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    MICROJET MODULE ASSEMBLY
    11.
    发明申请
    MICROJET MODULE ASSEMBLY 有权
    微型模块总成

    公开(公告)号：US20090095444A1

    公开(公告)日：2009-04-16

    申请号：US12338092

    申请日：2008-12-18

    申请人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Kamal K. Sikka ,  Hilton T. Toy

    发明人： Raschid J. Bezama ,  Govindarajan Natarajan ,  Kamal K. Sikka ,  Hilton T. Toy

    IPC分类号： F28F7/00

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

    摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

    摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体，并在垂直于目标表面的方向上去除废热流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。

    MICROFLUID MIXER, METHODS OF USE AND METHODS OF MANUFACTURE THEREOF
    12.
    发明申请
    MICROFLUID MIXER, METHODS OF USE AND METHODS OF MANUFACTURE THEREOF 失效
    微流控混合器，其使用方法及其制造方法

    公开(公告)号：US20090040864A1

    公开(公告)日：2009-02-12

    申请号：US11834973

    申请日：2007-08-07

    申请人： Govindarajan Natarajan

    发明人： Govindarajan Natarajan

    IPC分类号： B01F15/06 ,  C04B33/32

    CPC分类号： C04B41/91 ,  B01F11/0045 ,  B01F13/0059 ,  B01F15/065 ,  B01F2015/062 ,  C04B37/001 ,  C04B37/042 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/704

    摘要： Disclosed herein is a mixer comprising a base plate; a top plate in intimate contact with a surface of the base plate; the intimate contact preventing a fluid loss from the bottom plate; the top plate comprising a plurality of first ports for the entry of a first fluid and a second fluid; a mixing chamber in fluid communication with the plurality of first ports; a first heating element; and an exit channel for removing an intimate mixture of the first fluid and the second fluid; and a reciprocatory device in physical contact with the mixing chamber; the reciprocatory device being operative to agitate the first fluid and the second fluid.

    摘要翻译： 本文公开了一种包括基板的混合器; 顶板与基板的表面紧密接触; 紧密接触防止底板流体流失; 所述顶板包括用于进入第一流体和第二流体的多个第一端口; 与所述多个第一端口流体连通的混合室; 第一加热元件; 以及用于去除第一流体和第二流体的紧密混合物的出口通道; 以及与所述混合室物理接触的往复装置; 往复运动装置可操作以搅拌第一流体和第二流体。

    Electronic package with improved current carrying capability and method of forming the same
    14.
    发明授权
    Electronic package with improved current carrying capability and method of forming the same 有权
    具有改善载流能力的电子封装及其形成方法

    公开(公告)号：US07332805B2

    公开(公告)日：2008-02-19

    申请号：US10752176

    申请日：2004-01-06

    申请人： Govindarajan Natarajan ,  Raschid J Bezama

    发明人： Govindarajan Natarajan ,  Raschid J Bezama

    IPC分类号： H01L23/053 ,  H01L23/12

    CPC分类号： H05K1/0265 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/09881 ,  H01L2924/00

    摘要： An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.

    摘要翻译： 一种用于形成这种封装的电子封装和方法，其在放宽特征容差的同时，扩展线的电流能力和/或降低具有给定特征尺寸的封装的线路电阻。 所述方法和结构包括具有较大导线截面面积的区域的电线，该区域在封装必须向电子器件提供较高电流分布的位置和/或信号线需要较低电阻的位置。 这些较大的导线横截面积是垂直延伸的导体，其应用于导体的整个导体或部分。

    TEST APPARATUS AND METHOD
    16.
    发明申请
    TEST APPARATUS AND METHOD 审中-公开
    测试装置和方法

    公开(公告)号：US20050287044A1

    公开(公告)日：2005-12-29

    申请号：US10710183

    申请日：2004-06-24

    申请人： Govindarajan Natarajan

    发明人： Govindarajan Natarajan

    IPC分类号： B01L3/00

    CPC分类号： B01L3/50273 ,  B01L3/5025 ,  B01L3/502707 ,  B01L2400/0406 ,  B01L2400/0688

    摘要： An apparatus and method is described for testing interactions between multiple reagents or components by means of a flow distribution body configured to have a three-dimensional network of conduits including feed holes for dispensing fluid, connected to a capillary channel bounded on at least one surface by a receiving surface, which in turn is connected to capillary flow promotion chimneys. The receiving surface may be a surface of a detachable receiving plate. Each feed hole is configured to terminate at a capillary flow control means at the intersection of the capillary channel to the feed hole. A uniform layer of reagent is formed or deposited on the receiving surface along the capillary channel. The feed hole, capillary channel and capillary flow promotion chimneys are configured so that when fluid is dispensed into the feed hole, capillary forces promote continuous flow of fluid along the capillary channel from the feed hole to the flow promotion chimneys until the trailing meniscus of the fluid in the feed hole stops at the capillary flow control means.

    摘要翻译： 描述了一种用于测试多个试剂或组分之间的相互作用的装置和方法，所述流动分布主体被配置成具有三维网络的导管，所述导管的三维网络包括用于分配流体的进料孔，其连接到通过限定在至少一个表面上的毛细管通道 接收表面又连接到毛细管流动促进烟囱。 接收表面可以是可拆卸接收板的表面。 每个进料孔构造成在毛细管通道与进料孔交叉处的毛细管流动控制装置处终止。 沿着毛细通道在接收表面上形成或沉积均匀的试剂层。 进料孔，毛细管通道和毛细管流动促进烟囱被构造成使得当流体被分配到进料孔中时，毛细管力促使流体沿着毛细管通道从进料孔到流动促进烟囱的连续流动，直到尾部弯液面 进料孔中的流体在毛细管流动控制装置处停止。

    Ceramic structure using a support sheet
    17.
    发明授权
    Ceramic structure using a support sheet 有权
    陶瓷结构使用支撑片

    公开(公告)号：US06726984B2

    公开(公告)日：2004-04-27

    申请号：US10403239

    申请日：2003-03-28

    申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

    发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

    IPC分类号： B32B300

    CPC分类号： H01L21/486 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09581 ,  H05K2203/0152 ,  H05K2203/0156 ,  Y10T29/49126 ,  Y10T156/1057 ,  Y10T428/24917 ,  Y10T428/24926

    摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

    摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在多层陶瓷封装的制造中筛选，堆叠和处理非常薄的生片和/或具有非常密集金属化图案的生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。

    Method and structure to reduce low force pin pull failures in ceramic substrates
    19.
    发明授权
    Method and structure to reduce low force pin pull failures in ceramic substrates 失效
    降低陶瓷衬底中低引脚拉拔故障的方法和结构

    公开(公告)号：US06284079B1

    公开(公告)日：2001-09-04

    申请号：US09261344

    申请日：1999-03-03

    申请人： Raschid J. Bezama ,  Govindarajan Natarajan

    发明人： Raschid J. Bezama ,  Govindarajan Natarajan

    IPC分类号： B32B3126

    CPC分类号： H05K3/381 ,  H01L21/481 ,  H01L21/4853 ,  H05K1/0306 ,  H05K3/4629 ,  Y10T156/1023 ,  Y10T428/24917 ,  Y10T428/24926

    摘要： The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.

    摘要翻译： 可以在处理期间控制生片的表面冶金，以在输入 - 输出焊盘结构下提供对金属 - 陶瓷界面的低强度结构故障的增加的阻力，并且增加氧化铝多层陶瓷上的输入 - 输出焊盘的引脚强度 底物。 为了增加生片与输入输出垫之间的接触面积，粗筛在要输出输出垫的区域中的生片上的表面积变粗糙。 金属 - 陶瓷界面之间的机械互锁通过生片和投入产出冶金之间的粘合点数量的增加以及使用不同的筛选材料得到加强。

    Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
    20.
    发明授权
    Method of forming defect-free ceramic structures using thermally depolymerizable surface layer 失效
    使用可热解聚表面层形成无缺陷陶瓷结构的方法

    公开(公告)号：US06261927B1

    公开(公告)日：2001-07-17

    申请号：US09302943

    申请日：1999-04-30

    申请人： Govindarajan Natarajan ,  Richard F. Indyk ,  Vincent P. Peterson ,  Krishna G. Sachdev

    发明人： Govindarajan Natarajan ,  Richard F. Indyk ,  Vincent P. Peterson ,  Krishna G. Sachdev

    IPC分类号： H01L2130

    CPC分类号： H01L21/481 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y10S438/976 ,  H01L2924/00

    摘要： This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.

    摘要翻译： 本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。 特别地，本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。 更具体地说，本发明包括一种制造半导体衬底的方法，其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。 本发明还包括用于制造表面保护的生片层压板的方法，其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。 在层压之后，由于在烧结过程中挥发物质的热解聚和燃烧，因此可方便且清洁地除去热可分解/可分解的膜，从而提供无表面缺陷的陶瓷基材。