公开(公告)号：US20100090351A1

公开(公告)日：2010-04-15

申请号：US12357643

申请日：2009-01-22

Applicant: Heung-Kyu Kim ,  Young-Hwan Shin ,  Jong-Jin Lee

Inventor： Heung-Kyu Kim ,  Young-Hwan Shin ,  Jong-Jin Lee

IPC: H01L23/538

CPC classification number: H01L23/5385 ,  H01L24/13 ,  H01L24/14 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2225/1005 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: An electro component package is disclosed. The electro component package in accordance with an embodiment of the present invention includes a first package substrate having a first chip mounted on an upper surface thereof, the first chip having a through-via formed therein; a second package substrate being separated from the first package substrate and having a second chip mounted on an upper surface thereof; and a connection substrate having one end connected with an upper surface of the first chip and the other end connected with an upper surface of the second chip, the connection substrate electrically connecting the first chip with the second chip.

Abstract translation: 公开了电子部件封装。 根据本发明的实施例的电子部件封装包括：第一封装基板，其具有安装在其上表面上的第一芯片，所述第一芯片具有形成在其中的通孔; 第二封装衬底与第一封装衬底分离并且具有安装在其上表面上的第二芯片; 以及连接基板，其一端与所述第一芯片的上表面连接，所述另一端与所述第二芯片的上表面连接，所述连接基板将所述第一芯片与所述第二芯片电连接。

公开(公告)号：US20100056864A1

公开(公告)日：2010-03-04

申请号：US12515953

申请日：2007-11-21

Applicant: Jong-Jin Lee

Inventor： Jong-Jin Lee

IPC: A61B1/045 ,  H04N7/18

CPC classification number: A61B1/041 ,  A61B1/00158

Abstract: Provided are a capsule-type image photographing apparatus and endoscopy using the same. The apparatus includes a shell unit having a globular shape and a main body unit capable of freely rotating in the shell unit. The main body unit includes an image photographing system, a wireless transmitter, a battery, a counterweight for determining the center of gravity of the main body unit, and an encapsulant for fixing the image photographing system, the wireless transmitter, the battery, and the counterweight. The apparatus may be a long-distance capsule-type image photographing apparatus or a short-distance capsule-type image photographing apparatus depending on the position of the counterweight. By use of the long- and short-distance capsule-type image photographing apparatuses, the interior of the tested person's body can be effectively photographed.

Abstract translation: 提供了胶囊型图像拍摄装置和使用其的内窥镜检查。 该装置包括具有球形形状的壳单元和能够在壳单元中自由旋转的主体单元。 主体单元包括图像拍摄系统，无线发射器，电池，用于确定主体单元的重心的配重，以及用于固定图像拍摄系统，无线发射器，电池和 配重。 该装置可以是根据配重的位置的长距离胶囊型图像拍摄装置或短距离胶囊型图像拍摄装置。 通过使用长距离和短距离胶囊型图像拍摄装置，可以有效地拍摄被测试人体的内部。

公开(公告)号：US20100021108A1

公开(公告)日：2010-01-28

申请号：US12410743

申请日：2009-03-25

Applicant: Hyun-seo Kang ,  Sei-hyoung Lee ,  Kwon-seob Lim ,  Jong-jin Lee ,  Jai-sang Koh

Inventor： Hyun-seo Kang ,  Sei-hyoung Lee ,  Kwon-seob Lim ,  Jong-jin Lee ,  Jai-sang Koh

IPC: G02B6/26

CPC classification number: G02B6/4246 ,  G02B6/02095 ,  G02B6/29317 ,  G02B6/29323 ,  G02B6/4214

Abstract: An optical waveguide device and an optical communication module are provided. In the optical waveguide device which includes a core and a cladding layer formed around the core and has one end formed to be inclined so as to refract input and output signals, the core includes therein a diffraction portion for diffracting an optical signal incident through the cladding layer to propagate straight through the core. Thus, it is possible to prevent deterioration of an optical signal coupling ratio in implementing a technique of transmitting optical signals in opposite directions.

Abstract translation: 提供光波导器件和光通信模块。 在包括芯和围绕芯部形成的包覆层的光波导器件中，其一端形成为倾斜以折射输入和输出信号，其中包括衍射部分，用于衍射通过包层入射的光信号 层直接传播通过核心。 因此，在实现相反方向上发送光信号的技术中，可以防止光信号耦合比的恶化。

公开(公告)号：US20080265304A1

公开(公告)日：2008-10-30

申请号：US11896982

申请日：2007-09-07

Applicant: Se-Hoon Lee ,  Donghoon Jang ,  Jong Jin Lee ,  Jeong-Dong Choe

Inventor： Se-Hoon Lee ,  Donghoon Jang ,  Jong Jin Lee ,  Jeong-Dong Choe

IPC: H01L29/788 ,  H01L21/336

CPC classification number: H01L29/42324 ,  H01L21/28273 ,  H01L29/66825 ,  H01L29/7881

Abstract: A memory device includes a first floating gate electrode on a substrate between adjacent isolation layers in the substrate, at least a portion of the first floating gate protruding above a portion of the adjacent isolation layers, a second floating gate electrode, electrically connected to the first floating gate electrode, on at least one of the adjacent isolation layers, a dielectric layer over the first and second floating gate electrodes, and a control gate over the dielectric layer and the first and second floating gate electrodes.

Abstract translation: 存储器件包括在衬底中相邻隔离层之间的衬底上的第一浮置栅电极，第一浮置栅极的至少一部分突出在相邻隔离层的一部分上方，第二浮栅电极电连接到第一浮栅 浮栅电极，在至少一个相邻的隔离层上，第一和第二浮置栅电极之上的电介质层，以及介电层上的控制栅极以及第一和第二浮栅电极。

公开(公告)号：US20080203507A1

公开(公告)日：2008-08-28

申请号：US11892462

申请日：2007-08-23

Applicant: Kyoung-sik Moon ,  Jong-jin Lee ,  Bum-suk Kim ,  Yun-ho Jang ,  Jung-chak Ahn

Inventor： Kyoung-sik Moon ,  Jong-jin Lee ,  Bum-suk Kim ,  Yun-ho Jang ,  Jung-chak Ahn

IPC: H01L31/0224 ,  H01L21/00 ,  H01L31/0232

CPC classification number: H01L27/14636 ,  H01L27/14625 ,  H01L27/14685

Abstract: An image sensor includes a semiconductor substrate on which a plurality of photo diodes are formed. A plurality of interlayer dielectrics are formed above the semiconductor substrate, and a plurality of metal lines are formed on each of the interlayer dielectrics. A plurality of micro lenses are formed above the uppermost one of the interlayer dielectrics. The light passing through the zoom lenses is incident on the respective micro lenses. The plurality metal lines formed on at least one of the plurality of interlayer dielectrics have the same width.

Abstract translation: 图像传感器包括其上形成有多个光电二极管的半导体基板。 在半导体衬底上形成多个层间电介质，并且在每个层间电介质上形成多个金属线。 多层微透镜形成在最上面的层间电介质之上。 通过变焦镜头的光入射到相应的微透镜上。 形成在多个层间电介质中的至少一个的多个金属线具有相同的宽度。

公开(公告)号：US20080023624A1

公开(公告)日：2008-01-31

申请号：US11797561

申请日：2007-05-04

Applicant: Kyoung-Sik Moon ,  Bum-Suk Kim ,  Jong-Jin Lee ,  Yun-Ho Jang

Inventor： Kyoung-Sik Moon ,  Bum-Suk Kim ,  Jong-Jin Lee ,  Yun-Ho Jang

IPC: H01J40/14 ,  H01L31/18

CPC classification number: G02B3/08 ,  G02B3/0056 ,  G02B13/22 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14685 ,  H01L31/02165

Abstract: An image sensor may include a plurality of photodiodes for performing a photo-electric conversion and a plurality of microlenses. Each of the microlenses is formed over one of the photodiodes. The image sensor may further include a vertical light generating portion formed over the microlenses and configured to refract each of plurality of incident light rays such that the light rays are vertically incident on the microlenses.

Abstract translation: 图像传感器可以包括用于执行光电转换和多个微透镜的多个光电二极管。 每个微透镜形成在一个光电二极管上。 图像传感器还可以包括形成在微透镜上的垂直光产生部分，并被配置为折射多个入射光线中的每一个，使得光线垂直入射在微透镜上。

公开(公告)号：US20070205459A1

公开(公告)日：2007-09-06

申请号：US11653359

申请日：2007-01-16

Applicant: Eun-Suk Cho ,  Dong-Gun Park ,  Choong-Ho Lee ,  Jong-Jin Lee ,  Jeong-Dong Choe

Inventor： Eun-Suk Cho ,  Dong-Gun Park ,  Choong-Ho Lee ,  Jong-Jin Lee ,  Jeong-Dong Choe

IPC: H01L29/788

CPC classification number: H01L27/11568 ,  B82Y10/00 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/40114 ,  H01L29/40117 ,  H01L29/42324 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7854 ,  H01L29/7881 ,  H01L29/792

Abstract: A nonvolatile memory device includes a semiconductor pin including a first semiconductor pattern, a second semiconductor pattern on the first semiconductor pattern, and a third semiconductor pattern, disposed between the first semiconductor pattern and the second semiconductor pattern, connecting the first semiconductor pattern and the second semiconductor pattern, a charge storage layer on the second semiconductor pattern with a tunneling insulation layer interposed therebetween, and a gate electrode on the charge storage layer with a blocking insulation layer interposed therebetween, wherein a width of the second semiconductor pattern is greater than a width of the third semiconductor pattern.

Abstract translation: 非易失性存储器件包括：半导体引脚，包括第一半导体图案，第一半导体图案上的第二半导体图案和设置在第一半导体图案和第二半导体图案之间的第三半导体图案，将第一半导体图案和第二半导体图案 半导体图案，在第二半导体图案上的电荷存储层，其间插入有隧道绝缘层，以及在电荷存储层上的栅电极，其间插入有阻挡绝缘层，其中第二半导体图案的宽度大于宽度 的第三半导体图案。

公开(公告)号：US07227250B2

公开(公告)日：2007-06-05

申请号：US11093979

申请日：2005-03-30

Applicant: Jong Jin Lee

Inventor： Jong Jin Lee

IPC: H01L23/02

CPC classification number: H01L23/13 ,  H01L21/4803 ,  H01L21/4857 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/183 ,  H05K3/064 ,  H05K3/243 ,  H05K3/403 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09981 ,  H05K2201/10969 ,  H05K2203/1394 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a ball grid array substrate having a window formed on a core material instead of a thin core material, and wherein a semiconductor chip is mounted thereon, thereby reducing the thickness of a package, and a method of fabricating the same. The ball grid array substrate comprises a first external layer which includes first circuit patterns, wire bonding pad patterns, and a window corresponding in size to a first chip mounted therein and wherein the chip is wire-bonded to the wire bonding pad patterns. A second external layer includes second circuit patterns, a portion corresponding in position to the window of the first external layer, and solder ball pad patterns. Second chips mounted on the solder ball pad patterns. An insulating layer interposed between the first and second external layers. The window is formed through the insulating layer at a position corresponding to the window of the first external layer.

Abstract translation: 公开了一种球形阵列基板，其具有形成在芯材料上的窗口而不是薄的芯材料，并且其中安装有半导体芯片，从而减小了封装的厚度及其制造方法。 球栅阵列衬底包括第一外层，其包括第一电路图案，引线焊盘图案和尺寸对应于安装在其中的第一芯片的窗口，并且其中芯片被引线键合到引线焊盘图案。 第二外部层包括第二电路图案，对应于第一外部层的窗口的位置的部分和焊球图案。 第二芯片安装在焊球垫上。 插入在第一和第二外层之间的绝缘层。 在对应于第一外层的窗口的位置处，通过绝缘层形成窗口。

公开(公告)号：US07221410B2

公开(公告)日：2007-05-22

申请号：US10625682

申请日：2003-07-24

Applicant: Nam Su Choi ,  Jong Jin Lee ,  Dae Young Jung ,  Jin Seog Kang

Inventor： Nam Su Choi ,  Jong Jin Lee ,  Dae Young Jung ,  Jin Seog Kang

IPC: H04N5/63

CPC classification number: H04N5/64 ,  H04N5/44 ,  H04N5/63 ,  H04N21/4183

Abstract: A TV receiving module and a display apparatus and a TV receiving system using the same, wherein the TV receiving module is small in size and is detachably mounted outside or inside of the display apparatus. The TV receiving module is adapted to select and receive a TV signal of a desired broadcast from among TV signals inputted from a TV broadcast receiving antenna or cable, and provide the received TV signal. A detachable connector unit includes a first connector installed in the TV receiving module for receiving external power and an external control signal and providing the TV signal received by the TV receiving module externally, and a second connector detachably coupled with the first connector. The display apparatus is connected to the TV receiving module via the second connector of the detachable connector unit to provide the external power and external control signal to the TV receiving module, receive the TV signal from the TV receiving module and output video and audio signals of the received TV signal. The display apparatus may be an LCD monitor or a PDP TV receiver.

Abstract translation: 一种电视接收模块和显示装置以及使用该TV接收系统的TV接收系统，其中TV接收模块的尺寸小，并且可拆卸地安装在显示装置的外部或内部。 电视接收模块适于从从TV广播接收天线或电缆输入的TV信号中选择并接收所需广播的TV信号，并提供所接收的TV信号。 可拆卸连接器单元包括安装在TV接收模块中的用于接收外部电力的第一连接器和外部控制信号，并且将外部由TV接收模块接收的TV信号提供，以及可拆卸地与第一连接器耦合的第二连接器。 显示装置通过可拆卸连接器单元的第二连接器连接到TV接收模块，以将外部电源和外部控制信号提供给TV接收模块，从TV接收模块接收TV信号，并输出视频和音频信号 收到的电视信号。 显示装置可以是LCD监视器或PDP TV接收器。

公开(公告)号：US20050174910A1

公开(公告)日：2005-08-11

申请号：US11038085

申请日：2005-01-21

Applicant: Jong-Jin Lee

Inventor： Jong-Jin Lee

IPC: G11B7/00 ,  G11B7/085 ,  G11B7/09 ,  G11B15/18 ,  H02P8/22

CPC classification number: G11B7/08517 ,  G11B7/08505 ,  G11B7/08529

Abstract: There is provided a method for controlling a stepping motor by employing a micro-step mode at deceleration or acceleration of the stepping motor, which moves an optical pickup head in a full step mode or a half step mode, to minimize lens vibration of the optical pickup head. The method includes setting an initial step of the stepping motor, applying a micro-step mode to the stepping motor at the set initial step to move the optical pickup head, and after the initial step, applying a full step mode or a half step mode to the stepping motor to accelerate the optical pickup head by a desired speed. Also, the method includes setting a late step of the stepping motor, applying a full step mode or a half step mode to the stepping motor to decelerate the optical pickup head by a desired speed, and applying a micro-step mode to the stepping motor at the set late step to move the optical pickup head.

Abstract translation: 提供了一种通过在步进电机的减速或加速度下采用微步模式来控制步进电动机的方法，该步骤电动机以全步进模式或半步模式移动光学拾取头，以使光学器件的透镜振动最小化 拾音头。 该方法包括设置步进电机的初始步骤，在设定的初始步骤向步进电机施加微步模式以移动光学拾取头，并且在初始步骤之后，施加全步进模式或半步骤模式 到步进电机以以期望的速度加速光学拾取头。 此外，该方法包括设置步进电机的后期步骤，向步进电机施加全步进模式或半步模式以使光学拾取头减速所需速度，并将微步模式应用于步进电机 在设定的后期步骤移动光学头。