COMBINATION PARALLEL PATH HEATSINK AND EMI SHIELD
    11.
    发明申请
    COMBINATION PARALLEL PATH HEATSINK AND EMI SHIELD 审中-公开
    组合平行路加热和EMI屏蔽

    公开(公告)号:US20170071074A1

    公开(公告)日:2017-03-09

    申请号:US14846526

    申请日:2015-09-04

    Applicant: Apple Inc.

    Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

    Abstract translation: 电子设备具有具有发热部件(例如POP或SOC),散热器和EMI屏蔽结构的PCB。 组合结构可以包括位于POP / SOC顶部上方并与POP / SOC顶部热接触的顶部散热器/ EMI屏蔽件,位于POP / SOC底部下方并与POP / SOC底部热接触的底部散热器/ EMI屏蔽件,以及导热 部件位于PCB上,横向覆盖大部分POP / SOC侧面,并且与顶部和底部散热器热接触。 POP / SOC的所得热路径包括一个通过其顶部到顶部的散热器,另一个通过其底部到底部散热器,而另一个通过其侧面通过导热部件到达顶部和底部散热器 。 导热部件可以是一体地形成在PCB上的金属马蹄形垫。

    COOLING ELECTRONIC DEVICES USING FLOW SENSORS
    15.
    发明申请
    COOLING ELECTRONIC DEVICES USING FLOW SENSORS 审中-公开
    使用流量传感器冷却电子设备

    公开(公告)号:US20140185219A1

    公开(公告)日:2014-07-03

    申请号:US14197144

    申请日:2014-03-04

    Applicant: APPLE INC.

    Abstract: An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

    Abstract translation: 电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。 流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。 电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

    GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES
    16.
    发明申请
    GASKETS FOR THERMAL DUCTING AROUND HEAT PIPES 有权
    用于热管道上的热引导的垫圈

    公开(公告)号:US20130329357A1

    公开(公告)日:2013-12-12

    申请号:US13719022

    申请日:2012-12-18

    Applicant: APPLE INC.

    Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

    Abstract translation: 所公开的实施例提供了用于便携式电子设备的部件。 该部件包括垫圈,其包含围绕热管的底部设置的刚性部分,其中刚性部分在电子设备的风扇和排气口之间形成管道。 垫圈还包括结合到刚性部分的第一柔性部分,其中第一柔性部分包括在热管在电子装置中组装期间打开并且封闭在热管和刚性部分上以将管道密封 热管组装后。

    Gaskets for thermal ducting around heat pipes
    19.
    发明授权
    Gaskets for thermal ducting around heat pipes 有权
    用于热管周围热管的垫圈

    公开(公告)号:US09423841B2

    公开(公告)日:2016-08-23

    申请号:US15012661

    申请日:2016-02-01

    Applicant: Apple Inc.

    Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

    Abstract translation: 所公开的实施例提供了用于便携式电子设备的部件。 该部件包括垫圈,其包含围绕热管的底部设置的刚性部分,其中刚性部分在电子设备的风扇和排气口之间形成管道。 垫圈还包括结合到刚性部分的第一柔性部分,其中第一柔性部分包括在热管在电子装置中组装期间打开并且封闭在热管和刚性部分上以将管道密封 热管组装后。

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