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    Semiconductor chip assemblies and components with pressure contact
    11.
    发明授权
    Semiconductor chip assemblies and components with pressure contact 失效
    半导体芯片组件和压力接触部件

    公开(公告)号：US5414298A

    公开(公告)日：1995-05-09

    申请号：US38178

    申请日：1993-03-26

    申请人： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

    发明人： Gary Grube ,  Igor Khandros ,  Gaetan Mathieu

    IPC分类号： H01L23/48 ,  H01L39/02

    CPC分类号： H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/4913

    摘要： A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

    摘要翻译： 半导体芯片组件包括芯片，通过柔性引线永久地电连接到芯片的芯片和用于将端子偏压离开芯片的弹性元件或元件。 芯片与具有接触焊盘的基板永久地接合，使得端子设置在芯片和基板之间，并且端子在由弹性元件施加的力的影响下接合接触焊盘。 端子通常设置在柔性片状电介质插入件上，并且弹性元件设置在插入件和芯片之间。 可以在与基板接合之前测试芯片和端子的组件。 由于该组件与衬底的接合不涉及焊接或其它复杂的结合工艺，所以是可靠的。 组件可以非常紧凑，并且可以占据仅比芯片本身的面积稍大的区域。

    CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME
    12.
    发明申请
    CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME 审中-公开
    微电子互连元件的接点提示结构及其制作方法

    公开(公告)号：US20080116927A1

    公开(公告)日：2008-05-22

    申请号：US12020380

    申请日：2008-01-25

    申请人： Thomas Dozier ,  Benjamin Eldridge ,  Igor Khandros ,  Gaetan Mathieu ,  Sheldon Taylor

    发明人： Thomas Dozier ,  Benjamin Eldridge ,  Igor Khandros ,  Gaetan Mathieu ,  Sheldon Taylor

    IPC分类号： G01R1/067 ,  G01R31/02

    CPC分类号： G01R1/06727 ,  G01R1/07342 ,  H01L2924/01074 ,  H01L2924/01078

    摘要： Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively ‘perfect’ contact tip structures (“tips”) and joining them to relatively ‘imperfect’ interconnection elements to improve the overall capabilities of resulting “tipped” interconnection elements.

    摘要翻译： 接触尖端结构被制造在牺牲衬底上，用于随后连接到包括复合互连元件，单片互连元件，探针卡的钨针，膜探针的接触凸块等的互连元件。 尖端结构之间的空间关系可以光刻地定义为非常接近的公差。 尖端结构的冶金独立于它们所连接的互连元件的冶金，通过钎焊，电镀等。 接触尖端结构容易地具有拓扑（小的，精确的，突出的，非平面的）接触特征，例如呈截锥形的形式，以优化随后对电子部件的端子进行的电压连接。 描述了适于用作弹簧接触元件而不需要接合到弹性接触元件的细长接触尖端结构。 通常，本发明旨在制造（预制）相对“完美”的接触尖端结构（“尖端”）并将它们连接到相对“不完美”的互连元件，以改善所产生的“尖端”互连元件的整体能力。

    METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR
    15.
    发明申请
    METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR 失效
    用于平面化半导体接触器的方法

    公开(公告)号：US20080048688A1

    公开(公告)日：2008-02-28

    申请号：US11846012

    申请日：2007-08-28

    申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    IPC分类号： G01R31/26

    CPC分类号： G01R1/07307 ,  G01R3/00

    摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

    摘要翻译： 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS
    16.
    发明申请
    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 有权
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US20070139060A1

    公开(公告)日：2007-06-21

    申请号：US11548183

    申请日：2006-10-10

    申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Probe Array and Method of Its Manufacture
    17.
    发明申请
    Probe Array and Method of Its Manufacture 有权
    探针阵列及其制造方法

    公开(公告)号：US20070062913A1

    公开(公告)日：2007-03-22

    申请号：US11550340

    申请日：2006-10-17

    申请人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    发明人： Gaetan Mathieu ,  Benjamin Eldridge ,  Gary Grube

    IPC分类号： B23H9/00 ,  B23H5/00

    CPC分类号： B23H9/00 ,  G01R1/07314

    摘要： A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

    摘要翻译： 形成探针阵列的方法包括在探针材料块上形成尖端材料层。 第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。 去除从尖端材料层和探针材料块的多余材料以形成多个探针。 具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。 衬底被结合到多个探针。 去除过量的探针材料以使基底平坦化。

    Method and System for Compensating Thermally Induced Motion of Probe Cards
    19.
    发明申请
    Method and System for Compensating Thermally Induced Motion of Probe Cards 有权
    用于补偿探针卡热敏感运动的方法和系统

    公开(公告)号：US20080094088A1

    公开(公告)日：2008-04-24

    申请号：US11963575

    申请日：2007-12-21

    申请人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly
    20.
    发明申请
    Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号：US20060255814A1

    公开(公告)日：2006-11-16

    申请号：US11306515

    申请日：2005-12-30

    申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

    摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在布线基板附接到加强板的其他位置处设置空间，使得布线基板相对于加强板可以膨胀和收缩。