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    Electroplating systems and methods with increased metal ion concentrations
    11.
    发明授权
    Electroplating systems and methods with increased metal ion concentrations 有权

    公开(公告)号：US11686005B1

    公开(公告)日：2023-06-27

    申请号：US17587063

    申请日：2022-01-28

    Applicant: Applied Materials, Inc.

    Inventor： Kwan Wook Roh ,  Charles Sharbono ,  Kyle M. Hanson

    IPC: C25D3/38 ,  C25D7/12 ,  C25D21/14 ,  C25D17/00

    CPC classification number: C25D3/38 ,  C25D7/12 ,  C25D17/001 ,  C25D17/002 ,  C25D21/14

    Abstract: Electroplating methods and systems are described that include adding a metal-ion-containing starting solution to a catholyte to increase a metal ion concentration in the catholyte to a first metal ion concentration. The methods and systems further include measuring the metal ion concentration in the catholyte while the metal ions electroplate onto a substrate and the catholyte reaches a second metal ion concentration that is less than the first metal ion concentration. The methods and systems additionally include adding a portion of an anolyte directly to the catholyte when the catholyte reaches the second metal ion concentration. The addition of the portion of the anolyte increases the metal ion concentration in the catholyte to a third metal ion concentration that is greater than or about the first metal ion concentration.

    SEAL APPARATUS FOR AN ELECTROPLATING SYSTEM
    13.
    发明申请
    SEAL APPARATUS FOR AN ELECTROPLATING SYSTEM 审中-公开

    公开(公告)号：US20190323141A1

    公开(公告)日：2019-10-24

    申请号：US16386456

    申请日：2019-04-17

    Applicant: Applied Materials, Inc.

    Inventor： Kyle M. Hanson ,  Manjunatha Vishwanatha Adagoor ,  Karthikeyan Balaraman ,  Karthick Vasu ,  Shailesh Chouriya

    IPC: C25D17/00 ,  C25D17/06

    Abstract: Electroplating system seals may include an annular busbar characterized by an inner annular radius and an outer annular radius. The annular busbar may include a plurality of contact extensions. The seals may include an external seal member characterized by an inner annular radius and an outer annular radius. The external seal member may be vertically aligned with and extend inward of the contact extensions at the inner annular radius of the external seal member. The external seal member may include an interior surface at least partially facing the contact extensions. The seals may also include an internal seal member extending a first distance along the interior surface of the external seal member from the inner annular radius. The internal seal member may include a deformable material configured to support a substrate between the internal seal member and the plurality of contact extensions.

    Flow battery systems
    14.
    发明授权
    Flow battery systems 有权
    流动电池系统

    公开(公告)号：US09160025B2

    公开(公告)日：2015-10-13

    申请号：US14460122

    申请日：2014-08-14

    Applicant: Applied Materials, Inc.

    Inventor： Gregory J. Wilson ,  Kyle M. Hanson

    IPC: H01M8/18 ,  H01M8/02 ,  H01M8/20 ,  H01M4/42 ,  H01M12/08

    CPC classification number: H01M8/186 ,  H01M4/42 ,  H01M8/0232 ,  H01M8/0245 ,  H01M8/188 ,  H01M8/20 ,  H01M12/08 ,  H01M2250/00 ,  Y02E60/528

    Abstract: Embodiments of the invention generally provide for flow battery cells and systems containing a plurality of flow battery cells, and methods for improving metal plating within the flow battery cell, such as by flowing and exposing the catholyte to various types of cathodes. In one embodiment, a flow battery cell is provided which includes a cathodic half cell and an anodic half cell separated by an electrolyte membrane, wherein the cathodic half cell contains a plurality of cathodic wires extending perpendicular or substantially perpendicular to and within the catholyte pathway and in contact with the catholyte, and each of the cathodic wires extends parallel or substantially parallel to each other. In some examples, the plurality of cathodic wires may have at least two arrays of cathodic wires, each array contains at least one row of cathodic wires, and each row extends along the catholyte pathway.

    Abstract translation: 本发明的实施例通常提供了包含多个流动电池单元的流动电池单元和系统，以及用于改善流动电池单元内的金属电镀的方法，例如通过将阴极电解液流过和暴露于各种类型的阴极。 在一个实施例中，提供了流动电池单元，其包括阴极半电池和由电解质膜分离的阳极半电池，其中阴极半电池包含垂直于或基本垂直于阴极电解液通道延伸的多个阴极线， 与阴极电解液接触，并且每个阴极线彼此平行或基本平行延伸。 在一些示例中，多个阴极线可以具有至少两个阴极线阵列，每个阵列包含至少一排阴极线，并且每排沿着阴极电解液通道延伸。

    Fluid recovery in semiconductor processing
    16.
    发明授权
    Fluid recovery in semiconductor processing 有权

    公开(公告)号：US11788200B2

    公开(公告)日：2023-10-17

    申请号：US17735464

    申请日：2022-05-03

    Applicant: Applied Materials, Inc.

    Inventor： Sam Lee ,  Kyle M. Hanson ,  Eric J. Bergman

    IPC: C25D17/00 ,  C25D21/08 ,  H01L21/02 ,  H01L21/67

    CPC classification number: C25D21/08 ,  C25D17/001 ,  H01L21/02068 ,  H01L21/6715

    Abstract: Exemplary electroplating apparatuses may include a system head operable to clamp a substrate. The system head may be operable to raise and lower the substrate between a plating bath, a first position above the plating bath, and a second position above the first position. The electroplating apparatuses may include a plating bath vessel adapted to hold the plating bath for electroplating on the substrate. The electroplating apparatuses may include a weir extending about the plating bath vessel. The electroplating apparatuses may include a first nozzle extending through the weir at a first radial position, and positioned to deliver fluid to the substrate at the first position above the plating bath. The electroplating apparatuses may include a second nozzle extending through the weir at a second radial position, and positioned to deliver fluid to the substrate at the second position above the plating bath.

    Apparatus for post exposure bake
    17.
    发明授权
    Apparatus for post exposure bake 有权

    公开(公告)号：US11550224B2

    公开(公告)日：2023-01-10

    申请号：US17001399

    申请日：2020-08-24

    Applicant: Applied Materials, Inc.

    Inventor： Kyle M. Hanson ,  Gregory J. Wilson ,  Viachslav Babayan

    IPC: G03F7/38 ,  C23C16/56 ,  H01L21/67 ,  C23C16/54 ,  H01L21/677

    Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

    FLUID RECOVERY IN SEMICONDUCTOR PROCESSING
    18.
    发明申请
    FLUID RECOVERY IN SEMICONDUCTOR PROCESSING 有权

    公开(公告)号：US20220259756A1

    公开(公告)日：2022-08-18

    申请号：US17735464

    申请日：2022-05-03

    Applicant: Applied Materials, Inc.

    Inventor： Sam Lee ,  Kyle M. Hanson ,  Eric J. Bergman

    IPC: C25D21/08 ,  H01L21/02 ,  H01L21/67 ,  C25D17/00

    Abstract: Exemplary electroplating apparatuses may include a system head operable to clamp a substrate. The system head may be operable to raise and lower the substrate between a plating bath, a first position above the plating bath, and a second position above the first position. The electroplating apparatuses may include a plating bath vessel adapted to hold the plating bath for electroplating on the substrate. The electroplating apparatuses may include a weir extending about the plating bath vessel. The electroplating apparatuses may include a first nozzle extending through the weir at a first radial position, and positioned to deliver fluid to the substrate at the first position above the plating bath. The electroplating apparatuses may include a second nozzle extending through the weir at a second radial position, and positioned to deliver fluid to the substrate at the second position above the plating bath.

    Cleaning components and methods in a plating system
    20.
    发明授权
    Cleaning components and methods in a plating system 有权

    公开(公告)号：US11241718B2

    公开(公告)日：2022-02-08

    申请号：US16386646

    申请日：2019-04-17

    Applicant: Applied Materials, Inc.

    Inventor： Joseph Antony Jonathan ,  Kyle M. Hanson ,  Jason A. Rye ,  James E. Brown ,  Gregory J. Wilson ,  Eric J. Bergman ,  Tricia A. Youngbull ,  Timothy G. Stolt

    IPC: C25D21/08 ,  B08B1/00 ,  C25D17/00

    Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.

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