公开(公告)号：US12062744B2

公开(公告)日：2024-08-13

申请号：US16975771

申请日：2019-10-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin Di ,  Ke Wang ,  Guoqiang Wang ,  Zhiwei Liang ,  Renquan Gu ,  Yingwei Liu ,  Qi Yao ,  Zhanfeng Cao

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/387 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

公开(公告)号：US20240079354A1

公开(公告)日：2024-03-07

申请号：US18271117

申请日：2021-10-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao ,  Qi Yao ,  Guangcai Yuan ,  Yuelei Xiao ,  Yue Li

IPC: H01L23/64 ,  H01L23/00 ,  H01L23/498 ,  H01L23/522

CPC classification number: H01L23/642 ,  H01L23/49822 ,  H01L23/5227 ,  H01L24/30 ,  H01L2224/30505 ,  H01L2224/30515 ,  H01L2924/1205 ,  H01L2924/1206

Abstract: The present disclosure provides a base plate integrating passive devices and a method for manufacturing the same, which relate to the technical field of radio frequency devices. The base plate integrating passive devices of the present disclosure includes a substrate base plate and the passive devices disposed on the substrate base plate, the passive devices including at least an inductor, the inductor including a plurality of open ring portions arranged and connected in sequence in a direction away from the base plate, wherein an interlayer dielectric layer is disposed between the open ring portions disposed adjacently, and the open ring portions disposed adjacently are electrically connected through a first via hole penetrating the interlayer dielectric layer; orthographic projections of any two of the open ring portions on the substrate base plate at least partially overlap.

公开(公告)号：US11869897B2

公开(公告)日：2024-01-09

申请号：US17057546

申请日：2020-03-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/127 ,  H01L27/1251

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11728202B2

公开(公告)日：2023-08-15

申请号：US16758074

申请日：2019-01-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhanfeng Cao ,  Muxin Di ,  Ke Wang ,  Zhiwei Liang ,  Renquan Gu

IPC: B32B43/00 ,  H01L21/683 ,  H01L21/677 ,  H01L33/62

CPC classification number: H01L21/6838 ,  H01L21/67742 ,  H01L33/62 ,  B32B43/006 ,  Y10T156/1168 ,  Y10T156/19

Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

公开(公告)号：US11488987B2

公开(公告)日：2022-11-01

申请号：US16650690

申请日：2019-10-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu ,  Shuang Liang ,  Zhiwei Liang ,  Muxin Di ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L27/12 ,  H01L25/065 ,  H01L25/16 ,  H01L27/15 ,  H01L25/075

Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.

公开(公告)号：US11386837B2

公开(公告)日：2022-07-12

申请号：US17254088

申请日：2020-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Yingwei Liu ,  Zhiwei Liang ,  Muxin Di ,  Wusheng Li

IPC: G09G3/3225 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.

公开(公告)号：US10720512B2

公开(公告)日：2020-07-21

申请号：US15793299

申请日：2017-10-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei Liu

IPC: H01L29/66 ,  H01L29/786 ,  G06K9/00 ,  H01L27/12 ,  H01L29/49

Abstract: This disclosure discloses a production method of a thin-film transistor, a thin-film transistor, a display apparatus, and a fingerprint recognition unit. Said method comprises the steps of: sequentially depositing a metal layer and an indium zinc oxide layer as a protective layer on a substrate; etching the metal layer and the indium zinc oxide layer to form a first electrode and a second electrode of a photosensitive device; and forming a photoelectric semiconductor of the photosensitive device on the first electrode.

公开(公告)号：US09640295B2

公开(公告)日：2017-05-02

申请号：US14527518

申请日：2014-10-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Can Wang ,  Fang Liu ,  Yingwei Liu

IPC: H01L23/48 ,  H01B1/02 ,  B32B15/01 ,  C23C14/16 ,  C23C14/18

Abstract: The present disclosure relates to an aluminum electrode, a method of forming an aluminum electrode and an electronic device therewith. An aluminum electrode according to one aspect of the present disclosure comprises: a bottom layer consisting of molybdenum; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to one embodiment of the present disclosure eliminates the mouse bite phenomenon. An aluminum electrode according to another aspect of the present disclosure comprises: a bottom layer consisting of a metal or metal-alloy nitride; a top layer consisting of molybdenum; and an aluminum layer located between the bottom layer and the top layer, wherein the bottom layer, the top layer and the aluminum layer are formed at a temperature below 120° C. An aluminum electrode according to another embodiment of the present disclosure eliminates both of the mouse bite phenomenon and the undercut phenomenon, and can further arrive at a desired profile angle by controlling the content of nitrogen.

公开(公告)号：US12057520B2

公开(公告)日：2024-08-06

申请号：US16918753

申请日：2020-07-01

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhiwei Liang ,  Ke Wang ,  Zhanfeng Cao ,  Shuang Liang

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/0093 ,  H01L27/156 ,  H01L33/486 ,  H01L33/56 ,  H01L2933/005

Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.

公开(公告)号：US11764343B2

公开(公告)日：2023-09-19

申请号：US16982217

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Zhijun Lv ,  Ke Wang ,  Zhanfeng Cao ,  Hsuanwei Mai ,  Guangcai Yuan ,  Muxin Di

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0753 ,  H01L2224/0219 ,  H01L2224/02166 ,  H01L2224/02185 ,  H01L2224/03013 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/0518 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2933/0066

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.