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公开(公告)号：US10816739B2
公开(公告)日：2020-10-27
申请号：US16600194
申请日：2019-10-11
Applicant: Finisar Corporation
Inventor： Frank Lei Ding , Maziar Amirkiai , Jianwei Mu , Hongyu Deng , Tao Wu
IPC: G02B6/42
Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.
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公开(公告)号：US20200116961A1
公开(公告)日：2020-04-16
申请号：US16600194
申请日：2019-10-11
Applicant: Finisar Corporation
Inventor： Frank Lei Ding , Maziar Amirkiai , Jianwei Mu , Hongyu Deng , Tao Wu
IPC: G02B6/42
Abstract: A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.
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公开(公告)号：US09772467B2
公开(公告)日：2017-09-26
申请号：US14487310
申请日：2014-09-16
Applicant: FINISAR CORPORATION
Inventor： Maziar Amirkiai , Hongyu Deng
CPC classification number: G02B7/02 , B23K11/08 , B23K26/24 , B23K31/02 , G02B6/4201
Abstract: A method may include selecting a transistor-outline can (TO-can) assembly cap. The method may further include welding the TO-can assembly cap to a rim that surrounds an optical opening of an optical subassembly box (OSA) such that the TO-can assembly cap hermetically seals the optical opening and allows optical signals to pass through the TO-can assembly cap and the optical opening.
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公开(公告)号：US20160277140A1
公开(公告)日：2016-09-22
申请号：US15046436
申请日：2016-02-17
Applicant: Finisar Corporation
Inventor： Tao Wu , Hongyu Deng , Maziar Amirkiai , Shanshan Zeng , Tengda Du , Yunpeng Song
CPC classification number: H04J14/06 , H01S5/0064 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/4012 , H01S5/4087 , H04B10/506 , H04J14/0221
Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.
Abstract translation: 光发射机可以包括被配置为发射多个光束的发射激光器组件。 光发射机可以另外包括隔离器，其被配置为旋转多个光束中的每一个的对应的偏振状态。 光发射机可以另外包括功率复用组合器，其被配置为从隔离器接收多个光束并将多个光束组合成组合光束。 光发射机可以另外包括配置成将组合的光束聚焦到光纤上用于透射的透镜。
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公开(公告)号：US20160124167A1
公开(公告)日：2016-05-05
申请号：US14932151
申请日：2015-11-04
Applicant: FINISAR CORPORATION
Inventor： Maziar Amirkiai , Yu Huang , Tao Li , Hongyu Deng
CPC classification number: G02B6/4271 , F25B21/02 , G02B6/4279 , H01S5/02415
Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to thermoelectric coolers (TECs) and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a TEC having a TEC top, a top layer of an optoelectronic subassembly substrate, and a plurality of pillars extending between the TEC top and the top layer, such that the TEC is devoid of a TEC base between the pillars and optoelectronic subassembly substrate.
Abstract translation: 本公开通常涉及使用光信号通过网络传输数据的高速光纤网络。 所公开的主题包括与热电冷却器（TEC）和/或光电子组件有关的装置和方法。 在一些方面，所公开的设备和方法可以涉及具有TEC顶部，光电子组件衬底的顶层和在TEC顶部和顶层之间延伸的多个柱的TEC，使得TEC没有 支柱和光电子组件基板之间的TEC基座。
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Patent Agency Ranking
公开(公告)号：US20160050751A1
公开(公告)日：2016-02-18
申请号：US14923034
申请日：2015-10-26
Applicant: FINISAR CORPORATION
Inventor： Maziar Amirkiai , Yunpeng Song , Hongyu Deng
CPC classification number: H05K3/4682 , H05K1/0242 , H05K1/113 , H05K3/303 , H05K3/4667 , H05K3/467 , H05K3/4688 , H05K2201/0391 , H05K2201/094 , H05K2201/09727 , H05K2201/09736 , H05K2201/10121
Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.
Abstract translation: 本公开通常涉及使用光信号通过网络传输数据的高速光纤网络。 所公开的主题包括与头部组件和/或光电子部件有关的装置和方法。 在一些方面，所公开的设备和方法可以涉及头部子组件，其可以包括：具有底层的多层衬底，具有顶部薄膜信号线的顶层，以及具有位于第一层之间的厚膜迹线的一个或多个中间层 顶层和底层，厚膜迹线电耦合到顶部薄膜信号线; 以及位于多层衬底上并与信号线电耦合的光电子部件。
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公开(公告)号：US20160047997A1
公开(公告)日：2016-02-18
申请号：US14881693
申请日：2015-10-13
Applicant: FINISAR CORPORATION
Inventor： Maziar Amirkiai , Tao Wu , Mark Donovan , Hongyu Deng
CPC classification number: G02B6/4251 , G02B6/4204 , G02B6/4208 , G02B6/4248 , G02B6/4249 , G02B6/4292
Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.
Abstract translation: 本公开通常涉及使用光信号通过网络传输数据的高速光纤网络。 所公开的主题包括与多透镜光学部件和/或光电子部件有关的装置和方法。 在一些方面，装置和方法涉及包括限定空腔的壳体和在壳体的光学透射部分上具有多个透镜的透镜阵列的光学部件。 在一些方面，装置和方法涉及包括基板的光学部件; 以及在所述基板上的透镜阵列，所述透镜阵列具有多个离散透镜。
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公开(公告)号：US11418003B2
公开(公告)日：2022-08-16
申请号：US16533714
申请日：2019-08-06
Applicant: FINISAR CORPORATION
Inventor： Jianwei Mu , Frank Lei Ding , Tao Wu , Hongyu Deng , Maziar Amirkiai
IPC: H01S5/02325 , H01L23/498 , H01S5/024 , H01L23/34 , H01L21/48 , H01S5/0233 , H01S5/0235
Abstract: A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.
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公开(公告)号：US09912437B2
公开(公告)日：2018-03-06
申请号：US15046436
申请日：2016-02-17
Applicant: Finisar Corporation
Inventor： Tao Wu , Hongyu Deng , Maziar Amirkiai , Shanshan Zeng , Tengda Du , Yunpeng Song
CPC classification number: H04J14/06 , H01S5/0064 , H01S5/02284 , H01S5/02288 , H01S5/02292 , H01S5/4012 , H01S5/4087 , H04B10/506 , H04J14/0221
Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.
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公开(公告)号：US09874704B2
公开(公告)日：2018-01-23
申请号：US14824883
申请日：2015-08-12
Applicant: FINISAR CORPORATION
Inventor： Maziar Amirkiai , Hongyu Deng , Tao Wu
CPC classification number: G02B6/4212 , G02B6/325 , G02B6/3636 , G02B6/3858 , G02B6/3861 , G02B6/3874 , G02B6/4204 , G02B6/423 , G02B6/4231 , G02B6/4246 , G02B6/4249 , G02B6/4251
Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to ferrule assemblies and/or ferrule alignment assemblies. In some aspects, the disclosed devices and methods may relate to a ferrule assembly including: optical fibers, an upper clamp member and a lower clamp member configured to retain the optical fibers that are positioned between the upper and lower clamp members, and a ferrule body surrounding at least a portion of the upper and lower clamp members; and an alignment sleeve including a sleeve cavity configured to receive the ferrule body such that the ferrule assembly is capable of being longitudinally repositioned with respect to the alignment sleeve.
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