Abstract:
Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
Abstract:
Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.
Abstract:
A system for disposing high temperature solid state steel slag includes a working barrel (4), a feeding barrel (9), a liftable hydraulic bracket (12), a supporting device(13) and a transmission device(14). The working barrel (4) axially connects with the feeding barrel (9) in series. The working barrel (4) is provided with cooling and crushing medium (4-1) and spray pipe inside. A method for disposing high temperature solid state steel slag by using said system enables single feeding and multiple disposing.
Abstract:
The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.
Abstract:
A method of operating a network node comprising one or more transmit antennas that are associated with a plurality of antenna ports includes transmitting a first user-equipment—(UE-)specific reference signal on a first antenna port and reusing the first UE-specific reference signal to transmit a second UE-specific reference signal on one of the first antenna port and a second antenna port. The second UE-specific reference signal is orthogonal to the first UE-specific reference signal.
Abstract:
The embodiments of the present invention relate to methods and apparatuses (600, 700) for coordinating interference in a telecommunications LTE based system. According to exemplary embodiments, an apparatus acting as a macro radio base station (eNB) (600) is configured to decide on what radio resources to schedule to its UEs and further decide on what resources to leave unutilized. Information on the decided resources is further transmitted in an interference coordinate signalling message, to at least one relay node (RN) (700) via at least one layer (1) control channel. The interference coordination signalling message will assist the RN (700) to make its own scheduling decision based on the information in the signalling message.
Abstract:
A system level search module receives system level search user interface registration information for an application of the computing device. The registration information includes an indication of how the system level search module can launch the application. The registration information is added to a registration store, and the application is included as one of one or more applications that can be searched using the system level search user interface.
Abstract:
A retractable pen includes an improved triggering device (i.e., an actuating means), which is easy for manufacturing and user-friendly. The retractable pen has a pen-body having two pen-tubes, a pen-cartridge within the pen-body, and an actuating means. The actuating means not only triggers the movement of pen-cartridge (slidable protrusion/retraction of the pen-cartridge) but also, at the meantime, triggers length-change of pen-body (slidable movement between the two pen-tubes).
Abstract:
A retractable pen includes an outer tube whose inner surface on a front end is arranged with a plurality of axial guiding rails circularly, an inner tube whose inner surface on a rear end is disposed with a plurality of stoppers is arranged circularly, a first sleeve mounted in the outer tube and having a plurality of ratchet teeth arranged circularly on a front end thereof as well as an axial guiding rail between two adjacent ratchet teeth sliding in the axial guiding rail of the outer tube, and an elastic member elastically supported between the front end of the inner tube and the axial guiding rail of the ring tube. In use, the rear end of the inner tube is pressed so as to change the length of the retractable pen.
Abstract:
One embodiment of the communication system includes a switch, at least one base station, and a backhaul connection including at least one wireless link connecting the at least one base station to the switch. The wireless link may include at least one of a WiMax carrier and a WiFi carrier.