公开(公告)号：US20080185671A1

公开(公告)日：2008-08-07

申请号：US12011933

申请日：2008-01-30

申请人： Chien-Ping Huang ,  Cheng-Yi Chang ,  Chang-Yueh Chan

发明人： Chien-Ping Huang ,  Cheng-Yi Chang ,  Chang-Yueh Chan

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2924/00014

摘要： A sensor semiconductor package and a fabrication method thereof are provided in the present application. The fabrication method comprises steps of: forming a plurality of grooves on a wafer between bond pads on active surfaces of every adjacent chips; forming metal layers in the grooves for electrically connecting with the bond pads of adjacent chips; thinning the non-active surfaces to expose the metal layers therefrom; forming a cover layer on the non-active surfaces with the metal layers are exposed therefrom; forming a solder resist layer on the covering layer and the conductive wirings with terminals of the conductive wirings are exposed therefrom; and cutting along cutting paths between every sensor chips to form a plurality of sensor semiconductor packages. Accordingly, the prior art problems such as misalignment of forming beveled grooves, concentrated stress and breakage can be solved.

摘要翻译： 在本申请中提供了一种传感器半导体封装及其制造方法。 该制造方法包括以下步骤：在每个相邻芯片的有源表面上的接合焊盘之间的晶片上形成多个凹槽; 在所述凹槽中形成用于与相邻芯片的接合焊盘电连接的金属层; 使非活性表面变薄从而使金属层露出; 在金属层的非活性表面上形成覆盖层从其露出; 在覆盖层上形成阻焊层，并且导电布线与导电配线的端子相接触; 并且沿着每个传感器芯片之间的切割路径切割以形成多个传感器半导体封装。 因此，可以解决现有技术的问题，例如形成斜槽的未对准，集中应力和断裂。

公开(公告)号：US07858446B2

公开(公告)日：2010-12-28

申请号：US11982516

申请日：2007-11-02

申请人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

发明人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

IPC分类号： H01L21/48 ,  H01L21/50 ,  H01L21/78

CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012

摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。

公开(公告)号：US20080203511A1

公开(公告)日：2008-08-28

申请号：US12072369

申请日：2008-02-26

申请人： Chien-Ping Huang ,  Cheng-Yi Chang ,  Chang-Yueh Chan

发明人： Chien-Ping Huang ,  Cheng-Yi Chang ,  Chang-Yueh Chan

IPC分类号： H01L31/0224 ,  H01L21/60

CPC分类号： H01L31/0203 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/29 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/83 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention provides a sensor-type semiconductor package and a method for fabricating the same. The method includes the steps of: providing a wafer having a plurality of sensor chips for mounting the wafer on a carrier board having an insulation layer, a plurality of conductive traces, and a substrate; forming a plurality of grooves among the solder pads on the active surfaces of the adjacent sensor chips, so as to expose the conductive traces and form a metal layer in the grooves, to electrically connect to the solder pads on the active surfaces of the adjacent sensor chips and the conductive traces; disposing a transparent medium on the wafer to cover the sensing areas of the sensor chips; removing the substrate, so as to expose the conductive traces and the insulation layer; and cutting the sensor chips along the borders to form a plurality of sensor-type semiconductor packages. This can avoid the formation of slanted grooves on the non-active surface on the wafer and shift in position of the grooves due to failure to align with the cutting lines among the sensor chips, as observed in prior art. Consequently, the problems such as stress concentration and cracking are likely to occur in the contact points of the traces formed in the slanted grooves and the traces in the active surfaces.

摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该方法包括以下步骤：提供具有多个传感器芯片的晶片，用于将晶片安装在具有绝缘层，多个导电迹线和基板的载体板上; 在相邻传感器芯片的有效表面上的焊盘之间形成多个凹槽，以便露出导电迹线并在沟槽中形成金属层，以电连接到邻近传感器的有源表面上的焊盘 芯片和导电迹线; 在晶片上布置透明介质以覆盖传感器芯片的感测区域; 去除衬底，以便露出导电迹线和绝缘层; 并且沿着边界切割传感器芯片以形成多个传感器型半导体封装。 这可以避免在晶片上的非活性表面上形成斜槽，并且由于与现有技术中观察到的传感器芯片中的切割线不对准而使槽的位置移位。 因此，在倾斜槽中形成的迹线和活性表面中的迹线的接触点中可能会出现应力集中和开裂等问题。

公开(公告)号：US20080105942A1

公开(公告)日：2008-05-08

申请号：US11982516

申请日：2007-11-02

申请人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

发明人： Chien-Ping Huang ,  Tse-Wen Chang ,  Chang-Yueh Chan ,  Cheng-Yi Chang

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012

摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。

公开(公告)号：US20110198782A1

公开(公告)日：2011-08-18

申请号：US13092319

申请日：2011-04-22

申请人： Chih-Kuang Yang ,  Cheng-Yi Chang

发明人： Chih-Kuang Yang ,  Cheng-Yi Chang

IPC分类号： H05K3/10 ,  H05H1/24

CPC分类号： H05K3/28 ,  H05K3/0058 ,  H05K3/381 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2203/016 ,  H05K2203/065 ,  H05K2203/0759 ,  H05K2203/095 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.

摘要翻译： 公开了多层基板的多层基板和多层基板的制造方法。 通过使用载体交替地在其上形成介电层和金属结构层。 每个电介质层与相邻的电介质层粘合以将金属结构层嵌入与其对应的电介质层中。 与现有技术相比，当热压和粘附不同材料的不同层时，必须使用预浸料，本发明采用较少的工艺，因此在不使用预浸料的情况下，材料种类较少。 因此，本发明可以提高制造多层基板的整体质量和产率，以满足多层基板的机械特性匹配并降低整个制造工艺的成本。 重要的是，根据本发明的具有薄介电层的多层基板因此可以满足阻抗匹配的关注，并且可以减少串扰影响以保持良好的信号完整性。

公开(公告)号：US20110175135A1

公开(公告)日：2011-07-21

申请号：US13074125

申请日：2011-03-29

申请人： Chin-Ching Chen ,  Cheng-Yi Chang ,  Ming-Kuei Lin

发明人： Chin-Ching Chen ,  Cheng-Yi Chang ,  Ming-Kuei Lin

IPC分类号： H01L33/62 ,  H05K1/11

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion.

摘要翻译： 提供了包括芯片安装区域，第一焊盘和连接部分的基座。 LED芯片安装在芯片安装区域。 第一焊盘与LED芯片的电极电连接。 连接部分具有第一中空部分，并且设置在芯片安装区域和第一焊接区之间。 第一中空部分位于芯片安装区域和第一焊接区之间。 第一中空部位于连接部的中央部。

公开(公告)号：US20110266589A1

公开(公告)日：2011-11-03

申请号：US13183439

申请日：2011-07-15

申请人： Chih-Chia Tsai ,  Cheng-Yi Chang ,  Ming-Kuei Lin

发明人： Chih-Chia Tsai ,  Cheng-Yi Chang ,  Ming-Kuei Lin

IPC分类号： H01L33/48 ,  H01L33/52

CPC分类号： H01L33/483 ,  H01L23/3121 ,  H01L23/49506 ,  H01L23/49861 ,  H01L24/48 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.

摘要翻译： 公开了一种发光二极管（LED）封装及其制造方法。 一方面，发光二极管封装的制造方法可以：加热第一透光绝缘材料，使第一透光绝缘材料成为粘性构件; 将引线框架连接到粘性部件; 执行芯片接合步骤，其使用透光胶将至少一个发光二极管芯片粘合在粘性构件上; 用第二透光绝缘材料封装所述至少一个发光二极管芯片; 并且进行形成粘性构件和第二透光绝缘材料的干燥步骤。

公开(公告)号：US07982227B2

公开(公告)日：2011-07-19

申请号：US11592192

申请日：2006-11-03

申请人： Cheng-Yi Chang

发明人： Cheng-Yi Chang

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00 ,  B23K1/00 ,  B23K5/00

CPC分类号： H01L33/486 ,  H01L24/16 ,  H01L2924/12041 ,  H01L2924/00

摘要： A base apparatus includes a base and two finger devices. The base has a first surface and two opposite sides. The finger devices are respectively mounted on the sides of the base, are made of conductive material, and each of the finger devices has multiple fingers. The fingers are extended on the first surface of the base, wherein the fingers of a first finger device are arranged respectively corresponding to the fingers of a second finger device whereby each pair of corresponding fingers supports an illuminating device. The base has a height, each of the fingers has a width and the width is smaller than the height. When the LED is mounted onto a substrate, the LED can be mounted on the substrate by its side so that an entire assembly height of the LED is reduced and is equal to the width of the LED.

摘要翻译： 基本装置包括基座和两个手指装置。 底座具有第一表面和两个相对的两侧。 手指装置分别安装在基座的侧面上，由导电材料制成，并且每个手指装置具有多个指状物。 指状物在基部的第一表面上延伸，其中第一手指装置的指状物分别对应于第二手指装置的手指布置，由此每对相应的手指支撑照明装置。 基座具有高度，每个手指具有宽度，宽度小于高度。 当LED安装到基板上时，LED可以通过其侧面安装在基板上，使得LED的整个组装高度减小并且等于LED的宽度。

公开(公告)号：US06843926B2

公开(公告)日：2005-01-18

申请号：US10092977

申请日：2002-03-07

申请人： Yu-Chih Lai ,  Cheng-Yi Chang ,  Shih-Shun Chen

发明人： Yu-Chih Lai ,  Cheng-Yi Chang ,  Shih-Shun Chen

IPC分类号： H01L21/00 ,  C23F1/00 ,  H05H1/00

CPC分类号： H01L21/67259 ,  H01J2237/32 ,  H01L21/67069

摘要： A method and apparatus for measuring a wafer position on a lower electrode in a plasma etching device are disclosed herein. A wafer is generally placed on a lower electrode in a process chamber of a plasma etching device. Such a wafer (i.e., semiconductor wafer) generally comprises a front side and a back side. A differential pressure gradient between the front side and the back side of the wafer is determined, and thereafter, a position of the wafer on the lower electrode can be measured utilizing the differential pressure gradient.

摘要翻译： 本文公开了一种用于测量等离子体蚀刻装置中的下电极上的晶片位置的方法和装置。 晶片通常放置在等离子体蚀刻装置的处理室中的下电极上。 这样的晶片（即，半导体晶片）通常包括前侧和后侧。 确定晶片的前侧和后侧之间的压差梯度，然后可以利用差压梯度来测量晶片在下电极上的位置。

公开(公告)号：US20070252167A1

公开(公告)日：2007-11-01

申请号：US11600126

申请日：2006-11-16

申请人： Chung-Fu Chen ,  Cheng-Yi Chang ,  Chih-Chia Tsai

发明人： Chung-Fu Chen ,  Cheng-Yi Chang ,  Chih-Chia Tsai

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L2224/48091 ,  H04N5/2256 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface mounting optoelectronic device is provided. The surface mounting optoelectronic device comprises a circuit board, a conductive layer, an auto-focus LED chip, a flash LED chip, a reflector and an encapsulant. The auto-focus LED chip and the flash LED chip are located on the conductive layer. The reflector is located on the edge of the circuit board. The encapsulant is filled into the reflector to hermetically seal the auto-focus LED chip and the flash LED chip.

摘要翻译： 提供表面贴装光电器件。 表面安装光电器件包括电路板，导电层，自动聚焦LED芯片，闪光LED芯片，反射器和密封剂。 自动对焦LED芯片和闪光LED芯片位于导电层上。 反射器位于电路板的边缘。 将密封剂填充到反射器中以气密地密封自动聚焦LED芯片和闪光LED芯片。