公开(公告)号：US20080174503A1

公开(公告)日：2008-07-24

申请号：US11966775

申请日：2007-12-28

申请人： Moon-Il KIM ,  Kook-Joo LEE ,  Hong-Teuk KIM

发明人： Moon-Il KIM ,  Kook-Joo LEE ,  Hong-Teuk KIM

IPC分类号： H01Q1/00 ,  H01Q9/16

CPC分类号： H01Q9/30 ,  H01Q9/0407 ,  H01Q9/16

摘要： An antenna and electronic equipment having the same are disclosed. The antenna comprises: a radiator electrically connected to a feeder, and radiating an electric wave; and one or more reinforcing circuits disposed in the radiator so as to uniformly distribute a current on at least one part of the radiator. The antenna can have a length much shortened than a wavelength of an operation frequency with maintaining the same efficiency, thereby being able to be mounted even in electronic equipment such as a terrestrial DMB terminal operated at a low frequency bandwidth,

摘要翻译： 公开了一种具有该天线和电子设备的天线和电子设备。 天线包括：电连接到馈电器并辐射电波的散热器; 以及设置在散热器中的一个或多个加强电路，以便在散热器的至少一部分上均匀分布电流。 天线可以具有比操作频率的波长短得多的长度，并保持相同的效率，从而即使在诸如以低频带宽工作的地面DMB终端的电子设备中也能够安装天线，

公开(公告)号：US20080052906A1

公开(公告)日：2008-03-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/02

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US08929091B2

公开(公告)日：2015-01-06

申请号：US13067131

申请日：2011-05-11

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H05K1/16 ,  H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H05K1/18

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.

摘要翻译： 一种制造具有嵌入式裸芯片的印刷电路板（PCB）的方法包括：将带粘附到具有形成在其中的穿透孔的绝缘基板的一侧，并将裸芯片附接到穿透孔内的带上，使得电极焊盘 的裸片面对磁带; 用填料填充贯通孔，取出胶带; 将金属层层压到填料的表面上以及除去带的绝缘基板; 以及通过去除金属层的部分形成电极凸块。 电极凸块的形成还包括同时去除金属层的部分并在绝缘基板的一侧上形成电路图案。 电路图案直接形成在绝缘基板的上侧，并且电极凸块形成在电极焊盘的表面上。

公开(公告)号：US08482890B2

公开(公告)日：2013-07-09

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H3/22

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。

公开(公告)号：US20130095497A1

公开(公告)日：2013-04-18

申请号：US13698924

申请日：2010-05-20

申请人： Hyun Gyu Park ,  Min-Ah Woo ,  Moon Il Kim ,  Sang-Joon Hwang ,  Dae-Yeon Cho

发明人： Hyun Gyu Park ,  Min-Ah Woo ,  Moon Il Kim ,  Sang-Joon Hwang ,  Dae-Yeon Cho

IPC分类号： C12Q1/68

CPC分类号： C12Q1/6897 ,  C12Q1/02 ,  G01N33/6815 ,  G01N2333/245

摘要： Provided are a microorganism for use in quantification of homocysteine and methionine and a method of quantifying homocysteine and methionine in a sample by using the microorganism.

摘要翻译： 提供用于定量同型半胱氨酸和甲硫氨酸的微生物以及通过使用微生物定量样品中同型半胱氨酸和甲硫氨酸的方法。

公开(公告)号：US20120291274A1

公开(公告)日：2012-11-22

申请号：US13563271

申请日：2012-07-31

申请人： Jin-Won LEE ,  Yul-Kyo CHUNG ,  Seung-Hyun SOHN ,  Moon-Il KIM

发明人： Jin-Won LEE ,  Yul-Kyo CHUNG ,  Seung-Hyun SOHN ,  Moon-Il KIM

IPC分类号： H05K3/30

CPC分类号： H05K1/18 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H05K3/30 ,  H05K3/46 ,  Y10T29/49146 ,  Y10T156/10

摘要： An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate.

摘要翻译： 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例的电子部件嵌入式印刷电路板可以包括：第一基板，其具有形成在其中的空腔;第一电子部件，以面朝下的方式嵌入在所述空腔中;第二电子部件 所述第一基板被堆叠在所述第一电子部件的上侧并以面朝上的方式嵌入所述空腔中;以及第二基板，其被堆叠在所述第一基板的上表面和下表面上。

公开(公告)号：US08184448B2

公开(公告)日：2012-05-22

申请号：US11703814

申请日：2007-02-08

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.

摘要翻译： 具有嵌入式裸芯片的PCB包括其中形成有穿透孔的绝缘基板; 填充物穿透孔内部的填充物; 嵌入填料中的裸芯片，使得在其一侧形成的电极焊盘在填料的表面露出; 以及附着到电极焊盘的表面并突出以暴露于外部的电极凸块。

公开(公告)号：US20110277320A1

公开(公告)日：2011-11-17

申请号：US13067131

申请日：2011-05-11

申请人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： H05K3/30

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A method of manufacturing a PCB that includes embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads.

摘要翻译： 一种制造PCB的方法，包括将裸芯片嵌入板中，使得裸芯片的电极焊盘露出，并在电极焊盘上形成电极凸块。

公开(公告)号：US20110176246A1

公开(公告)日：2011-07-21

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il KIM ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il KIM ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H9/00 ,  B29C65/54 ,  H05K1/18

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。

公开(公告)号：US20100154210A1

公开(公告)日：2010-06-24

申请号：US12656781

申请日：2010-02-16

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing a printed circuit board having embedded electronic components. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 一种具有嵌入式电子部件的印刷电路板的制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。