output a second command to read an error corrected portion of the first data. A memory device includes: an error detector, a data storage circuit and an error correction circuit. The error detector is configured to detect a number of error bits in data read from a memory cell in response to a first command. The data storage circuit is configured to store the read data if the detected number of error bits is greater than or equal to a first threshold value. The error correction circuit is configured to correct the stored data.
摘要:
In one embodiment, a memory device includes a plurality of unit cell arrays. Each unit cell array includes an array of memory cells arranged in a plurality of columns, and each column is associated with a bit line. The memory device further includes a program control circuit configured to program cells in the plurality of unit cell arrays based on program bits associated with the plurality of unit cell arrays. For example, the program control unit is configured to simultaneously program one memory cell in each unit cell array having at least one associated program bit.