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公开(公告)号：US20240159794A1
公开(公告)日：2024-05-16
申请号：US18218029
申请日：2023-07-04
Applicant: okins electronics Co.,Ltd
Inventor： Jin Kook JUN , Chan Ho Lee , Jae Hyun SEO
CPC classification number: G01R1/0466 , G01R31/2886
Abstract: A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.
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公开(公告)号：US20180188290A1
公开(公告)日：2018-07-05
申请号：US15741213
申请日：2016-07-04
Applicant: OKINS ELECTRONICS CO.,LTD
Inventor： Sung Gye PARK , Jin Kook JUN
CPC classification number: G01R3/00 , G01R1/0433 , G01R31/2863 , G01R31/2896 , H05K1/0268 , H05K1/028 , H05K1/111 , H05K3/103 , H05K3/28 , H05K3/285 , H05K3/3484 , H05K3/4007 , H05K3/4015 , H05K2201/0154 , H05K2201/0162 , H05K2201/09827 , H05K2201/10234 , H05K2201/10265 , H05K2201/10287 , H05K2201/10757 , H05K2201/10795 , H05K2201/10856 , H05K2203/041 , H05K2203/1327 , H05K2203/166
Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.
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公开(公告)号：US12222367B2
公开(公告)日：2025-02-11
申请号：US18130431
申请日：2023-04-04
Applicant: okins electronics Co.,Ltd
Inventor： Jin Kook Jun , Chan Ho Lee , Seung Hyun Noh
Abstract: A contact pin for a test socket is provided in the test socket for testing the electrical characteristics of a semiconductor device. The contact pin includes an elastic part elastically deformable in the longitudinal direction of the contact pin; a first contact part which includes a first support part extending from one end of the elastic part and a first contact tip connected to an end of the first support part; and a second contact part which includes a second support part extending from the other end of the elastic part and a second contact tip connected to an end of the second support part, where the elastic part and the second contact part are bent in at least one direction with respect to the first contact part.
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公开(公告)号：US12100607B2
公开(公告)日：2024-09-24
申请号：US18452271
申请日：2023-08-18
Applicant: OKINS ELECTRONICS CO., LTD
Inventor： Jin Kook Jun , Sung Gye Park , Soung Hun Choi
IPC: H01L21/677 , H01F7/02
CPC classification number: H01L21/67721 , H01F7/0252
Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
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15.发明公开公开(公告)号：US20240291207A1
公开(公告)日：2024-08-29
申请号：US18573811
申请日：2022-06-13
Applicant: SENSORVIEW CO., LTD. , OKINS ELECTRONICS CO., LTD
Inventor： Byoung Nam KIM , Kyoung ll KANG , Jong Hyup LIM , Dong UK LEE , Jae Kun CHOI , Jin Kook JUN , Sung Gyu PARK , Jong Wook HAM
IPC: H01R13/6582
CPC classification number: H01R13/6582
Abstract: The connector assembly, according to the present invention, comprises: a receptacle arranged on a substrate; and a plug coupled to the receptacle, wherein the plug includes: a pin having one side electrically connected to a cable and having a contact portion arranged on the other side; a dielectric arranged on the outside of the pin; a shield can arranged on the outside of the dielectric; and a plug shell arranged on the outside of the shield can, wherein the receptacle comprises a first hole, the dielectric comprises a second hole in which the pin is arranged, the pin is arranged in the second hole such that the contact portion protrudes farther than the outer surface of the dielectric, and the dielectric is positioned in the first hole so that the contact portion is directly and elastically in contact with a contact point of the substrate.
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Patent Agency Ranking
公开(公告)号：US12068561B2
公开(公告)日：2024-08-20
申请号：US17723605
申请日：2022-04-19
Applicant: SENSORVIEW CO., LTD. , okins electronics Co., Ltd , Hyun Duk Kim
Inventor： Byoung Nam Kim , Kyoung Il Kang , Jin Woo Lee , Jin Kook Jun , Sung Gyu Park , Hyun Duk Kim , Jong Wook Ham , Sang Woo Han
CPC classification number: H01R31/06 , H01R24/005
Abstract: Disclosed is a cable adaptor which is connected to a cable including an outer conductor. The adaptor includes a contact pin which comes into contact with a signal pin of the cable, a first member which is conductive and disposed inside and coupled to the contact pin, a second member disposed outside and coupled to the contact pin, and a third member which is conductive and disposed outside the second member. Here, the contact pin includes a first body coupled to the second member, a first contact portion which is conductive and extends from one side of the first body to come into contact with the signal pin, and a second contact portion which extends from the other side of the first body and comes into contact with an object being tested. The third member includes a second body coupled to the second member and a third contact portion.
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公开(公告)号：US20240170864A1
公开(公告)日：2024-05-23
申请号：US18552037
申请日：2022-03-03
Applicant: SENSORVIEW CO., LTD. , OKINS ELECTRONICS CO., LTD
Inventor： Byoung Nam KIM , Kyoung Il KANG , Joung Min PARK , Sung Cheol CHO , Jin Kook JUN , Sung Gyu PARK , Soeung Chel JANG
IPC: H01R9/05 , H01R24/40 , H01R103/00
CPC classification number: H01R9/0524 , H01R24/40 , H01R2103/00
Abstract: A plug connector coupled to a receptacle connector is presented, comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor for ground surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body. The conductor for signals includes a lower portion protruding below a first portion of the top of the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion. The conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion. The lower body includes a lower housing, such that the upper portion is accommodated in the hollow portion.
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公开(公告)号：USD1024815S1
公开(公告)日：2024-04-30
申请号：US29836243
申请日：2022-04-26
Applicant: OKINS ELECTRONICS CO., LTD.
Designer： Masafumi Okuma
Abstract: FIG. 1 is a perspective view of a probe for measuring electrical characteristics showing my new design;
FIG. 2 is a front view thereof, the rear view being a mirror image thereof;
FIG. 3 is a right side view thereof, the left side view being a mirror image thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a cross-sectional view thereof taken along line 6-6 in FIG. 2;
FIG. 7 is an enlarged cross-sectional view thereof taken along line 7-7 in FIG. 2; and,
FIG. 8 is an enlarged cross-sectional view thereof taken along line 8-8 in FIG. 2.
The dashed broken lines illustrate portions of the probe for measuring electrical characteristics that form no part of the claimed design. The dot-dash broken lines define boundaries of the claimed design and form no part thereof.-
公开(公告)号：US20230395413A1
公开(公告)日：2023-12-07
申请号：US18452271
申请日：2023-08-18
Applicant: OKINS ELECTRONICS CO., LTD
Inventor： Jin Kook JUN , Sung Gye PARK , Soung Hun CHOI
IPC: H01L21/677 , H01F7/02
CPC classification number: H01L21/67721 , H01F7/0252
Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.
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公开(公告)号：US20230314472A1
公开(公告)日：2023-10-05
申请号：US18130431
申请日：2023-04-04
Applicant: okins electronics Co.,Ltd
Inventor： Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
CPC classification number: G01R1/0466 , G01R31/2863
Abstract: A contact pin for a test socket is provided in the test socket for testing the electrical characteristics of a semiconductor device. The contact pin includes an elastic part elastically deformable in the longitudinal direction of the contact pin; a first contact part which includes a first support part extending from one end of the elastic part and a first contact tip connected to an end of the first support part; and a second contact part which includes a second support part extending from the other end of the elastic part and a second contact tip connected to an end of the second support part, where the elastic part and the second contact part are bent in at least one direction with respect to the first contact part.
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