公开(公告)号：US08426985B2

公开(公告)日：2013-04-23

申请号：US13060763

申请日：2009-09-02

申请人： Hiroshi Matsutani ,  Takumi Ueno ,  Alexandre Nicolas ,  Ken Nanaumi

发明人： Hiroshi Matsutani ,  Takumi Ueno ,  Alexandre Nicolas ,  Ken Nanaumi

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： G03F7/0233 ,  G03F7/0045 ,  G03F7/40 ,  H01L2224/13

摘要： A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.

摘要翻译： 一种正性感光性组合物，其含有：（A）具有酚性羟基的碱溶性树脂; （B）由具有4〜100个碳原子的不饱和烃基的化合物改性的酚醛树脂; （C）通过光的作用产生酸的化合物; （D）通过加热交联成分（A）和成分（B）的热交联剂; 和（E）溶剂。

公开(公告)号：US4278786A

公开(公告)日：1981-07-14

申请号：US54796

申请日：1979-07-05

申请人： Ken Nanaumi ,  Fusaji Shoji ,  Hisashi Kohkame ,  Susumu Era

发明人： Ken Nanaumi ,  Fusaji Shoji ,  Hisashi Kohkame ,  Susumu Era

IPC分类号： C08G69/00 ,  C07C67/00 ,  C07C213/00 ,  C07C213/02 ,  C07C217/90 ,  C08G69/32 ,  H01B3/30 ,  C08G69/40

CPC分类号： C08G69/32

摘要： A heat-resistant polyamide polymer having melt-moldability is obtained by reacting an aromatic diamine having the general formula: ##STR1## with an equivalent amount of aromatic dicarboxylic acid dihalide in an organic solvent in the presence of an aqueous solution of an alkali-metal hydroxide. When an equimolar mixture of terephthalic acid dihalide and isophthalic dihalide is reacted with the diamine, polyamide polymers with good melt-moldability are obtained.

摘要翻译： 具有熔融成型性的耐热性聚酰胺聚合物通过使具有以下通式的芳族二胺与下列通式反应获得：具有下式的芳族二胺：H，Cl，CH 3 R 5 -R 6 :H，CH 3，CH 5，C 3 H 7与等量的 芳族二羧酸二卤化物在有机溶剂中，在碱金属氢氧化物水溶液的存在下进行。 当将对苯二甲酸二卤化物和间苯二甲酸二卤化物的等摩尔混合物与二胺反应时，获得具有良好熔融成型性能的聚酰胺聚合物。

公开(公告)号：US4229330A

公开(公告)日：1980-10-21

申请号：US937114

申请日：1978-08-28

申请人： Susumu Konii ,  Yukio Yoshimura ,  Ken Nanaumi ,  Kohei Yasuzawa ,  Takeshi Yoshida ,  Toyotaro Shinko

发明人： Susumu Konii ,  Yukio Yoshimura ,  Ken Nanaumi ,  Kohei Yasuzawa ,  Takeshi Yoshida ,  Toyotaro Shinko

IPC分类号： C08G8/28 ,  C08L61/14 ,  D21H17/48 ,  H05K1/03 ,  C08G8/32

CPC分类号： C08L61/14 ,  C08G8/28 ,  D21H17/48 ,  H05K1/0326 ,  Y10T428/31688 ,  Y10T428/31967

摘要： Internally plasticized phenolic resins suitable for use in preparing laminates and the like excellent in electrical properties, heat resistance, solvent resistance as well as punchability are produced by reacting a compound of the formula: ##STR1## wherein R.sub.1 is an alkylene residue having 1 to 3 carbon atoms; and R.sub.2 and R.sub.3 are independently hydrogen or a saturated or unsaturated hydrocarbon group having 1 to 3 carbon atoms, with an epoxidized vegetable oil with heating in the presence of one or more secondary and/or tertiary amines, and adding formaldehyde or one or more phenols and formaldehyde to the reaction system to further proceed the reaction.

摘要翻译： 适用于制备层压板等的电气性能，耐热性，耐溶剂性和冲击性优异的内部增塑酚醛树脂通过使下式化合物反应来制备：其中R1是具有1-3个 碳原子 R2和R3独立地为氢或具有1至3个碳原子的饱和或不饱和烃基，在一种或多种仲胺和/或叔胺存在下加热环氧化植物油，并加入甲醛或一种或多种酚 和甲醛反应进行反应。

公开(公告)号：US09786576B2

公开(公告)日：2017-10-10

申请号：US12741854

申请日：2008-11-07

申请人： Hiroshi Matsutani ,  Takumi Ueno ,  Alexandre Nicolas ,  Ken Nanaumi

发明人： Hiroshi Matsutani ,  Takumi Ueno ,  Alexandre Nicolas ,  Ken Nanaumi

IPC分类号： B32B3/30 ,  G03F7/20 ,  G03F7/004 ,  H01L23/31 ,  G03F7/023 ,  G03F7/40 ,  H01L23/00

CPC分类号： H01L23/3171 ,  G03F7/0236 ,  G03F7/40 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/24479 ,  H01L2924/00 ,  H01L2924/00014

摘要： A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

公开(公告)号：US20110250396A1

公开(公告)日：2011-10-13

申请号：US12741854

申请日：2008-11-07

申请人： Hiroshi Matsutani ,  Takumi Ueno ,  Alexandre Nicolas ,  Ken Nanaumi

发明人： Hiroshi Matsutani ,  Takumi Ueno ,  Alexandre Nicolas ,  Ken Nanaumi

IPC分类号： B32B3/30 ,  G03F7/20 ,  G03F7/004

CPC分类号： H01L23/3171 ,  G03F7/0236 ,  G03F7/40 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/24479 ,  H01L2924/00 ,  H01L2924/00014

摘要： A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

摘要翻译： 正型感光性树脂组合物包含（A）通过具有4〜100个碳原子的不饱和烃基的化合物改性的酚醛树脂; （B）通过光产生酸的化合物; （C）热交联剂; 和（D）溶剂。 根据本发明的正型感光性树脂组合物可以通过碱性水溶液显影，其效果是可以形成具有足够高的灵敏度和分辨率，优异的粘附性和良好的耐热冲击性的抗蚀剂图案。

公开(公告)号：US20060008632A1

公开(公告)日：2006-01-12

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B27/38 ,  B32B15/08 ,  C08L63/00 ,  B32B27/04

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

公开(公告)号：US06475629B1

公开(公告)日：2002-11-05

申请号：US09773705

申请日：2001-02-02

申请人： Kazumasa Takeuchi ,  Tetsuya Saito ,  Ken Nanaumi

发明人： Kazumasa Takeuchi ,  Tetsuya Saito ,  Ken Nanaumi

IPC分类号： B32B1508

CPC分类号： B32B15/08 ,  B32B3/266 ,  B32B7/12 ,  B32B15/20 ,  B32B2311/12 ,  B32B2323/10 ,  B32B2327/18 ,  B32B2367/00 ,  B32B2379/08 ,  B32B2457/00 ,  C08G18/3243 ,  C08G18/345 ,  C08G18/61 ,  C08G77/388 ,  C08G77/452 ,  C08L63/00 ,  C08L79/08 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/20 ,  C09D183/10 ,  C09J7/22 ,  C09J7/35 ,  C09J179/08 ,  C09J183/10 ,  C09J2479/08 ,  C09J2479/086 ,  H01L23/293 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K2201/0154 ,  Y10T156/1052 ,  Y10T428/12361 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12569 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/31663 ,  Y10T428/31667 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

摘要翻译： 可用于制造半导体器件的粘合膜由硅氧烷改性的聚酰胺酰亚胺树脂组合物制备，其包含100重量份的硅氧烷改性的聚酰胺酰亚胺树脂和1至200重量份的热固性树脂成分。

公开(公告)号：US5885723A

公开(公告)日：1999-03-23

申请号：US994965

申请日：1997-12-19

申请人： Atsushi Takahashi ,  Shinji Ogi ,  Koji Morita ,  Kazunori Yamamoto ,  Ken Nanaumi ,  Kiyoshi Hirosawa ,  Akinari Kida ,  Takao Hirayama ,  Toshihiko Ito ,  Hiroaki Hirakura

发明人： Atsushi Takahashi ,  Shinji Ogi ,  Koji Morita ,  Kazunori Yamamoto ,  Ken Nanaumi ,  Kiyoshi Hirosawa ,  Akinari Kida ,  Takao Hirayama ,  Toshihiko Ito ,  Hiroaki Hirakura

IPC分类号： C08F283/00 ,  C08F283/04 ,  C08L63/00 ,  H05K3/38 ,  H05K3/46 ,  B32B15/08

CPC分类号： H05K3/386 ,  C08F283/00 ,  C08F283/04 ,  C08L63/00 ,  H05K2201/012 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/249921 ,  Y10T428/29 ,  Y10T428/31551 ,  Y10T428/31725

摘要： Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

摘要翻译： 提供即使在弯曲曲率小的情况下即使弯曲也耐龟裂的印刷电路板用接合膜，即使在其半固化状态下也具有足够的机械强度，因此可以容易地进行处理，因此不是不希望的脆性，因此 切割时不产生不希望的碎屑，同时具有柔韧性和阻燃性。 接合膜可以由（i）高分子环氧树脂组成; （ii）使环氧树脂和聚酰胺反应得到的变性聚酰胺; （iii）多官能环氧树脂; 和（iv）固化剂。 优选地，变性聚酰胺包括聚亚烷基二醇残基或聚碳酸酯二醇残基。 优选地，高分子环氧树脂通过双官能环氧树脂和双官能酚醛树脂的聚合制备，并且具有等于50,000或更高的重均分子量。

公开(公告)号：US5206333A

公开(公告)日：1993-04-27

申请号：US879363

申请日：1992-05-07

申请人： Haruaki Sue ,  Ken Nanaumi ,  Takuji Itou ,  Ken Madarame ,  Shinsuke Hagiwara

发明人： Haruaki Sue ,  Ken Nanaumi ,  Takuji Itou ,  Ken Madarame ,  Shinsuke Hagiwara

IPC分类号： C08G8/08

CPC分类号： C08G8/08

摘要： A copolycondensation of a phenol, a naphthol and formaldehyde proceeds smoothly in the presence of an acid and a metallic element selected from the group consisting of transition metallic elements and metallic elements of Group IIa, Group IIIa, Group IVa, Group Va and Group VIa of the Periodic Table, and a naphthol-modified phenolic resin which has a large molecular weight and does not gel is obtained.