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公开(公告)号：US20170339798A1
公开(公告)日：2017-11-23
申请号：US15486591
申请日：2017-04-13
Applicant: DELTA ELECTRONICS, INC.
Inventor： Tao Wang , Kai Lu , Zhenqing Zhao , Shouyu Hong , Wei Cheng
CPC classification number: H05K7/1432 , H01L23/04 , H01L25/072 , H01L2224/48091 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/73265 , H01L2924/181 , H05K1/181 , H05K5/03 , H05K7/1401 , H01L2924/00012 , H01L2924/00014
Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.
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公开(公告)号：US09589863B2
公开(公告)日：2017-03-07
申请号：US15094038
申请日：2016-04-08
Applicant: DELTA ELECTRONICS, INC.
Inventor： Shouyu Hong , Yanlin Chen , Zhenqing Zhao
IPC: H01L23/36 , H01L23/373
CPC classification number: H01L23/3733 , H01L23/3737 , H01L2224/0603 , H01L2224/4846
Abstract: A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.
Abstract translation: 本文提供了功率模块和热接口结构。 热界面结构包括：基底和分散在基底中的多个填料颗粒。 当填料颗粒处于压力下时，填料颗粒的至少一部分变形，并且至少两个相邻的填料颗粒彼此部分接触以形成用于传递热量的导热路径。
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公开(公告)号：US11277067B2
公开(公告)日：2022-03-15
申请号：US16130850
申请日：2018-09-13
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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公开(公告)号：US11245214B2
公开(公告)日：2022-02-08
申请号：US16934076
申请日：2020-07-21
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Ganyu Zhou , Pengkai Ji , Yiqing Ye , Zhenqing Zhao
IPC: H01R13/22 , H01R12/71 , H01R43/16 , H01R13/405
Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.
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公开(公告)号：US11183323B2
公开(公告)日：2021-11-23
申请号：US16104961
申请日：2018-08-20
Applicant: Delta Electronics,Inc.
Inventor： Haibin Xu , Tao Wang , Shouyu Hong , Zhenqing Zhao , Yicong Xie , Zengsheng Wang
Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.
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Patent Agency Ranking
公开(公告)号：US10685895B2
公开(公告)日：2020-06-16
申请号：US16261012
申请日：2019-01-29
Applicant: DELTA ELECTRONICS, INC.
Inventor： Pengkai Ji , Shouyu Hong , Zhenqing Zhao , Jianhong Zeng
IPC: H05K1/02 , H05K5/00 , H05K9/00 , H01L23/34 , H01L23/36 , H01L23/58 , H01L23/66 , H01L23/367 , H01L29/82 , H01L51/52 , H01L23/31 , H01L21/56 , H01L23/433 , H01L23/498 , H01L23/492 , H05K1/11 , H05K1/18 , H05K3/30 , H05K3/40
Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.
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公开(公告)号：US10340617B2
公开(公告)日：2019-07-02
申请号：US15168262
申请日：2016-05-31
Applicant: Delta Electronics, Inc.
Inventor： Le Liang , Shouyu Hong , Zhenqing Zhao
Abstract: A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.
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公开(公告)号：US20190157175A1
公开(公告)日：2019-05-23
申请号：US16261012
申请日：2019-01-29
Applicant: DELTA ELECTRONICS, INC.
Inventor： Pengkai Ji , Shouyu Hong , Zhenqing Zhao , Jianhong Zeng
IPC: H01L23/31 , H01L23/498 , H01L23/433 , H01L23/492 , H05K3/40 , H01L21/56 , H05K1/18 , H05K1/11 , H05K1/02 , H05K3/30
Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.
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公开(公告)号：US20180122562A1
公开(公告)日：2018-05-03
申请号：US15784864
申请日：2017-10-16
Applicant: DELTA ELECTRONICS, INC.
Inventor： Pengkai Ji , Jinping Zhou , Shouyu Hong , Tao Wang , Jianhong Zeng , Zhangnan Xin
CPC classification number: H01F27/29 , H01F27/24 , H01F27/2847 , H01F27/306 , H01L27/02 , H05K1/111 , H05K1/115 , H05K1/181 , H05K1/185 , H05K2201/1003
Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.
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公开(公告)号：US09892998B2
公开(公告)日：2018-02-13
申请号：US14918837
申请日：2015-10-21
Applicant: DELTA ELECTRONICS, INC.
Inventor： Kai Lu , Zhenqing Zhao , Shouyu Hong , Tao Wang , Le Liang
IPC: H01L23/495 , H01L21/56 , H01L23/00 , H01L23/31
CPC classification number: H01L23/49568 , H01L21/561 , H01L23/3107 , H01L23/3121 , H01L23/4952 , H01L23/49524 , H01L23/49541 , H01L23/49555 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2224/131 , H01L2224/16225 , H01L2224/29101 , H01L2224/2929 , H01L2224/32225 , H01L2224/32245 , H01L2224/40225 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/81192 , H01L2224/8382 , H01L2224/97 , H01L2924/00014 , H01L2924/00015 , H01L2924/0781 , H01L2224/83 , H01L2224/85 , H01L2224/45099 , H01L2224/37099 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/0665
Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.
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