公开(公告)号：US06490146B2

公开(公告)日：2002-12-03

申请号：US09929806

申请日：2001-08-13

申请人： You Wang ,  Shamouil Shamouilian ,  Arnold Kholodenko ,  Alexander M. Veytser ,  Surinder S. Bedi ,  Kadthala R. Narendrnath ,  Semyon L. Kats ,  Dennis S. Grimard ,  Wing L. Cheng ,  Ananda H. Kumar

发明人： You Wang ,  Shamouil Shamouilian ,  Arnold Kholodenko ,  Alexander M. Veytser ,  Surinder S. Bedi ,  Kadthala R. Narendrnath ,  Semyon L. Kats ,  Dennis S. Grimard ,  Wing L. Cheng ,  Ananda H. Kumar

IPC分类号： H01G2300

CPC分类号： C04B37/026 ,  C04B37/006 ,  C04B37/021 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/61 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/74 ,  H01L21/6831 ,  H01L21/6833

摘要： An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.

公开(公告)号：US09466758B2

公开(公告)日：2016-10-11

申请号：US14957588

申请日：2015-12-02

申请人： Ananda H. Kumar ,  Tue Nguyen

发明人： Ananda H. Kumar ,  Tue Nguyen

IPC分类号： H01L33/00 ,  H01L31/18 ,  H01L21/762 ,  H01L31/0224

CPC分类号： H01L33/007 ,  H01L21/76254 ,  H01L31/022425 ,  H01L31/1804

摘要： Composite substrates include a single crystal silicon layer disposed on a ceramic layer, including a transparent glass layer. Combination of single crystal devices and non-single crystal devices can be fabricated on a ceramic substrate.

公开(公告)号：US08808800B2

公开(公告)日：2014-08-19

申请号：US13409950

申请日：2012-03-01

申请人： Ananda H. Kumar ,  Jorge Sotelo Albarran ,  Adam L. Cohen ,  Kieun Kim ,  Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

发明人： Ananda H. Kumar ,  Jorge Sotelo Albarran ,  Adam L. Cohen ,  Kieun Kim ,  Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

IPC分类号： B05D3/00

CPC分类号： B81C1/00666 ,  C25D5/022

摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

摘要翻译： 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

公开(公告)号：US20110155580A1

公开(公告)日：2011-06-30

申请号：US13021939

申请日：2011-02-07

申请人： Gang Zhang ,  Adam L. Cohen ,  Michael S. Lockard ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Kieun Kim

发明人： Gang Zhang ,  Adam L. Cohen ,  Michael S. Lockard ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Kieun Kim

IPC分类号： C25D5/02 ,  C25D5/50

CPC分类号： C25D5/50 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

摘要： Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

摘要翻译： 多层微尺度或中尺度结构用粘附层（例如在连续层沉积到先前层上时结合在一起的层）制造，然后进行显着增强层间粘合的热处理操作。 认为热处理操作导致材料在层边界上的扩散，并且附着力增强（即扩散粘合）。 可以通过在有助于从表面甚至从内部部分去除较弱的氧化物的还原气氛的热处理来增强层间粘附和可能的层内内聚力。

公开(公告)号：US20100119917A1

公开(公告)日：2010-05-13

申请号：US12292078

申请日：2008-11-12

申请人： Ananda H. Kumar ,  Dien Nguyen ,  Martin Janousek ,  Tad Armstrong

发明人： Ananda H. Kumar ,  Dien Nguyen ,  Martin Janousek ,  Tad Armstrong

IPC分类号： C03C8/00 ,  B28B1/00 ,  H01M2/08

CPC分类号： H01M8/0286 ,  C03C8/02 ,  C03C8/24 ,  H01M8/0282 ,  H01M8/1246 ,  H01M2008/1293 ,  Y02E60/50

摘要： A seal composition includes a first alkaline earth metal oxide, a second alkaline earth metal oxide which is different from the first alkaline earth metal oxide, aluminum oxide, and silica in an amount such that molar percent of silica in the composition is at least five molar percent greater than two times a combined molar percent of the first alkaline earth metal oxide and the second alkaline earth metal oxide. The composition is substantially free of boron oxide and phosphorus oxide. The seal composition forms a glass ceramic seal which includes silica containing glass cores located in a crystalline matrix comprising barium aluminosilicate, and calcium aluminosilicate crystals located in the glass cores.

摘要翻译： 密封组合物包括第一碱土金属氧化物，与第一碱土金属氧化物不同的第二碱土金属氧化物，氧化铝和二氧化硅，其量使得组合物中二氧化硅的摩尔百分比为至少五摩尔 百分比大于第一碱土金属氧化物和第二碱土金属氧化物的组合摩尔百分数的两倍。 该组合物基本上不含氧化硼和氧化磷。 密封组合物形成玻璃陶瓷密封件，其包括位于包括硅铝酸钡的晶体基质中的含二氧化硅的玻璃核心和位于玻璃核心中的硅铝酸钙晶体。

公开(公告)号：US07670688B2

公开(公告)日：2010-03-02

申请号：US09892212

申请日：2001-06-25

申请人： Tony S. Kaushal ,  You Wang ,  Ananda H. Kumar

发明人： Tony S. Kaushal ,  You Wang ,  Ananda H. Kumar

IPC分类号： B32B15/04 ,  B32B9/00 ,  C23C16/00

CPC分类号： H01J37/32467 ,  H01J37/32477 ,  Y10T428/12576 ,  Y10T428/1259 ,  Y10T428/12736

摘要： An erosion-resistant article for use as a component in plasma process chamber. The erosion-resistant article comprises a support and an oxide coating comprising yttrium, which is disposed over the support. The support and the oxide coating preferably have material compositions that differ from one another in coefficient of thermal expansion by no more than 5×10−6/K. Preferred oxide coating compositions include yttria and yttrium aluminum garnet. Preferred supports include alumina supports and aluminum-silicon carbide supports.

摘要翻译： 用作等离子体处理室中的组分的耐腐蚀制品。 防侵蚀制品包括载体和包含钇的氧化物涂层，其被设置在载体上。 载体和氧化物涂层优选具有不同于热膨胀系数不超过5×10-6 / K的材料组成。 优选的氧化物涂层组合物包括氧化钇和钇铝石榴石。 优选的载体包括氧化铝载体和铝 - 碳化硅载体。

公开(公告)号：US07273812B2

公开(公告)日：2007-09-25

申请号：US11178145

申请日：2005-07-07

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang

IPC分类号： H01L21/44

CPC分类号： C25D1/003 ,  G01R3/00 ,  Y10T29/49222

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US07241689B2

公开(公告)日：2007-07-10

申请号：US11029169

申请日：2005-01-03

申请人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

发明人： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard T. Chen ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard

IPC分类号： H01L21/44

CPC分类号： H01R13/187 ,  H01L24/72 ,  H01L2924/15747 ,  H01L2924/00

摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

摘要翻译： 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US06273958B1

公开(公告)日：2001-08-14

申请号：US09329020

申请日：1999-06-09

申请人： Shamouil Shamouilian ,  Ananda H. Kumar ,  Siamak Salimian ,  Mahmoud Dahimene ,  Michael G. Chafin ,  Dennis S. Grimard

发明人： Shamouil Shamouilian ,  Ananda H. Kumar ,  Siamak Salimian ,  Mahmoud Dahimene ,  Michael G. Chafin ,  Dennis S. Grimard

IPC分类号： C23C1600

摘要： A support 55 comprises a dielectric 60 covering a primary electrode 70, the dielectric 60 having a surface 75 adapted to receive a substrate 25 and a conduit 160 that extends through the dielectric 60. The thickness of a portion of the dielectric 60 between an edge 195 of the primary electrode 70 and a surface 180 of the conduit 160 is sufficiently large to reduce the incidence of plasma formation in the conduit 160 when the primary electrode 70 is charged by an RF voltage to form a plasma of gas in the chamber 30 during processing of the substrate 25.

公开(公告)号：US5880924A

公开(公告)日：1999-03-09

申请号：US980591

申请日：1997-12-01

申请人： Ananda H. Kumar ,  Shamouil Shamouilian

发明人： Ananda H. Kumar ,  Shamouil Shamouilian

IPC分类号： B25J15/06 ,  B23Q3/15 ,  H01L21/683 ,  H02N13/00

CPC分类号： H01L21/6831 ,  H02N13/00 ,  Y10T279/23

摘要： An electrostatic chuck 20 for holding a substrate 12 comprises a dielectric 70 having a receiving surface 75 for receiving the substrate thereon. The dielectric 70 comprises a charging electrode 80 for generating electrostatic charge for electrostatically holding the substrate 12 to the receiving surface 75, and a discharge electrode 85 electrically isolated from the charging electrode for removing electrostatic charge accumulated in the chuck 20.

摘要翻译： 用于保持基板12的静电卡盘20包括具有用于在其上接收基板的接收表面75的电介质70。 电介质70包括用于产生用于将基板12静电保持到接收表面75的静电电荷的充电电极80以及与充电电极电隔离以去除积聚在卡盘20中的静电电荷的放电电极85。