公开(公告)号：US20100309633A1

公开(公告)日：2010-12-09

申请号：US12733929

申请日：2008-09-03

Applicant: Martin Birner ,  Rainer Kreutzer ,  Hubert Schierling ,  Norbert Seliger

Inventor： Martin Birner ,  Rainer Kreutzer ,  Hubert Schierling ,  Norbert Seliger

IPC: H05K7/20 ,  H01R43/00

CPC classification number: H05K1/142 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/09963 ,  Y10T29/49117 ,  H01L2924/00

Abstract: To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.

Abstract translation: 为了改善电子电路的制造，电子电路由布置在诸如冷却体的公共基板上的子电路的模块组成，并且通过平面电接触元件电互连。

公开(公告)号：US07807931B2

公开(公告)日：2010-10-05

申请号：US10551207

申请日：2004-03-09

Applicant: Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

Inventor： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC: H05K1/16

CPC classification number: H01L23/552 ,  H01L23/49844 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/36 ,  H01L24/40 ,  H01L24/82 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/37099

Abstract: In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

Abstract translation: 在具有至少一个基板的布置中，至少一个电气部件设置在基板的表面部分上并且设置有电接触区域，并且至少一个电接触凸耳具有电接触区域的接触面积 组件。 接触片的连接区域和部件的接触区域互连，使得接触片的至少一个区域突出超出部件的区域。 接触片设置有至少一个导电膜，而导电膜设置有接触片的电连接区域。 这种布置对于功率半导体芯片的大面积低电感接触特别有用，因为它允许高电流密度。

公开(公告)号：US07402457B2

公开(公告)日：2008-07-22

申请号：US10491137

申请日：2002-09-25

Applicant: Kerstin Häse ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf ,  Matthias Rebhan

Inventor： Kerstin Häse ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf ,  Matthias Rebhan

IPC: H01L21/00

CPC classification number: H05K3/4605 ,  H01L23/051 ,  H01L23/3735 ,  H01L23/482 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/48

Abstract: A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.

Abstract translation: 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。

公开(公告)号：US20070216025A1

公开(公告)日：2007-09-20

申请号：US11728900

申请日：2007-03-27

Applicant: Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

Inventor： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC: H01L23/485

CPC classification number: H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

Abstract: A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Abstract translation: 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20070040189A1

公开(公告)日：2007-02-22

申请号：US10558285

申请日：2004-03-18

Applicant: Stephan Bolz ,  Rainer Knorr ,  Norbert Seliger

Inventor： Stephan Bolz ,  Rainer Knorr ,  Norbert Seliger

IPC: H01L31/00

CPC classification number: H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/351 ,  H02J7/0052 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A bi-directional switch has at least one first controllable semiconductor component with a first input contact, a first output contact, and a first control contact, and at least one second controllable semiconductor component with a second input contact, a second output contact, and a second control contact. The first input contact of the first semiconductor component and the second input contact of the second semiconductor component are interconnected in an electrically conducting manner, and the first control contact of the first semiconductor component and the second control contact of the second semiconductor component are interconnected in an electrically conducting manner while the first output contact of the first semiconductor component and the second output contact of the second semiconductor component are electrically insulated from each other. The semiconductor components are disposed on a common substrate that is provided with an electrically conducting coating. At least one of said semiconductor components of the switch is arranged on the electrically conducting coating in such a way that a joint contact area corresponding to at least 60 percent of the surface of the contact, which faces the coating, is created between the coating and said surface of the contact, which faces the coating. Said arrangement makes it possible to create a low-impedance, low-inductive bi-directional switch.

Abstract translation: 双向开关具有至少一个具有第一输入触点，第一输出触点和第一控制触点的第一可控半导体部件，以及具有第二输入触点，第二输出触点和至少一个第二输入触点的至少一个第二可控半​​导体部件， 第二个控制联系人。 第一半导体部件和第二半导体部件的第二输入触点的第一输入触点以导电方式互连，并且第二半导体部件的第一半导体部件和第二控制触点的第一控制触点互相连接 当第一半导体部件和第二半导体部件的第二输出触点的第一输出触点彼此电绝缘时，导电方式。 半导体部件设置在设置有导电涂层的公共基板上。 开关的所述半导体部件中的至少一个被布置在导电涂层上，使得在涂层和涂层之间产生对应于接触面的至少60％的面向涂层的接合面积 接触面的所述表面面向涂层。 所述布置使得可以产生低阻抗，低电感双向开关。

公开(公告)号：US20120133306A1

公开(公告)日：2012-05-31

申请号：US13389253

申请日：2010-07-15

Applicant: Norbert Seliger ,  Karl Weidner

Inventor： Norbert Seliger ,  Karl Weidner

IPC: H05H9/00 ,  H01J9/24

CPC classification number: H05H7/00 ,  H05H7/22 ,  H05H9/00

Abstract: The present invention relates to waveguides, e.g., waveguides in a dielectricwall accelerator, and to methods for the manufacture thereof. For example, planar contact electronic assemblies may be integrated in a waveguide e.g., a waveguide of an accelerator cell of a dielectricwall accelerator.

Abstract translation: 本发明涉及波导，例如介质壁加速器中的波导，以及其制造方法。 例如，平面接触电子组件可以集成在波导中，例如介电壁加速器的加速器单元的波导。

公开(公告)号：US20070296078A1

公开(公告)日：2007-12-27

申请号：US11793919

申请日：2005-11-21

Applicant: Mark-Matthias Bakran ,  Andreas Fuchs ,  Matthias Hofstetter ,  Hans-Joachim Knaak ,  Andreas Nagel ,  Norbert Seliger

Inventor： Mark-Matthias Bakran ,  Andreas Fuchs ,  Matthias Hofstetter ,  Hans-Joachim Knaak ,  Andreas Nagel ,  Norbert Seliger

IPC: H01L23/36 ,  H01L23/051

CPC classification number: H01L23/5389 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00

Abstract: At least one bearing body in a power semiconductor module has a surface section on which a first semiconductor component and at least one additional semiconductor component are arranged adjacent to each other. The semiconductor components have contact surfaces, oriented away from the surface section of the bearing body, that are in a contact in a planar manner to provide a flat connection line between the contact surfaces of the semiconductor components. The flat connection line has a lower inductivity and a lower instance dependency of inductivity compared to a bonding wire. A distance between the semiconductor components along the surface section is greater than a lateral measurement of at least one of the semiconductor components and can be, selectively, relatively large, allowing for thermal and/or temperature expansion and a lower thermal load of the semiconductor module than previously obtained.

Abstract translation: 功率半导体模块中的至少一个轴承体具有表面部分，第一半导体部件和至少一个附加半导体部件相邻配置在该表面部分上。 半导体部件具有远离轴承体的表面部分的接触表面，其以平面方式接触以在半导体部件的接触表面之间提供平坦的连接线。 与接合线相比，扁平连接线具有较低的电感和较低的电感的依赖性。 沿着表面部分的半导体部件之间的距离大于半导体部件中的至少一个的横向测量，并且可以选择性地相对较大，允许半导体模块的热和/或温度膨胀和较低的热负载 比以前获得的。

公开(公告)号：US20070175656A1

公开(公告)日：2007-08-02

申请号：US10551207

申请日：2004-03-09

Applicant: Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Kart Weidner ,  Jorg Zapf

Inventor： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Kart Weidner ,  Jorg Zapf

IPC: H05K1/16

CPC classification number: H01L23/552 ,  H01L23/49844 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/36 ,  H01L24/40 ,  H01L24/82 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/37099

Abstract: In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

Abstract translation: 在具有至少一个基板的布置中，至少一个电气部件设置在基板的表面部分上并且设置有电接触区域，并且至少一个电接触凸耳具有电接触区域的接触面积 组件。 接触片的连接区域和部件的接触区域互连，使得接触片的至少一个区域突出超出部件的区域。 接触片设置有至少一个导电膜，而导电膜设置有接触片的电连接区域。 这种布置对于功率半导体芯片的大面积低电感接触特别有用，因为它允许高电流密度。

公开(公告)号：US20060192290A1

公开(公告)日：2006-08-31

申请号：US10547173

申请日：2004-01-26

Applicant: Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

Inventor： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC: H01L23/48 ,  H01L21/4763

CPC classification number: H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

Abstract: A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Abstract translation: 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US07057275B2

公开(公告)日：2006-06-06

申请号：US10491129

申请日：2002-09-10

Applicant: Herbert Schwarzbauer ,  Norbert Seliger

Inventor： Herbert Schwarzbauer ,  Norbert Seliger

IPC: H01L23/10 ,  H01L23/34 ,  H01L23/52 ,  H01L23/04

CPC classification number: H01L25/162 ,  H01L23/473 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A device with power semiconductor components controlling the power of high currents has each power semiconductor component insulated and fixed to a common cooled carrier body. Conductor bars, in addition to the power semiconductor components, are fixed to the carrier body, the conductor bars being electrically insulated and placed on top of each other, whereby each semiconductor bar has a free contact surface, and one electrical contact surface of each semiconductor component is electrically connected to a conductor bar by one or several electric conductor bridges and another electrical contact surface of the power semiconductor component is electrically connected to another bar conductor by one or several conductor bridges.

Abstract translation: 具有控制高电流功率的功率半导体器件的器件具有绝缘并固定到公共冷却载体的每个功率半导体部件。 除了功率半导体部件之外，导体棒被固定到载体主体，导体条电绝缘并且放置在彼此的顶部上，由此每个半导体棒具有自由接触表面，并且每个半导体的一个电接触表面 部件通过一个或多个电导体桥电连接到导体棒，并且功率半导体部件的另一个电接触表面通过一个或多个导体电桥电连接到另一条导体。