公开(公告)号：US07898061B2

公开(公告)日：2011-03-01

申请号：US11741436

申请日：2007-04-27

申请人： James S. Dunn ,  David L. Harame ,  Jeffrey B. Johnson ,  Alvin J. Joseph

发明人： James S. Dunn ,  David L. Harame ,  Jeffrey B. Johnson ,  Alvin J. Joseph

IPC分类号： H01L29/73

CPC分类号： H01L29/7371 ,  H01L27/0823 ,  H01L29/66242

摘要： A method of forming a semiconductor device having two different strains therein is provided. The method includes forming a strain in a first region with a first straining film, and forming a second strain in a second region with a second straining film. Either of the first or second strains may be either tensile or compressive. Additionally the strains may be formed at right angles to one another and may be additionally formed in the same region. In particular a vertical tensile strain may be formed in a base and collector region of an NPN bipolar transistor and a horizontal compressive strain may be formed in the extrinsic base region of the NPN bipolar transistor. A PNP bipolar transistor may be formed with a compression strain in the base and collector region in the vertical direction and a tensile strain in the extrinsic base region in the horizontal direction.

摘要翻译： 提供了形成其中具有两个不同应变的半导体器件的方法。 该方法包括在具有第一应变膜的第一区域中形成应变，并且在第二区域中用第二应变膜形成第二应变。 第一或第二应变中的任一种可以是拉伸的或压缩的。 此外，菌株可以彼此成直角形成，并且可以另外形成在相同的区域中。 特别地，可以在NPN双极晶体管的基极和集电极区域中形成垂直拉伸应变，并且可以在NPN双极晶体管的非本征基极区域中形成水平压缩应变。 PNP双极晶体管可以在垂直方向的基极和集电极区域中形成压缩应变，并且在水平方向上在外部基极区域中形成拉伸应变。

公开(公告)号：US07002221B2

公开(公告)日：2006-02-21

申请号：US10604988

申请日：2003-08-29

申请人： Marwan H. Khater ,  James S. Dunn ,  David L. Harame ,  Alvin J. Joseph ,  Qizhi Liu ,  Francois Pagette ,  Stephen A. St. Onge ,  Andreas D. Stricker

发明人： Marwan H. Khater ,  James S. Dunn ,  David L. Harame ,  Alvin J. Joseph ,  Qizhi Liu ,  Francois Pagette ,  Stephen A. St. Onge ,  Andreas D. Stricker

IPC分类号： H01L23/62

CPC分类号： H01L29/66287 ,  H01L29/1004 ,  H01L29/66242 ,  H01L29/732 ,  H01L29/7378

摘要： A bipolar transistor with raised extrinsic base and selectable self-alignment between the extrinsic base and the emitter is disclosed. The fabrication method may include the formation of a predefined thickness of a first extrinsic base layer of polysilicon or silicon on an intrinsic base. A dielectric landing pad is then formed by lithography on the first extrinsic base layer. Next, a second extrinsic base layer of polysilicon or silicon is formed on top of the dielectric landing pad to finalize the raised extrinsic base total thickness. An emitter opening is formed using lithography and RIE, where the second extrinsic base layer is etched stopping on the dielectric landing pad. The degree of self-alignment between the emitter and the raised extrinsic base is achieved by selecting the first extrinsic base layer thickness, the dielectric landing pad width, and the spacer width.

公开(公告)号：US06815802B2

公开(公告)日：2004-11-09

申请号：US10122857

申请日：2002-04-15

申请人： Jack Oon Chu ,  Douglass Duane Coolbaugh ,  James Stuart Dunn ,  David R. Greenberg ,  David L. Harame ,  Basanth Jagannathan ,  Robb Allen Johnson ,  Louis D. Lanzerotti ,  Kathryn Turner Schonenberg ,  Ryan Wayne Wuthrich

发明人： Jack Oon Chu ,  Douglass Duane Coolbaugh ,  James Stuart Dunn ,  David R. Greenberg ,  David L. Harame ,  Basanth Jagannathan ,  Robb Allen Johnson ,  Louis D. Lanzerotti ,  Kathryn Turner Schonenberg ,  Ryan Wayne Wuthrich

IPC分类号： H01L27082

CPC分类号： H01L29/66242 ,  H01L21/02381 ,  H01L21/02447 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L29/1004 ,  H01L29/161 ,  H01L29/7378

摘要： A SiGe bipolar transistor containing substantially no dislocation defects present between the emitter and collector region and a method of forming the same are provided. The SiGe bipolar transistor includes a collector region of a first conductivity type; a SiGe base region formed on a portion of said collector region; and an emitter region of said first conductivity type formed over a portion of said base region, wherein said collector region and said base region include carbon continuously therein. The SiGe base region is further doped with boron.

公开(公告)号：US5266813A

公开(公告)日：1993-11-30

申请号：US825230

申请日：1992-01-24

申请人： James H. Comfort ,  David L. Harame ,  Scott R. Stiffler

发明人： James H. Comfort ,  David L. Harame ,  Scott R. Stiffler

IPC分类号： H01L21/76 ,  H01L21/762 ,  H01L21/763 ,  H01L31/12

CPC分类号： H01L21/763 ,  H01L21/76224

摘要： The present invention is an isolation structure for use with FET or bipolar devices incorporating a silicon-germanium layer in which the semiconductor devices are isolated by trench structures. A trench is etched through a pad layer, a single crystal silicon layer, a silicon-germanium layer, and finally, into the silicon substrate. The silicon-germanium layer is interposed between the single crystal silicon layer and the silicon substrate and the pad layer covers the single crystal silicon layer. The trench sidewall exposes the silicon-germanium layer. A single crystal silicon layer is formed as a trench liner. This silicon trench liner is then oxidized to passivate the trench isolation. The trench can then be filled with a dielectric without the devices being affected by parasitic leakage caused by the silicon-germanium layer exposed by the trench isolation.

公开(公告)号：US4889819A

公开(公告)日：1989-12-26

申请号：US196398

申请日：1988-05-20

申请人： Bijan Davari ,  Eti Ganin ,  David L. Harame ,  George A. Sai-Halasz

发明人： Bijan Davari ,  Eti Ganin ,  David L. Harame ,  George A. Sai-Halasz

IPC分类号： H01L21/265

CPC分类号： H01L21/26513 ,  H01L21/26506

摘要： Shallow junctions of a first conductivity type in a semiconductor of the opposite conductivity type are fabricated by doping the substrate with a dopant of an opposite conductivity type than the first conductivity type to preamorphize portions of the substrate. The dopant of the opposite conductivity type must have a molecular weight that is higher than the molecular weight of the substrate. The substrate is then doped with the dopant of the first conductivity type to form the shallow junctions.

公开(公告)号：US08927357B2

公开(公告)日：2015-01-06

申请号：US13294731

申请日：2011-11-11

申请人： Kevin K. Chan ,  John J. Ellis-Monaghan ,  David L. Harame ,  Qizhi Liu ,  John J. Pekarik

发明人： Kevin K. Chan ,  John J. Ellis-Monaghan ,  David L. Harame ,  Qizhi Liu ,  John J. Pekarik

IPC分类号： H01L21/337 ,  H01L29/10 ,  H01L27/06 ,  H01L29/66 ,  H01L29/737 ,  H01L29/808 ,  H01L29/165 ,  H01L29/08

CPC分类号： H01L29/8086 ,  G06F17/5045 ,  H01L27/0623 ,  H01L29/0817 ,  H01L29/0826 ,  H01L29/1004 ,  H01L29/1058 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165 ,  H01L29/66242 ,  H01L29/66893 ,  H01L29/66901 ,  H01L29/732 ,  H01L29/7375 ,  H01L29/808

摘要： Junction field-effect transistors, methods for fabricating junction field-effect transistors, and design structures for a junction field-effect transistor. A source and a drain of the junction field-effect transistor are comprised of a semiconductor material grown by selective epitaxy and in direct contact with a top surface of a semiconductor layer. A gate is formed that is aligned with a channel laterally disposed in the semiconductor layer between the source and the drain. The source, the drain, and the semiconductor layer are each comprised of a second semiconductor material having an opposite conductivity type from a first semiconductor material comprising the gate.

摘要翻译： 结型场效应晶体管，用于制造结型场效应晶体管的方法，以及结型场效应晶体管的设计结构。 结场效应晶体管的源极和漏极由通过选择性外延生长并与半导体层的顶表面直接接触的半导体材料组成。 形成与在源极和漏极之间横向设置在半导体层中的沟道对准的栅极。 源极，漏极和半导体层各自包括与包括栅极的第一半导体材料具有相反导电类型的第二半导体材料。

公开(公告)号：US20130214275A1

公开(公告)日：2013-08-22

申请号：US13401064

申请日：2012-02-21

申请人： James W. Adkisson ,  David L. Harame ,  Qizhi Liu

发明人： James W. Adkisson ,  David L. Harame ,  Qizhi Liu

IPC分类号： H01L29/737 ,  H01L21/331

CPC分类号： H01L29/732 ,  H01L29/1004 ,  H01L29/66234 ,  H01L29/66242 ,  H01L29/7371

摘要： Disclosed are a transistor (e.g., bipolar junction transistor (BJT) or a heterojunction bipolar transistor (HBT)) and a method of forming the transistor with a narrow in-substrate collector region for reduced base-collector junction capacitance. The transistor has, within a substrate, a collector region positioned laterally adjacent to a trench isolation region. A relatively thin seed layer covers the trench isolation region and collector region. This seed layer has a monocrystalline center, which is aligned above and wider than the collector region (e.g., due to a solid phase epitaxy regrowth process), and a polycrystalline outer section. An intrinsic base layer is epitaxially deposited on the seed layer such that it similarly has a monocrystalline center section that is aligned above and wider than the collector region. An extrinsic base layer is the intrinsic base layer and has a monocrystalline extrinsic base-to-intrinsic base link-up region that is offset vertically from the collector region.

摘要翻译： 公开了晶体管（例如，双极结型晶体管（BJT）或异质结双极晶体管（HBT））以及形成具有窄的衬底内集电极区域以减小基极 - 集电极结电容的晶体管的方法。 晶体管在衬底内具有位于横向邻近沟槽隔离区域的集电极区域。 相对薄的种子层覆盖沟槽隔离区域和收集器区域。 该晶种层具有单晶中心，该晶体中心在集电极区域上方（例如由于固相外延再生长工艺）而上方且更宽，并且多晶外部部分。 本征基底层外延沉积在种子层上，使得其类似地具有在集电极区域上方并且更宽的单晶中心部分。 非本征基层是本征基层，并且具有从集电极垂直偏移的单晶非本征基本至本征基极连接区域。

公开(公告)号：US08492237B2

公开(公告)日：2013-07-23

申请号：US13042902

申请日：2011-03-08

申请人： Kevin K. Chan ,  Erik M. Dahlstrom ,  Peter B. Gray ,  David L. Harame ,  Qizhi Liu

发明人： Kevin K. Chan ,  Erik M. Dahlstrom ,  Peter B. Gray ,  David L. Harame ,  Qizhi Liu

IPC分类号： H01L21/8222

CPC分类号： H01L29/73 ,  H01L21/28518 ,  H01L29/0821 ,  H01L29/66272 ,  H01L29/732 ,  H01L29/7378

摘要： Methods for fabricating bipolar junction transistors with self-aligned emitter and extrinsic base, bipolar junction transistors made by the methods, and design structures for a BiCMOS integrated circuit. The bipolar junction transistor is fabricated using a sacrificial emitter pedestal that provides a sacrificial mandrel promoting self-alignment between the emitter and the extrinsic base. The sacrificial emitter pedestal is subsequently removed to open an emitter window extending to the intrinsic base. An emitter is formed in the emitter window that lands on the intrinsic base.

摘要翻译： 用于制造具有自对准发射极和非本征基极的双极结型晶体管的方法，通过该方法制造的双极结型晶体管以及用于BiCMOS集成电路的设计结构。 使用牺牲发射器基座制造双极结型晶体管，该牺牲发射器基座提供牺牲的心轴，以促进发射极和外部基极之间的自对准。 随后去除牺牲发射器基座以打开延伸到本征基底的发射器窗口。 在发射器窗口中形成发射极，其位于本征基极上。

公开(公告)号：US20130126944A1

公开(公告)日：2013-05-23

申请号：US13303248

申请日：2011-11-23

申请人： Thomas N. Adam ,  David L. Harame ,  Qizhi Liu ,  Alexander Reznicek

发明人： Thomas N. Adam ,  David L. Harame ,  Qizhi Liu ,  Alexander Reznicek

IPC分类号： H01L29/70 ,  H01L21/331

CPC分类号： H01L21/0262 ,  H01L21/02381 ,  H01L21/02439 ,  H01L21/02447 ,  H01L21/0245 ,  H01L21/02521 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02576 ,  H01L21/02579 ,  H01L29/0817 ,  H01L29/1004 ,  H01L29/41708 ,  H01L29/66242 ,  H01L29/7371

摘要： A heterojunction bipolar transistor (HBT) may include an n-type doped crystalline collector formed in an upper portion of a crystalline silicon substrate layer; a p-type doped crystalline p+Si1-xGex layer, formed above the n-type doped collector, that forms a p-type doped internal base of the HBT; a crystalline silicon cap formed on the p-type doped crystalline p+Si1-xGex layer, in which the crystalline silicon cap includes an n-type impurity and forms an n-type doped emitter of the HBT; and an n-type doped crystalline silicon emitter stack formed within an opening through an insulating layer to an upper surface of the crystalline silicon cap.

摘要翻译： 异质结双极晶体管（HBT）可以包括在晶体硅衬底层的上部形成的n型掺杂晶体集电极; 形成在n型掺杂集电极上方的p型掺杂晶体p + Si1-xGex层，其形成HBT的p型掺杂内部基极; 形成在p型掺杂结晶p + Si1-xGex层上的晶体硅帽，其中晶体硅帽包括n型杂质并形成HBT的n型掺杂发射极; 以及形成在通过绝缘层的开口内的晶体硅帽的上表面的n型掺杂晶体硅发射极堆叠。

公开(公告)号：US20110309471A1

公开(公告)日：2011-12-22

申请号：US12817249

申请日：2010-06-17

申请人： Renata Camillo-Castillo ,  Mattias E. Dahlstrom ,  Peter B. Gray ,  David L. Harame ,  Russell T. Herrin ,  Alvin J. Joseph ,  Andreas D. Stricker

发明人： Renata Camillo-Castillo ,  Mattias E. Dahlstrom ,  Peter B. Gray ,  David L. Harame ,  Russell T. Herrin ,  Alvin J. Joseph ,  Andreas D. Stricker

IPC分类号： H01L29/73 ,  H01L21/331

CPC分类号： H01L29/732 ,  H01L29/66242 ,  H01L29/66287 ,  H01L29/7378

摘要： Disclosed are embodiments of an improved transistor structure (e.g., a bipolar transistor (BT) structure or heterojunction bipolar transistor (HBT) structure) and a method of forming the transistor structure. The structure embodiments can incorporate a dielectric layer sandwiched between an intrinsic base layer and a raised extrinsic base layer to reduce collector-base capacitance Ccb, a sidewall-defined conductive strap for an intrinsic base layer to extrinsic base layer link-up region to reduce base resistance Rb and a dielectric spacer between the extrinsic base layer and an emitter layer to reduce base-emitter Cbe capacitance. The method embodiments allow for self-aligning of the emitter to base regions and further allow the geometries of different features (e.g., the thickness of the dielectric layer, the width of the conductive strap, the width of the dielectric spacer and the width of the emitter layer) to be selectively adjusted in order to optimize transistor performance.

摘要翻译： 公开了改进的晶体管结构（例如，双极晶体管（BT）结构或异质结双极晶体管（HBT）结构）的实施例以及形成晶体管结构的方法。 结构实施例可以包括夹在本征基极层和凸起的非本征基极层之间的电介质层，以将集电极 - 基极电容Ccb，用于本征基极层的侧壁限定导电带限制到外部基极层连接区域以减少基极 电阻Rb和外部基极层和发射极层之间的介电间隔物，以减少基极 - 发射极的Cbe电容。 该方法实施例允许发射极与基极区域的自对准，并进一步允许不同特征的几何形状（例如，电介质层的厚度，导电带的宽度，电介质间隔物的宽度和介电隔离物的宽度 发射极层）进行选择性调整，以优化晶体管性能。