公开(公告)号：US08619428B2

公开(公告)日：2013-12-31

申请号：US13206810

申请日：2011-08-10

Applicant: Han-Hsiang Lee ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

Inventor： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC: H05K7/20

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

Abstract translation: 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。

公开(公告)号：US20130093069A1

公开(公告)日：2013-04-18

申请号：US13273247

申请日：2011-10-14

Applicant: BAU-RU LU ,  JENG-JEN LI ,  CHIANG KAIPENG

Inventor： BAU-RU LU ,  JENG-JEN LI ,  CHIANG KAIPENG

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/49861 ,  H01L23/13 ,  H01L23/49524 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/83192 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/83851 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.

Abstract translation: 本发明公开了一种由金属基底和引线框组合而成的封装结构。 在一个实施例中，在金属基板中形成凹部，并且具有至少一个第一I / O端子的第一导电元件接合在凹部中。 引线框架形成在金属基板上并且包括多个电连接以与第一导电元件的所述至少一个第一I / O端子连接。 在另一个实施例中，另一导电元件设置在引线框架的空位中。 本发明还公开了一种用于制造由金属基底和引线框的组合制成的封装结构的方法。

公开(公告)号：US20110199746A1

公开(公告)日：2011-08-18

申请号：US12705389

申请日：2010-02-12

Applicant: Han-Hsiang LEE ,  Kun-Hong SHIH ,  Jeng-Jen LI

Inventor： Han-Hsiang LEE ,  Kun-Hong SHIH ,  Jeng-Jen LI

IPC: H05K7/00

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract translation: 将由安装在引线框架上的电路板制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，相对低的发热电子部件适于安装在电路板上。 金属线用于IC芯片的电路和电路板之间的电耦合。 具有复合基板的电子系统具有两个优点 - 电路板具有良好的电路布置能力和来自引线框架的良好热分布。

公开(公告)号：US07405467B2

公开(公告)日：2008-07-29

申请号：US11233578

申请日：2005-09-22

Applicant: Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Chieh Hsu ,  Chau Chun Wen

Inventor： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Chieh Hsu ,  Chau Chun Wen

IPC: H01L23/495 ,  H01L21/00 ,  H01R9/00 ,  H01R43/00

CPC classification number: H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

Abstract translation: 公开了功率模块封装结构。 控制电路制造在电路板上，而不是直接在主衬底上制造。 由于基板的尺寸缩小，所以制造成本降低。 此外，功率芯片放置在具有高导热性的材料上。 从功率芯片产生的热量可以快速传输。 因此，可以提高功率模块封装的可靠性。

公开(公告)号：US20060284340A1

公开(公告)日：2006-12-21

申请号：US11192651

申请日：2005-07-29

Applicant: Chun-Tiao Liu ,  Da-Jung Chen ,  Jeng-Jen Li ,  Chun-Liang Lin ,  Chau Wen

Inventor： Chun-Tiao Liu ,  Da-Jung Chen ,  Jeng-Jen Li ,  Chun-Liang Lin ,  Chau Wen

IPC: B29C45/14

CPC classification number: B29C45/14655 ,  B29C45/14065 ,  B29C45/1418 ,  B29C45/14336 ,  B29C2045/14131 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for preventing the overflowing of the molding compound is disclosed. The method provides a substrate that having at least a pair of outer leads. By the pressed downward the pair of outer leads as the thimble point, the substrate can contact with the mold completely without any gap therebetween, thus, the overflowing of the molding compound would not be occurred.

Abstract translation: 公开了一种防止模塑料溢出的方法。 该方法提供了具有至少一对外引线的基板。 通过向下按压一对外引线作为套管点，基板可以完全与模具接触而没有间隙，因此不会发生模塑料的溢流。

公开(公告)号：US20060267187A1

公开(公告)日：2006-11-30

申请号：US11233578

申请日：2005-09-22

Applicant: Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

Inventor： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

IPC: H01L23/34

CPC classification number: H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

Abstract translation: 公开了功率模块封装结构。 控制电路制造在电路板上，而不是直接在主衬底上制造。 由于基板的尺寸缩小，所以制造成本降低。 此外，功率芯片放置在具有高导热性的材料上。 从功率芯片产生的热量可以快速传输。 因此，可以提高功率模块封装的可靠性。

公开(公告)号：US20060220188A1

公开(公告)日：2006-10-05

申请号：US11192498

申请日：2005-07-29

Applicant: Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

Inventor： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The present invention provides a package structure, which includes a substrate, wherein the circuit has been configured within the substrate; a lead-frame having lead on the first surface of the substrate; at least one first electronic device located on the lead-frame; a second electronic device located on the first surface of the substrate whose the circuit has been configured therein; a plurality of conductive wires, which used for electrically coupling the first electronic device and second electronic device, and the second electronic device with the lead-frame; a molding compound, which used to seal the portion of substrate, the first electronic device, the second electronic device, and the portion of the lead-frame; and a metal plate, which located on the second surface of the substrate, and used to remove the heat that is generated from the first electronic device.

Abstract translation: 本发明提供一种封装结构，其包括基板，其中所述电路已经配置在所述基板内; 引线框架，其在所述基板的第一表面上具有引线; 位于引线框架上的至少一个第一电子设备; 位于基板的第一表面上的第二电子器件，其电路已经配置在其中; 用于将第一电子设备和第二电子设备电耦合的多条导线以及具有引线框架的第二电子设备; 用于密封所述基板的所述部分，所述第一电子设备，所述第二电子设备以及所述引线框架的所述部分的模塑料; 以及金属板，其位于所述基板的第二表面上，并且用于去除从所述第一电子设备产生的热量。

公开(公告)号：US10373930B2

公开(公告)日：2019-08-06

申请号：US13571378

申请日：2012-08-10

Applicant: Jeng-Jen Li ,  Bau-Ru Lu

Inventor： Jeng-Jen Li ,  Bau-Ru Lu

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498

Abstract: The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.

公开(公告)号：US08547709B2

公开(公告)日：2013-10-01

申请号：US12705389

申请日：2010-02-12

Applicant: Han-Hsiang Lee ,  Kun-Hong Shih ,  Jeng-Jen Li

Inventor： Han-Hsiang Lee ,  Kun-Hong Shih ,  Jeng-Jen Li

IPC: H05K5/02 ,  H05K7/00

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract translation: 将由安装在引线框架上的电路板制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，相对低的发热电子部件适于安装在电路板上。 金属线用于IC芯片的电路和电路板之间的电耦合。 具有复合基板的电子系统具有两个优点 - 电路板具有良好的电路布置能力和来自引线框架的良好热分布。