公开(公告)号：US10322471B2

公开(公告)日：2019-06-18

申请号：US15326180

申请日：2015-07-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K31/02 ,  B23K35/26 ,  B23K35/00 ,  C22C13/00 ,  C22C13/02 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  B23K35/02 ,  H01L23/00 ,  B23K101/40 ,  B23K101/42

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

公开(公告)号：US20190157535A1

公开(公告)日：2019-05-23

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G. Herrick ,  Amit Patel ,  Ravindra M. Bhatkal ,  Bawa Singh

IPC: H01L33/62 ,  B23K1/005 ,  B23K1/002 ,  H01L23/00 ,  C22C13/02 ,  B23K35/26 ,  B23K1/00 ,  B23K1/08

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US09786629B2

公开(公告)日：2017-10-10

申请号：US14908986

申请日：2014-07-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Sutapa Mukherjee ,  Harish Hanchina Siddappa ,  Morgana De Avila Ribas ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/00 ,  H01L21/66 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L22/12 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/0133 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

公开(公告)号：US20170106479A1

公开(公告)日：2017-04-20

申请号：US15390861

申请日：2016-12-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC: B23K35/362 ,  B23K35/02 ,  C08L93/04 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

公开(公告)号：US20240282742A1

公开(公告)日：2024-08-22

申请号：US18582801

申请日：2024-02-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghosal ,  Remya Chandran ,  Venodh Manoharan ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/00 ,  B22F9/24 ,  B23K35/02 ,  B23K35/30 ,  B82Y40/00

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/006 ,  B22F9/24 ,  B23K35/025 ,  B23K35/302 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B82Y40/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US11411150B2

公开(公告)日：2022-08-09

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  C22C13/02 ,  H01L33/62 ,  H01L23/00 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  H01L33/64

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20210205935A1

公开(公告)日：2021-07-08

申请号：US17149503

申请日：2021-01-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Remya Chandran ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Bawa Singh

IPC: B23K35/30 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C09C1/62 ,  B23K35/02 ,  B23K35/36

Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

公开(公告)号：US10821557B2

公开(公告)日：2020-11-03

申请号：US16098367

申请日：2017-05-02

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana De Avila Ribas ,  Suresh Telu ,  Pritha Choudhury ,  Anil K. N. Kumar ,  Siuli Sarkar

IPC: B23K1/00 ,  B23K35/26 ,  C22C13/02

Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

公开(公告)号：US09751159B2

公开(公告)日：2017-09-05

申请号：US15390861

申请日：2016-12-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC: B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  C08L93/04 ,  C08K11/00 ,  H05K3/34 ,  B23K101/42

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.