摘要:
A physical layer interface including an auto-negotiation circuit configured to negotiate a first data transmission rate with a network client; a transceiver configured to communicate with the network client at the first data transmission rate; and a serializer interface configured to communicate with a media access controller at a second data transmission rate that is different than the first data transmission rate. The serializer interface includes a transmitter configured to replicate data received from the network client in response to the first data transmission rate being lower than the second data transmission rate.
摘要:
A system includes a sensing module and a switching module. The sensing module is configured to sense output voltages of first and second cells connected in series in a rechargeable battery stack. The switching module is configured to alternately connect a capacitance across the first cell and the second cell at a switching frequency when a difference in the output voltages is greater than or equal to a first threshold. The switching module is further configured to stop alternately connecting the capacitance when the difference is less than or equal to a second threshold, wherein the first threshold is greater than the second threshold.
摘要:
An integrated chip package includes at least one semiconductor chip. The at least one semiconductor chip includes a first surface and a second surface. The integrated chip package includes an intermediate substrate. The intermediate substrate is electrically coupled via conductive bumps to the first surface of the at least one semiconductor chip. The intermediate substrate includes at least one capacitor electrically coupled to the at least one semiconductor chip. The at least one capacitor includes a trench capacitor. The integrated chip package includes a package substrate. The package substrate includes a first surface electrically coupled to the intermediate substrate via a plurality of bonding wires.
摘要:
A system includes a transceiver configured to receive a composite signal. The composite signal is a composite of a transmit signal and a receive signal. A replica transmitter is configured to generate a replica transmit signal based on the transmit signal. A transmit canceller is configured to recover the receive signal at least in part by resistively summing the composite signal and the replica transmit signal.
摘要:
Systems and methods for operating an integrated circuit. The method includes: storing data in one or more of a plurality of locations in a memory module, wherein each location in the memory module has a corresponding memory address; storing a memory address of each location in the memory module detected to be defective in a memory repair module; detecting one or more locations in the memory module that are defective, locating one or more redundant memory elements in the memory module, and storing information in the memory repair database, the information associating the memory address of each location in the memory detected to be defective with the redundant memory elements; and physically remapping the memory addresses to a corresponding redundant memory element.
摘要:
A mobile device including a system-on-chip, which includes a mobile device control module to execute application programs for the mobile device, a solid-state disk (SSD) control module to control SSD operations, a random access memory (RAM) control module to store both SSD-related data and mobile device-related data in a single RAM, and a nonvolatile (NV) memory control module to control reading from and writing to the NV memory array. Data in the single RAM is stored into the NV memory array during an idle mode. The single RAM is powered down during the idle mode after the data in the single RAM has been stored into the NV memory array. The stored data in the NV memory array is loaded into the single RAM during a re-start mode.
摘要:
Embodiments provide a method comprising providing a multi-memory die that comprises multiple individual memory dies. Each of the individual memory dies is defined as an individual memory die within a wafer of semiconductor material during production of memory dies. The multi-memory die is created by singulating the wafer of semiconductor material into memory dies where at least one of the memory dies is a multi-memory die that includes multiple individual memory dies that are still physically connected together. The method further comprises coupling a semiconductor die to the multi-memory die.
摘要:
An integrated circuit (IC) including a first layer of a conducting material; a second layer of an insulating material, where the second layer has a first side arranged adjacent to the first layer, and a second side; and a substrate arranged adjacent to the second side of the second layer. A first well arranged in the substrate. The first well is adjacent to the second side of the second layer. The substrate and the first well have opposite doping.
摘要:
A device operable in each of active and inactive modes includes first and second processors. The first processor performs, in accordance with a first power level, both wireless and non-wireless network processing. A second processor performs wireless network processing in accordance with a second power level. While the device is operating in the active mode: the first processor and the first display are powered up; the first display displays a result of the wireless network processing or the non-wireless network processing by the first processor; and the second processor and the second display are powered down. While the device is operating in the inactive mode: the first processor and the first display are powered down; the second processor and the second display are powered up; and the second display displays a result of the wireless network related processing by the second processor.
摘要:
A slew rate enhancing system is disclosed. The slew rate enhancing system includes a first switch and a second switch each having a control terminal, a first terminal, and a second terminal. The first terminals of the first and second switches receive a first signal of a differential signal pair. The control terminals of the first and second switches receive a second signal of the differential signal pair. A first output is connected to the second terminals of the first and second switches.