公开(公告)号：US20060261467A1

公开(公告)日：2006-11-23

申请号：US10908615

申请日：2005-05-19

Applicant: Evan Colgan ,  David Edwards ,  Benjamin Fasano ,  Kamal Sikka ,  Jeffrey Zitz ,  Wei Zou

Inventor： Evan Colgan ,  David Edwards ,  Benjamin Fasano ,  Kamal Sikka ,  Jeffrey Zitz ,  Wei Zou

IPC: H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

Abstract translation: 公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。 特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。 放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。 芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

公开(公告)号：US20060094296A1

公开(公告)日：2006-05-04

申请号：US10904198

申请日：2004-10-28

Applicant: David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller

Inventor： David Edwards ,  Ronald Hering ,  David Long ,  Jason Miller

IPC: H01R13/73

CPC classification number: H05K7/142

Abstract: An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.

Abstract translation: 公开了一种扩展的支座连接器，其包括具有通过套环的壁的狭缝的套环，锥形内表面和被配置为接合电路板的安装开口的内部的外表面。 包括螺纹部分和构造成与套环的锥形内表面配合的基本锥形部分的紧固件被放置在套环内并且前进以扩展套环以安装电路板。 还公开了一种用于安装电路板的相关方法。 由于膨胀仅是水平的（纯径向），所以从电路板的顶部到底部的更均匀的径向膨胀被施加到电路板上，并且可以保持电路板和散热器之间的最佳匹配对准。

公开(公告)号：US20060060636A1

公开(公告)日：2006-03-23

申请号：US10711501

申请日：2004-09-22

Applicant: Glenn Daves ,  David Edwards ,  Mukta Farooq ,  Frank Pompeo

Inventor： Glenn Daves ,  David Edwards ,  Mukta Farooq ,  Frank Pompeo

IPC: B23K31/02

CPC classification number: B23K3/0638 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

Abstract translation: 一种用于组装的方法，并且所得到的电子模块包括使用第一焊料互连阵列将芯片附接到衬底，并且使用第二焊料互连阵列将衬底附接到衬底，第二焊料互连阵列可以是单熔体或双 - 熔融焊料阵列。 第二焊料互连阵列完全位于限定在板和衬底之间的空间内。 在该空间内设有抗蠕变结构，用于维持限定的空间并优化第二焊料互连阵列的完整性。 抗蠕变结构可以包括底部填充材料，球，支架，框架，套环或其组合。 其中抗蠕变结构是底部填充材料，在将基板完全用底部填充材料完全封装第二互连阵列之前，或者在具有底部填充材料的不连续位置部分地封装第二焊料互连阵列之前，衬底附着到板上是至关重要的。

公开(公告)号：US20060016839A1

公开(公告)日：2006-01-26

申请号：US10894687

申请日：2004-07-20

Applicant: David Edwards

Inventor： David Edwards

IPC: B62D43/00

CPC classification number: B60R11/06 ,  B60R2011/0036 ,  B62D43/10

Abstract: An apparatus is provided for securing tools with respect to a spare wheel for a vehicle. The apparatus includes a hub member that is adapted for selective securement to a central area of a spare wheel. At least one securement structure is provided on the hub member. At least one strap member is secured to the at least one securement structure. The at least one strap member is adjustable to at least partially define a variably sized opening and is configured to selectively secure at least one tool within the variably sized opening.

Abstract translation: 提供了一种用于相对于用于车辆的备用轮固定工具的装置。 该装置包括一个适于选择性地固定到备用轮的中心区域的轮毂件。 在轮毂构件上设置至少一个固定结构。 至少一个带构件被固定到所述至少一个固定结构。 所述至少一个带状构件是可调节的，以至少部分地限定可变尺寸的开口，并且构造成选择性地将至少一个工具固定在可变尺寸的开口内。

公开(公告)号：US20050097379A1

公开(公告)日：2005-05-05

申请号：US10700989

申请日：2003-11-04

Applicant: David Edwards

Inventor： David Edwards

IPC: G06F1/20 ,  G06F1/26 ,  H01L23/42

CPC classification number: G06F1/26 ,  G06F1/206 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y02D10/16 ,  H01L2924/00

Abstract: The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor module between a lower power state such as a zero power, nap or sleep state and a full power state over a predetermined time period. This allows the rate of movement and strain rate of the thermal interface material within the semiconductor module to be controlled, thus preserving the reliability of the material. Typically, the power is changed over time between the lower power state and the full power state in a linear fashion or incrementally.

Abstract translation: 本发明提供了一种用于控制半导体模块的功率变化的方法。 具体地说，在本发明的范围内，在预定时间段内，在诸如零功率，睡眠状态或睡眠状态的较低功率状态和全功率状态之间施加功率或从半导体模块中去除功率。 这允许控制半导体模块内的热界面材料的移动速度和应变速率，从而保持材料的可靠性。 通常，功率随着时间的推移在低功率状态和全功率状态之间以线性方式或递增地改变。

公开(公告)号：US20050083564A1

公开(公告)日：2005-04-21

申请号：US10975173

申请日：2004-10-28

Applicant: Prakash Mallya ,  Yi-Hung Chiao ,  David Edwards ,  Kal Li ,  Xin-Jiu Wang ,  Sriram Venkatasanthanam ,  Nagarajan Srivatsan ,  Pradeep Iyer

Inventor： Prakash Mallya ,  Yi-Hung Chiao ,  David Edwards ,  Kal Li ,  Xin-Jiu Wang ,  Sriram Venkatasanthanam ,  Nagarajan Srivatsan ,  Pradeep Iyer

IPC: G02F1/139 ,  G02B20060101 ,  G02B26/00 ,  G02F1/01 ,  G02F1/03 ,  G02F1/07 ,  G02F1/1333 ,  G02F1/1334 ,  G02F1/1345 ,  G02F1/137

CPC classification number: G02F1/13718 ,  G02F1/1334 ,  G02F1/13737 ,  G02F2201/086 ,  G02F2201/30 ,  G02F2201/50 ,  G02F2201/501 ,  G02F2202/026 ,  G02F2202/04

Abstract: The present invention is directed to an electrically switchable laminate construction for applications including smart windows, and other uses and applications in which light management is desired. The electro-optical laminate construction has scattering and transparent modes of operation for dynamically controlling electromagnetic radiation flow.

Abstract translation: 本发明涉及一种用于包括智能窗户以及期望光管理的其它用途和应用的应用的可电切换层压结构。 电光层压结构具有散射和透明的操作模式，用于动态控制电磁辐射流。

公开(公告)号：US20050060724A1

公开(公告)日：2005-03-17

申请号：US10974060

申请日：2004-10-27

Applicant: John Skinner ,  David Edwards

Inventor： John Skinner ,  David Edwards

IPC: G06F3/00 ,  G06F9/44 ,  G06F9/54

CPC classification number: G06F9/452

Abstract: A method of integrating an Xt Intrinsics based toolkit with a JAVA application. The application includes a process thread that implements an X event loop and an application thread that suspends execution of the event loop to allow a call to be made through the JAVA Native Interface to a toolkit or a widget to cause something to be displayed. The application thread includes a write socket to communicate a token to a read socket of the event loop, and performs a blocking read suspending the thread. The event loop returns an acknowledgment token via a write socket to a read socket of the thread that unblocks its blocking read and the event loop invokes its own blocking read suspending its execution. The file descriptor function, XtAppAddInput, preferably, is used to read the token and to set the blocking read. After a toolkit call is made, a token is sent from a second write socket of the thread to a second read socket of the event loop that unblocks its blocking read resuming the event loop. JAVA multithreading support services, such as JAVA's wait and notifyAll methods, are employed in multithreaded applications to ensure that only one thread at a time can make a call. Use of a separate Intrinsics application context to service the event loop is employed, windows are managed in separate hierarchies associated with each application context, and a special JAVA Canvas manages native windows transparent to the programmer.

Abstract translation: 将基于Xt Intrinsics的工具包与JAVA应用程序集成的方法。 该应用程序包括一个实现X事件循环的进程线程和一个挂起事件循环执行的应用程序线程，以允许通过JAVA Native Interface对工具包或小部件进行调用，以使某些内容显示出来。 应用程序线程包括一个写入套接字，用于将令牌传递给事件循环的读取套接字，并执行阻止读取挂起该线程。 事件循环通过写套接字将确认令牌发送到线程的读套接字，该套接字解除阻塞其读取的阻塞，并且事件循环调用其自身的阻塞读取暂停其执行。 文件描述符函数XtAppAddInput最好用于读取令牌并设置阻塞读取。 在进行工具包调用之后，令牌从线程的第二个写入套接字发送到事件循环的第二个读取套接字，该套接字解除其阻止读取恢复事件循环的阻塞。 JAVA多线程支持服务（如JAVA的wait和notifyAll方法）被用于多线程应用程序，以确保一次只能有一个线程进行调用。 使用单独的Intrinsics应用程序上下文来维护事件循环，Windows将在与每个应用程序上下文相关联的单独层次结构中进行管理，而特殊的JAVA Canvas可以管理对程序员透明的本机窗口。

公开(公告)号：US20050057075A1

公开(公告)日：2005-03-17

申请号：US10663270

申请日：2003-09-16

Applicant: David Edwards

Inventor： David Edwards

IPC: B62D25/08 ,  B62D27/06 ,  B62D29/04 ,  B62D43/10 ,  B62D25/00

CPC classification number: B62D27/065 ,  B62D25/087 ,  B62D29/048 ,  B62D43/10

Abstract: Exemplary embodiments of a fastening system include an object with a securement structure and a mounting structure fastened with respect to the securement structure. The fastening system further includes a bearing member with a first portion for bearing against the bearing surface of the securement structure and a second portion for bearing against the bearing surface of the mounting structure. The bearing member may be biased such that the bearing surfaces of the securement and mounting structures both simultaneously receive compressive force from the respective first and second portions of the bearing member.

Abstract translation: 紧固系统的示例性实施例包括具有固定结构的物体和相对于固定结构固定的安装结构。 紧固系统还包括具有用于抵靠固定结构的支承表面的第一部分的轴承部件和用于支承安装结构的支承表面的第二部分。 轴承构件可以被偏置，使得固定和安装结构的支承表面同时承受来自轴承构件的相应的第一和第二部分的压缩力。

公开(公告)号：US20050042257A1

公开(公告)日：2005-02-24

申请号：US10955833

申请日：2004-09-30

Applicant: Mark Dewis ,  David Edwards ,  Lesley Kendrick ,  Maria Wright ,  Amir Yusuf

Inventor： Mark Dewis ,  David Edwards ,  Lesley Kendrick ,  Maria Wright ,  Amir Yusuf

IPC: A23L27/00 ,  A23L27/20 ,  A23L27/29 ,  A61K47/00 ,  A23L2/00

CPC classification number: A23G3/36 ,  A23G3/48 ,  A23G4/06 ,  A23G4/068 ,  A23L27/2022 ,  A23L27/29 ,  C11B9/0011

Abstract: This invention pertains to a method for flavoring an ingestible composition with a flavoring agent in organoleptically purified form, unaccompanied by substances of natural origin present in mango. The flavoring agent may be used in a wide variety of ingestible vehicles such as chewing gum compositions, hard and soft confections, dairy products, beverage products including juice drinks and juice products, green vegetable and chicken products, and the like. The present invention also pertains to an ingestible composition comprising an ingestible vehicle and an organoleptically effective amount of the purified flavoring agent. The present invention further pertains to ethyl 3-mercaptobutyrate represented by the formula, CH3(SH)CHCH2COOCH2CH3, in purified form, unaccompanied by substances of natural origin present in mango. The present invention still further pertains to a method to confer, enhance, improve, or modify the odor properties of a perfuming composition or a perfumed article, which comprises adding to the perfuming composition or perfumed article, ethyl 3-mercaptobutyrate represented by the formula, CH3(SH)CHCH2COOCH2CH3. The present invention still further pertains to a perfuming composition or a perfumed article containing as an active perfuming ingredient, ethyl 3-mercaptobutyrate represented by the formula, CH3(SH)CHCH2COOCH2CH3. The present invention also pertains to a method for preparing ethyl 3-mercaptobutyrate which comprises reacting ethyl crotonate with sodium hydrogen sulfide and sodium bicarbonate to form the disulfide dimer of ethyl 3-mercaptobutyrate followed by reducing the disulfide dimer to yield ethyl 3-mercaptobutyrate.

Abstract translation: 本发明涉及一种通过感官纯化形式调味具有调味剂的可摄入组合物的方法，不伴随芒果中存在的天然来源的物质。 调味剂可以用于各种可摄取的载体，例如口香糖组合物，硬和软糖果，乳制品，饮料产品，包括果汁饮料和果汁产品，绿色蔬菜和鸡肉制品等。 本发明还涉及包含可摄入载体和感官有效量的纯化调味剂的可摄取组合物。 本发明还涉及以通式CH3（SH）CHCH2COOCH2CH3表示的3-巯基丁酸乙酯，纯化形式，不含芒果中存在的天然来源的物质。 本发明还涉及赋予，增强，改善或改善加香组合物或加香制品的气味性质的方法，其包括向加香组合物或香料制品中加入由式表示的3-巯基丁酸乙酯， CH3（SH）CHCH2COOCH2CH3。 本发明还涉及含有作为活性加香成分的由式CH3（SH）CHCH2COOCH2CH3表示的3-巯基丁酸乙酯的加香组合物或香料制品。 本发明还涉及制备3-巯基丁酸乙酯的方法，该方法包括使巴豆酸乙酯与硫化氢钠和碳酸氢钠反应，形成3-巯基丁酸乙酯的二硫化物二聚物，然后还原二硫化物二聚物，得到3-巯基丁酸乙酯。

公开(公告)号：US10758812B2

公开(公告)日：2020-09-01

申请号：US15896033

申请日：2018-02-13

Applicant: David Edwards

Inventor： David Edwards

IPC: A63F3/06 ,  A63F11/00

Abstract: Portable holders for supporting lottery tickets and the scratching off of coatings therefrom. In some embodiments, the holders may include substantially planar surfaces having top edges, bottom edges, left side edges, and right side edges, the top edges being opposite to the bottom edges, and the left side edges being parallel and opposite to the right side edges; at least one slot and/or notch disposed along the surfaces and configured to hold lottery tickets on the surfaces; and trays attached to the bottom edges of the surfaces and configured to collect particulates there within.