公开(公告)号：US07807931B2

公开(公告)日：2010-10-05

申请号：US10551207

申请日：2004-03-09

申请人： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H05K1/16

CPC分类号： H01L23/552 ,  H01L23/49844 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/36 ,  H01L24/40 ,  H01L24/82 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/37099

摘要： In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

摘要翻译： 在具有至少一个基板的布置中，至少一个电气部件设置在基板的表面部分上并且设置有电接触区域，并且至少一个电接触凸耳具有电接触区域的接触面积 组件。 接触片的连接区域和部件的接触区域互连，使得接触片的至少一个区域突出超出部件的区域。 接触片设置有至少一个导电膜，而导电膜设置有接触片的电连接区域。 这种布置对于功率半导体芯片的大面积低电感接触特别有用，因为它允许高电流密度。

公开(公告)号：US20070175656A1

公开(公告)日：2007-08-02

申请号：US10551207

申请日：2004-03-09

申请人： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Kart Weidner ,  Jorg Zapf

发明人： Franz Auerbach ,  Bernd Gutsmann ,  Thomas Licht ,  Norbert Seliger ,  Kart Weidner ,  Jorg Zapf

IPC分类号： H05K1/16

CPC分类号： H01L23/552 ,  H01L23/49844 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/36 ,  H01L24/40 ,  H01L24/82 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/37099

摘要： In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

摘要翻译： 在具有至少一个基板的布置中，至少一个电气部件设置在基板的表面部分上并且设置有电接触区域，并且至少一个电接触凸耳具有电接触区域的接触面积 组件。 接触片的连接区域和部件的接触区域互连，使得接触片的至少一个区域突出超出部件的区域。 接触片设置有至少一个导电膜，而导电膜设置有接触片的电连接区域。 这种布置对于功率半导体芯片的大面积低电感接触特别有用，因为它允许高电流密度。

公开(公告)号：US07855451B2

公开(公告)日：2010-12-21

申请号：US11728900

申请日：2007-03-27

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/12 ,  H01L23/14

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US07427532B2

公开(公告)日：2008-09-23

申请号：US10547119

申请日：2004-01-23

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L21/50 ,  H01L21/48

CPC分类号： H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15798 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

摘要翻译： 根据本发明，将由电绝缘材料制成的层施加到基板和其上配置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

公开(公告)号：US07208347B2

公开(公告)日：2007-04-24

申请号：US10547173

申请日：2004-01-26

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20060252253A1

公开(公告)日：2006-11-09

申请号：US10547119

申请日：2004-01-23

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L21/4763

CPC分类号： H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15798 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

摘要翻译： 根据本发明，将由电绝缘材料制成的层施加到基板和其上布置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

公开(公告)号：US07402457B2

公开(公告)日：2008-07-22

申请号：US10491137

申请日：2002-09-25

申请人： Kerstin Häse ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf ,  Matthias Rebhan

发明人： Kerstin Häse ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jörg Zapf ,  Matthias Rebhan

IPC分类号： H01L21/00

CPC分类号： H05K3/4605 ,  H01L23/051 ,  H01L23/3735 ,  H01L23/482 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/48

摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.

摘要翻译： 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。

公开(公告)号：US20050032347A1

公开(公告)日：2005-02-10

申请号：US10491137

申请日：2001-09-25

申请人： Kerstin Hase ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jorg Zapf ,  Matthias Rebhan

发明人： Kerstin Hase ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jorg Zapf ,  Matthias Rebhan

IPC分类号： H01L23/051 ,  H01L23/373 ,  H01L23/482 ,  H01L25/07 ,  H01L25/18 ,  H05K1/03 ,  H05K3/10 ,  H05K3/32 ,  H05K3/46 ,  H01L21/44 ,  H01L21/4763

CPC分类号： H05K3/4605 ,  H01L23/051 ,  H01L23/3735 ,  H01L23/482 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/48

摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.

摘要翻译： 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。

公开(公告)号：US20070216025A1

公开(公告)日：2007-09-20

申请号：US11728900

申请日：2007-03-27

申请人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jorg Zapf

IPC分类号： H01L23/485

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20120133306A1

公开(公告)日：2012-05-31

申请号：US13389253

申请日：2010-07-15

申请人： Norbert Seliger ,  Karl Weidner

发明人： Norbert Seliger ,  Karl Weidner

IPC分类号： H05H9/00 ,  H01J9/24

CPC分类号： H05H7/00 ,  H05H7/22 ,  H05H9/00

摘要： The present invention relates to waveguides, e.g., waveguides in a dielectricwall accelerator, and to methods for the manufacture thereof. For example, planar contact electronic assemblies may be integrated in a waveguide e.g., a waveguide of an accelerator cell of a dielectricwall accelerator.

摘要翻译： 本发明涉及波导，例如介质壁加速器中的波导，以及其制造方法。 例如，平面接触电子组件可以集成在波导中，例如介电壁加速器的加速器单元的波导。