公开(公告)号：US20060284340A1

公开(公告)日：2006-12-21

申请号：US11192651

申请日：2005-07-29

申请人： Chun-Tiao Liu ,  Da-Jung Chen ,  Jeng-Jen Li ,  Chun-Liang Lin ,  Chau Wen

发明人： Chun-Tiao Liu ,  Da-Jung Chen ,  Jeng-Jen Li ,  Chun-Liang Lin ,  Chau Wen

IPC分类号： B29C45/14

CPC分类号： B29C45/14655 ,  B29C45/14065 ,  B29C45/1418 ,  B29C45/14336 ,  B29C2045/14131 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for preventing the overflowing of the molding compound is disclosed. The method provides a substrate that having at least a pair of outer leads. By the pressed downward the pair of outer leads as the thimble point, the substrate can contact with the mold completely without any gap therebetween, thus, the overflowing of the molding compound would not be occurred.

摘要翻译： 公开了一种防止模塑料溢出的方法。 该方法提供了具有至少一对外引线的基板。 通过向下按压一对外引线作为套管点，基板可以完全与模具接触而没有间隙，因此不会发生模塑料的溢流。

公开(公告)号：US20060267187A1

公开(公告)日：2006-11-30

申请号：US11233578

申请日：2005-09-22

申请人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

发明人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

摘要翻译： 公开了功率模块封装结构。 控制电路制造在电路板上，而不是直接在主衬底上制造。 由于基板的尺寸缩小，所以制造成本降低。 此外，功率芯片放置在具有高导热性的材料上。 从功率芯片产生的热量可以快速传输。 因此，可以提高功率模块封装的可靠性。

公开(公告)号：US20060220188A1

公开(公告)日：2006-10-05

申请号：US11192498

申请日：2005-07-29

申请人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

发明人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Hsu ,  Chau Wen

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The present invention provides a package structure, which includes a substrate, wherein the circuit has been configured within the substrate; a lead-frame having lead on the first surface of the substrate; at least one first electronic device located on the lead-frame; a second electronic device located on the first surface of the substrate whose the circuit has been configured therein; a plurality of conductive wires, which used for electrically coupling the first electronic device and second electronic device, and the second electronic device with the lead-frame; a molding compound, which used to seal the portion of substrate, the first electronic device, the second electronic device, and the portion of the lead-frame; and a metal plate, which located on the second surface of the substrate, and used to remove the heat that is generated from the first electronic device.

摘要翻译： 本发明提供一种封装结构，其包括基板，其中所述电路已经配置在所述基板内; 引线框架，其在所述基板的第一表面上具有引线; 位于引线框架上的至少一个第一电子设备; 位于基板的第一表面上的第二电子器件，其电路已经配置在其中; 用于将第一电子设备和第二电子设备电耦合的多条导线以及具有引线框架的第二电子设备; 用于密封所述基板的所述部分，所述第一电子设备，所述第二电子设备以及所述引线框架的所述部分的模塑料; 以及金属板，其位于所述基板的第二表面上，并且用于去除从所述第一电子设备产生的热量。

公开(公告)号：US07405467B2

公开(公告)日：2008-07-29

申请号：US11233578

申请日：2005-09-22

申请人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Chieh Hsu ,  Chau Chun Wen

发明人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Chieh Hsu ,  Chau Chun Wen

IPC分类号： H01L23/495 ,  H01L21/00 ,  H01R9/00 ,  H01R43/00

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

摘要翻译： 公开了功率模块封装结构。 控制电路制造在电路板上，而不是直接在主衬底上制造。 由于基板的尺寸缩小，所以制造成本降低。 此外，功率芯片放置在具有高导热性的材料上。 从功率芯片产生的热量可以快速传输。 因此，可以提高功率模块封装的可靠性。

公开(公告)号：US20070096293A1

公开(公告)日：2007-05-03

申请号：US11336973

申请日：2006-01-23

申请人： Chau Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

发明人： Chau Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

IPC分类号： H01L23/12 ,  H01L23/52

CPC分类号： H01L23/3107 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

摘要翻译： 本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。 第一基板包括在其中填充有导体的通孔。 位于第一基板的底表面上的多个引线框架。 位于两个引线框之间的第二基板。 然后，封装以覆盖上述结构的模塑料形成包装装置。 因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁 可以减少封装器件的射频干扰。

公开(公告)号：US09271398B2

公开(公告)日：2016-02-23

申请号：US13481887

申请日：2012-05-28

申请人： Da-Jung Chen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Chun-Tiao Liu

IPC分类号： H05K7/18 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/02 ,  H05K3/34

CPC分类号： H05K1/181 ,  H01F27/027 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/4902 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

摘要翻译： 电源模块包括至少一个电源组件，电感器和封装。 电感器设置在至少一个电源部件上，并且至少一个电源部件和电感器设置在封装内。 此外，电源模块还包括印刷电路板，并且至少一个电源部件和电感器安装到印刷电路板。 此外，电感器包括多个引线，其在至少一个电源部件上支撑电感器。

公开(公告)号：US09001527B2

公开(公告)日：2015-04-07

申请号：US13485954

申请日：2012-06-01

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC分类号： H05K5/02 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552

CPC分类号： H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

摘要翻译： 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。

公开(公告)号：US20120236519A1

公开(公告)日：2012-09-20

申请号：US13485954

申请日：2012-06-01

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  BAU-RU LU

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  BAU-RU LU

IPC分类号： H05K5/00 ,  H05K3/30

CPC分类号： H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

摘要翻译： 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。

公开(公告)号：US09601412B2

公开(公告)日：2017-03-21

申请号：US13612852

申请日：2012-09-13

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

公开(公告)号：US08338928B2

公开(公告)日：2012-12-25

申请号：US11847351

申请日：2007-08-30

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/02

CPC分类号： H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.