Abstract:
Circuitry includes a voltage-controlled switch having a transmitter input, a receiver input, and an output that connects to one of the transmitter input and the receiver input. Passive components form a low-pass filter that is electrically connected to the transmitter input. The passive components are part of a multilayer ceramic passive module that includes a base body made of superimposed dielectric layers and electrically conductive layers. The voltage-controlled switch is on an upper portion or a lower portion of the base body.
Abstract:
A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure, also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.
Abstract:
An electrical multilayer component includes a base body having stacked ceramic dielectric and metallization layers that are formed into component structures among the dielectric layers. Solder contacts are on the underside of the base body. Plated through-holes connect the component structures to the solder contacts. The plated through-holes have at least cross section that widens upward away from the solder contact.
Abstract:
A transmitter module for mobile radio applications includes a multilayer module substrate with levels of metallization and intervening dielectric stacks in which a circuit is implemented by structuring the levels of metallization. In or on the module substrate, at least one HF filter or adjustment network is implemented. On the underside of the module substrate, a cutout, in which a chip element is soldered in a flip-chip-arrangement, is provided. The rear of the chip element pointing to the outside displays a metallization that makes a good thermal contact of the chip element with extrinsic circuit surroundings possible.
Abstract:
A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.
Abstract:
A strip transmission filter having resonators with impedance skips in which the resonators are provided in a ceramic substrate. The strip transmission filter also includes capacitive couplings. The ceramic substrate has a metallic coating on all sides except for a face side. The coupling structures are at the face side of the substrate. The ceramic substrate is constructed in a stepped formation in a region of the coupling structures and at least one ground terminal. Thus, the adhesion of metallic coating is increased which, in turn, facilitates soldering.
Abstract:
Compositions containing p-dinitrosobenzene deposited onto a support of a chemically inert material which is solid at room temperature are provided. The composition is preferably formed by depositing p-dinitrosobenzene from a solution or by sublimation or in the course of its synthesis in the presence of one or more supports. Hydrophilic or hydrophobic silica, hydrophobicized zeolites, carbon blacks and layer silicates are examples of supports. The composition is useful in the production of adhesives, more particularly for bonding elastomers, e.g. in the polymerization or crosslinking of elastomers, and even more particularly in the bonding of rubber to metal.
Abstract:
A circuit arrangement for a mobile radio device includes a first transmission path for a first communication system with TDD duplex operation and a second transmission path for a second communication system with FDD duplex operation. The first transmission path contains a first transmission filter and the second transmission path contains a first duplexer. The first and second communication systems use transmission frequency bands that are arranged within the same octave. A transmitted signal from the first communication system can be routed switchably and thus either via the first or the second transmission path.
Abstract:
Circuitry includes a terminal for a high-frequency signal, at least two signal lines, a switching unit for connecting the terminal to a signal line, and a primary protection device for protecting against electrostatic discharges. The primary protection device is between the terminal and the switching unit. The primary protection device includes a first element that diverts voltages having a pulse height greater than 200V relative to a reference potential.
Abstract:
An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.