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公开(公告)号：US10456886B2
公开(公告)日：2019-10-29
申请号：US15394044
申请日：2016-12-29
Applicant: Applied Materials, Inc.
Inventor： Sivapackia Ganapathiappan , Nag B. Patibandla , Rajeev Bajaj , Daniel Redfield , Fred C. Redeker , Mahendra C. Orilall , Boyi Fu , Mayu Yamamura , Ashwin Chockalingam
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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公开(公告)号：US10384330B2
公开(公告)日：2019-08-20
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Aniruddh Khanna , Jason G. Fung , Mario Cornejo , Ashwin Chockalingam , Mayu Yamamura , Veera Raghava Reddy Kakireddy , Ashavani Kumar , Venkat Hariharan , Gregory E. Menk , Fred C. Redeker , Nag B. Patibandla , Hou T. Ng , Robert E. Davenport , Amritanshu Sinha
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20190009388A1
公开(公告)日：2019-01-10
申请号：US16130939
申请日：2018-09-13
Applicant: Applied Materials, Inc.
Inventor： Mahendra Christopher Orilall , Rajeev Bajaj , Fred C. Redeker
Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.
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公开(公告)号：US09776361B2
公开(公告)日：2017-10-03
申请号：US14863409
申请日：2015-09-23
Applicant: Applied Materials, Inc.
Inventor： Kasiraman Krishnan , Daniel Redfield , Russell Edward Perry , Gregory E. Menk , Rajeev Bajaj , Fred C. Redeker , Nag B. Patibandla , Mahendra C. Orilall , Jason G. Fung
IPC: B29C67/00 , B24B37/22 , B24B37/26 , B29K105/16 , B29L31/00
CPC classification number: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/001 , B29K2105/16 , B29K2995/007 , B29L2031/736
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
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公开(公告)号：US09486893B2
公开(公告)日：2016-11-08
申请号：US14285545
申请日：2014-05-22
Applicant: Applied Materials, Inc.
Inventor： Hung Chen , Rajeev Bajaj , Brian J. Brown , Robert T. Lum , Fred C. Redeker
IPC: H01L21/302 , B24B53/017 , B24B37/26 , B26F3/00 , B23K26/36 , B26D3/06
CPC classification number: B24B53/017 , B23K26/36 , B24B37/26 , B26D3/06 , B26F3/004
Abstract: Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.
Abstract translation: 除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。 抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。 一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。 该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。
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Patent Agency Ranking
公开(公告)号：US20160176021A1
公开(公告)日：2016-06-23
申请号：US14575608
申请日：2014-12-18
Applicant: Applied Materials, Inc.
Inventor： Mahendra Christopher Orilall , Rajeev Bajaj , Fred C. Redeker
CPC classification number: B24D11/001 , B24D3/32 , B24D11/00 , B29C35/0805 , B29C35/0888 , B29C2035/0822 , B29C2035/0827
Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.
Abstract translation: 制造化学机械抛光垫的方法包括将含有丙烯酸酯官能团的聚合物前体引入模具中，在聚合物前体中提供研磨颗粒和光引发剂以形成混合物，并且当混合物包含在底板和 模具的顶盖，通过模具的透明部分将混合物暴露于紫外线辐射，以使聚合物前体形成自由基，通过使自由基彼此交联从聚合物前体形成聚合物基质。 抛光层包括其中分散有磨料颗粒的聚合物基质。
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公开(公告)号：US20150371907A1
公开(公告)日：2015-12-24
申请号：US14312470
申请日：2014-06-23
Applicant: Applied Materials, Inc.
Inventor： Wei Lu , Zhihong Wang , Wen-Chiang Tu , Zhefu Wang , Hassan G. Iravani , Boguslaw A. Swedek , Fred C. Redeker , William H. McClintock
IPC: H01L21/66 , H01L21/306
CPC classification number: H01L22/14 , H01L21/3212 , H01L22/26 , H01L22/30
Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.
Abstract translation: 用于制造集成电路的衬底具有具有多个导电互连的层。 衬底包括半导体本体，设置在半导体本体上的电介质层，设置在电介质层中的第一沟槽中的导电材料的多条导电线，以提供导电互连，以及设置导电材料的闭合导电环结构 在介质层的第二沟槽中。 闭合的导电回路不与任何导电线电连接。
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公开(公告)号：US12138733B2
公开(公告)日：2024-11-12
申请号：US17684285
申请日：2022-03-01
Applicant: Applied Materials, Inc.
Inventor： Ekaterina A. Mikhaylichenko , Fred C. Redeker , Brian J. Brown , Chirantha Rodrigo , Steven M. Zuniga , Jay Gurusamy
Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
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公开(公告)号：US11471999B2
公开(公告)日：2022-10-18
申请号：US16042016
申请日：2018-07-23
Applicant: Applied Materials, Inc.
Inventor： Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24D11/04 , B24B37/26 , B24D18/00 , B24B37/16 , B24B37/20 , B33Y80/00 , B33Y10/00 , B29C64/112 , B33Y30/00 , H01L21/306
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US20220281062A1
公开(公告)日：2022-09-08
申请号：US17684285
申请日：2022-03-01
Applicant: Applied Materials, Inc.
Inventor： Ekaterina A. Mikhaylichenko , Fred C. Redeker , Brian J. Brown , Chirantha Rodrigo , Steven M. Zuniga , Jay Gurusamy
Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
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