公开(公告)号：US20170120416A1

公开(公告)日：2017-05-04

申请号：US15298766

申请日：2016-10-20

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  H01L21/306

CPC classification number: B24B37/20 ,  H01L21/30625

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US20160101500A1

公开(公告)日：2016-04-14

申请号：US14695778

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Jason Garcheung FUNG ,  Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Fred C. REDEKER ,  Russell Edward PERRY ,  Gregory E. MENK ,  Daniel REDFIELD

IPC: B24B37/26 ,  B24B55/02 ,  B24B37/015

CPC classification number: B24B37/26 ,  B24B37/015 ,  B24B55/02

Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。

公开(公告)号：US20230294239A1

公开(公告)日：2023-09-21

申请号：US18202013

申请日：2023-05-25

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Ankit VORA ,  Boyi FU ,  Venkat HARIHARAN ,  Mayu YAMAMURA ,  Mario CORNEJO ,  Igor ABRAMSON ,  Mo YANG ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10

CPC classification number: B24B37/24 ,  C08F283/008 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B29L2031/736

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US20230125502A1

公开(公告)日：2023-04-27

申请号：US17512555

申请日：2021-10-27

Applicant: Applied Materials, Inc.

Inventor： Shiyan JAYANATH ,  Daniel REDFIELD ,  Ashwin CHOCKALINGAM

IPC: B24B37/005 ,  B24B37/04 ,  H01L21/306

Abstract: Embodiments described herein generally relate to a surface topology measurement device that enables mapping a surface profile of a polishing pad. Embodiments of the disclosure may include a method of measuring and/or adjusting a property of a polishing surface of a polishing pad disposed in a substrate processing system during processing or after one or more processes have been performed. The method can include positioning a surface topology measurement device such that the surface topology measurement device contacts the polishing surface of the polishing pad, generating a three-dimensional surface map of the polishing surface of the polishing pad, comparing the three-dimensional surface map of the polishing surface of the polishing pad to a predetermined threshold, and adjusting one or more properties of the substrate processing system based on the comparison of the three-dimensional surface map to the predetermined threshold.

公开(公告)号：US20230052048A1

公开(公告)日：2023-02-16

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani KUMAR ,  Ashwin CHOCKALINGAM ,  Sivapackia GANAPATHIAPPAN ,  Rajeev BAJAJ ,  Boyi FU ,  Daniel REDFIELD ,  Nag B. PATIBANDLA ,  Mario Dagio CORNEJO ,  Amritanshu SINHA ,  Yan ZHAO ,  Ranga Rao ARNEPALLI ,  Fred C. REDEKER

IPC: B24B37/24 ,  B33Y80/00 ,  B33Y10/00 ,  B24D11/04 ,  B24B37/26 ,  B24D18/00 ,  B29C64/112

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US20220362904A1

公开(公告)日：2022-11-17

申请号：US17321694

申请日：2021-05-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Uma SRIDHAR ,  Yingdong LUO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Sebastian David ROZO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: B24B37/24

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.

公开(公告)号：US20220250203A1

公开(公告)日：2022-08-11

申请号：US17172152

申请日：2021-02-10

Applicant: Applied Materials, Inc.

Inventor： Puneet Narendra JAWALI ,  Veera Raghava Reddy KAKIREDDY ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/24 ,  B23K26/342 ,  B33Y80/00

Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

公开(公告)号：US20190240802A1

公开(公告)日：2019-08-08

申请号：US16259597

申请日：2019-01-28

Applicant: Applied Materials, Inc.

Inventor： Venkat HARIHARAN ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/24 ,  B24B37/26 ,  B24B37/22 ,  B29C64/112 ,  C09G1/02 ,  H01L21/321 ,  H01L21/768

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76877

Abstract: Embodiments described herein relate to methods of detecting a polishing endpoint using one or more sensors embedded in the polishing material of a polishing pad, the polishing pads, and methods of forming the polishing pads. In one embodiment, a method of polishing a substrate includes urging a to be polished surface of a substrate against a polishing surface of a polishing pad, the polishing pad having one or more sensors embedded in the polishing pad material thereof, wherein the polishing pad is mounted on a polishing platen of a polishing system, detecting a force exerted against a polishing surface of the polishing pad using the one or more sensors, converting the detected force into signal information, wirelessly communicating the signal information received from the one or more sensors to one or more interrogators disposed in the polishing platen, and changing one or more polishing conditions based on the signal information.

公开(公告)号：US20170133252A1

公开(公告)日：2017-05-11

申请号：US14935134

申请日：2015-11-06

Applicant: Applied Materials, Inc.

Inventor： Jason G. FUNG ,  Rajeev BAJAJ ,  Daniel REDFIELD ,  Aniruddh KHANNA ,  Mario CORNEJO ,  Gregory E. MENK ,  John WATKINS

IPC: H01L21/67 ,  H01L21/66 ,  B24B37/26 ,  B29C67/00 ,  B24B49/14 ,  B24B49/16 ,  B24B49/10 ,  H01L21/306 ,  B24B49/00

CPC classification number: H01L21/67253 ,  B24B37/26 ,  B24B49/003 ,  B24B49/10 ,  B24B49/14 ,  B24B49/16 ,  B29C64/106 ,  B29K2995/0003 ,  B29K2995/0005 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/30625 ,  H01L21/67075 ,  H01L21/67294 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

公开(公告)号：US20160107295A1

公开(公告)日：2016-04-21

申请号：US14885950

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh KHANNA ,  Jason G. FUNG ,  Mario CORNEJO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Ashavani KUMAR ,  Venkatachalam HARIHARAN ,  Gregory E. MENK ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Robert E. DAVENPORT ,  Amritanshu SINHA

IPC: B24D18/00 ,  B24D3/28

CPC classification number: B24D18/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.